JPS6259409A - Surface acoustic wave element - Google Patents
Surface acoustic wave elementInfo
- Publication number
- JPS6259409A JPS6259409A JP19889185A JP19889185A JPS6259409A JP S6259409 A JPS6259409 A JP S6259409A JP 19889185 A JP19889185 A JP 19889185A JP 19889185 A JP19889185 A JP 19889185A JP S6259409 A JPS6259409 A JP S6259409A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor plate
- gap
- input
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は表面弾性波素子の改良に関するものである。[Detailed description of the invention] [Industrial application field] This invention relates to improvements in surface acoustic wave devices.
第３図は１例えば特公昭５８−２９６５４号公報に示さ
れた。従来の表面弾性波素子の構成を示す斜視図である
。FIG. 3 is shown in, for example, Japanese Patent Publication No. 58-29654. FIG. 2 is a perspective view showing the configuration of a conventional surface acoustic wave element.
この図において（！）は表面弾性波の伝搬媒体となる圧
電体基板、 （２Ａ）及び（２Ｂ）は上記基板の表面に
間隔を介して設けられた。すだれ状の入力電極及び出力
電極、（３）は各電極のリード部、（４）は上記両電極
間に設けられたシールド用の電極で、アースされている
ものである。In this figure, (!) is a piezoelectric substrate serving as a propagation medium for surface acoustic waves, and (2A) and (2B) are provided at intervals on the surface of the substrate. The input and output electrodes are interdigitated; (3) is a lead portion of each electrode; and (4) is a shielding electrode provided between the two electrodes, which is grounded.
このように構成された表面弾性波素子の本来の信号の伝
達は、基板（１）の表面上を伝搬する表面弾性波を媒体
とするが、実際には、この他に入出力電極（２Ａ）（２
Ｂ）の間に電磁界を媒体とする結合があり、これによっ
て希望しない信号が伝達される。The original signal transmission of the surface acoustic wave device configured in this way uses surface acoustic waves propagating on the surface of the substrate (1) as a medium, but in reality, in addition to this, input/output electrodes (2A) are used. (2
There is a coupling between B) through an electromagnetic field, which transmits an undesired signal.
この電磁界による結合を抑制する手段として。As a means of suppressing coupling due to this electromagnetic field.
入出力電極（２Ａ） （２Ｂ）間にアースされたシール
ド電極（４）が設けられているものである。A grounded shield electrode (4) is provided between the input and output electrodes (2A) and (2B).
しかしこの場合、基板＋１１の表面上の電磁界は。However, in this case, the electromagnetic field on the surface of substrate +11 is.
シールド電極（４）によって抑制されるが、基板（１）
の表面を離れた上方の空間では依然として電磁界が伝搬
しているため、入出力電極間の電気的結合を遮断する結
果は得られにくい。Although suppressed by the shield electrode (4), the substrate (1)
Since the electromagnetic field is still propagating in the space above, away from the surface of the electrode, it is difficult to achieve a result of cutting off the electrical coupling between the input and output electrodes.
このため第４図に示すような構成のものも従来から使用
されている。この図においては、第３図のシールド電極
（４）に代えて導体板（５）が使用されている。この導
体板（５）は導体の平板を基板（１）と直交するように
入出力電極（２Ａ）（２Ｂ）間に配設し２両電極をとり
まく空間を仕切るようにしている。その他の構成は第３
図のものと同様であるため説明を省略する。このような
構成とすれば、基板（１）の上方の空間においても電磁
界が遮蔽され、より効果的に入出力電極（２Ａ）（２Ｂ
）間の電気的結合を抑制することが出来る。しかし、導
体板（５）が基板（１）の表面に接触すると基板（１）
の表面を伝搬する表面弾性波が撹乱されるため導体板（
５）と基板表面との間に、第４図に（ａｌで示す僅かな
隙間をもった間隙部（６）を設けなければならない。For this reason, a configuration as shown in FIG. 4 has also been used in the past. In this figure, a conductor plate (5) is used in place of the shield electrode (4) of FIG. 3. The conductor plate (5) is a flat conductor plate arranged between the input and output electrodes (2A) and (2B) so as to be orthogonal to the substrate (1), so as to partition the space surrounding the two electrodes. Other configurations are 3rd
Since it is the same as that shown in the figure, the explanation will be omitted. With such a configuration, the electromagnetic field is shielded even in the space above the substrate (1), and the input/output electrodes (2A) (2B
) can suppress electrical coupling between them. However, when the conductor plate (5) comes into contact with the surface of the substrate (1), the substrate (1)
Because the surface acoustic waves propagating on the surface of the conductor plate (
5) and the substrate surface, a gap (6) with a slight gap shown in FIG. 4 (al) must be provided.
そして上述した間隙部（６）は基板表面との隙間（ａｌ
の寸法を小さくするほど入出力電極間の遮蔽効果が向上
するが、量産に当って（ａｌの値を精度よく定めるため
には導体板（５）の接地部（５Ａ）からの寸法（ｂｌを
精度゛よ（製作しなければならない。The above-mentioned gap (6) is the gap (al
The shielding effect between the input and output electrodes improves as the dimension of Precision (must be manufactured).
しかし圧電体基板（１）の厚さくｔｌにも１個々により
ばらつきがあるため（ａｌの値が一定せず、結果的には
個々の素子の特性にばらつきが生ずることになる。従っ
て精度の悪い分だけ（ａｌの値を大きめに設定しておか
なければならず、その結果、入出力電極間の電気的遮蔽
効果が悪くなるという問題点があった。However, since the thickness tl of the piezoelectric substrate (1) varies from one individual to another (the value of al is not constant, and as a result, the characteristics of individual elements vary. Therefore, the accuracy is poor. Therefore, the value of al must be set relatively large, resulting in a problem that the electrical shielding effect between the input and output electrodes deteriorates.
この発明はこのような問題点を解消するためになされた
もので、入出力電極間の電気的遮蔽について、よりよい
効果が得られると共に、遮蔽効果のばらつきの少ない素
子を提供しようとするものである。This invention was made to solve these problems, and aims to provide an element that can achieve better electrical shielding effects between input and output electrodes and has less variation in shielding effects. be.
この発明においては入出力電極間に配設される導体板に
基板の表面と接触する接触部と、この接触部から所定寸
法切り込まれ上記基板表面との間に隙間を形成する間隙
部とを設けたものである。In this invention, a conductor plate disposed between input and output electrodes has a contact portion that contacts the surface of the substrate, and a gap portion that is cut in a predetermined dimension from this contact portion and forms a gap between the conductor plate and the surface of the substrate. It was established.
導体板に上述した接触部と１間隙部とを設けることによ
り導体板と基板との位置関係が、基板の厚さのばらつき
に関係なく一定とすることが出来るため、導体板と基板
との間に設ける隙間の寸法を精度よく定めることが出来
る。By providing the above-mentioned contact portion and gap portion on the conductor plate, the positional relationship between the conductor plate and the substrate can be kept constant regardless of variations in the thickness of the substrate. The dimensions of the gap to be provided can be determined with high accuracy.
以下、第１図に示すこの発明の一実施例について説明す
る。An embodiment of the present invention shown in FIG. 1 will be described below.
第１図において（５）はこの発明の特徴とする導体板で
、基板（１１の表面に直交するような状態で載置した時
、基板端縁部の表面に接触する接触部（５Ｂ）と、この
接触部から（ａ）寸法だけ切り込まれ、基板表面との間
に（ａ１寸法の隙間を形成する間隙部（５Ｃ）とが設け
られている。又、この導体板（５）はアースされている
。その他の構成は従来のものと同様であるため説明を省
略する。In FIG. 1, (5) is a conductor plate that is a feature of the present invention, and has a contact portion (5B) that comes into contact with the surface of the edge of the substrate when it is placed perpendicular to the surface of the substrate (11). , a gap part (5C) is cut from this contact part by dimension (a) and forms a gap (a1 dimension) between it and the surface of the board.In addition, this conductor plate (5) is The rest of the configuration is the same as the conventional one, so the explanation will be omitted.
上述の構成において、導体板（５）の接地部（５Ａ）か
ら接触部（５Ｂ）までの寸法（ｄｉを基板（１１の厚さ
くｔｌのばらつきを考慮した最小値より小さい値に設定
すれば、導体板（５）の接触部（５Ｂ）は常に基板表面
と接する。従って導体板（５）の間隙部（５Ｃ）と基板
表面との隙間（ａｌは上述した（ｄｌや（ｔｌの寸法の
ばらつきに関係な（独自の寸法精度で決めることが出来
る。In the above configuration, if the dimension (di) from the grounding part (5A) to the contact part (5B) of the conductor plate (5) is set to a value smaller than the minimum value considering the variation in the thickness tl of the board (11), The contact portion (5B) of the conductor plate (5) is always in contact with the substrate surface. Therefore, the gap (al) between the gap portion (5C) of the conductor plate (5) and the substrate surface is determined by the variation in dimensions of (dl and (tl) described above. related to (can be determined with unique dimensional accuracy.
又、（ａ）の寸法は（ｄｉと比べて小さいため、より高
い精度で製作することが出来る。更に導体板（５）の厚
さくＣ）を十分薄くすることにより（ａｌの寸法を−Ｊ
−小さく、かつ精度よくすることが可能である。In addition, since the dimension (a) is smaller than (di), it can be manufactured with higher precision.Furthermore, by making the thickness C of the conductor plate (5) sufficiently thin, the dimension (al) can be reduced to -J
- It is possible to make it small and accurate.
この結果、入出力電極間の電気的結合の抑制効果がよく
て、かつばらつきの小さい素子を得ることが出来るもの
である。As a result, it is possible to obtain an element that has a good effect of suppressing electrical coupling between input and output electrodes and has small variations.
第２図はこの発明の他の実施例を示すもので。FIG. 2 shows another embodiment of the invention.
導体板（５）の間隙部（５Ｃ）に対応する位置で、基板
（１１の表面にアースされたシールド電極（４）を更に
設置したもので、入出力電極間の電気的結合の抑制効果
が一段と良くなるものである。A grounded shield electrode (4) is further installed on the surface of the substrate (11) at a position corresponding to the gap (5C) of the conductor plate (5), which has the effect of suppressing electrical coupling between input and output electrodes. It gets even better.
この発明は以上のように構成されているため。 This invention is configured as described above.
入出力電極間における電気的結合の抑制効果がよ＜、シ
かもばらつきの少ない素子を得る°ことが出来るもので
ある。The effect of suppressing electrical coupling between input and output electrodes is improved, and an element with less variation can be obtained.
第１図はこの発明の一実施例を示す斜視図、第２図はこ
の発明の他の実施例を示す斜視図、第３図及び第４図は
従来の素子の構成を示す斜視図である。図中（１１は基
板、 （２Ａ）（２Ｂ）は入力及び出力電極、（４）は
シールド電極、（５）は導体板、 （５Ｂ）は接触部、
（５Ｇ）は間隙部である。
なお、同一符号は夫々間−又は相当部分を示す。FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment of the invention, and FIGS. 3 and 4 are perspective views showing the configuration of a conventional element. . In the figure (11 is the board, (2A) and (2B) are the input and output electrodes, (4) is the shield electrode, (5) is the conductor plate, (5B) is the contact part,
(5G) is a gap. Note that the same reference numerals indicate gaps or corresponding parts, respectively.
Claims (3)
面に間隔を介して設けられた表面弾性波送信用及び受信
用の電極及び上記送受信用電極間に配設されてアースさ
れ、電磁界を遮蔽する導体板を備えたものにおいて、上
記導体板に上記基板表面と接触する接触部と、この接触
部から所定寸法切り込まれ、上記基板表面との間に隙間
を形成する間隙部とを設けたことを特徴とする表面弾性
波素子(1) A substrate that serves as a propagation medium for surface acoustic waves, electrodes for transmitting and receiving surface acoustic waves provided at intervals on the surface of this substrate, and electrodes arranged between the transmitting and receiving electrodes to be grounded and electromagnetic. A contact portion that contacts the surface of the substrate on the conductor plate, and a gap portion that is cut in a predetermined dimension from the contact portion and forms a gap between the surface of the substrate and the surface of the substrate. A surface acoustic wave device characterized by being provided with
ことを特徴とする特許請求の範囲第１項記載の表面弾性
波素子(2) The surface acoustic wave device according to claim 1, wherein the contact portion is located at an end of the substrate surface.
電極を設けるようにしたことを特徴とする特許請求の範
囲第１項又は第２項記載の表面弾性波素子(3) The surface acoustic wave device according to claim 1 or 2, characterized in that a grounded electrode is provided at a portion of the substrate surface corresponding to the gap portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19889185A JPS6259409A (en) | 1985-09-09 | 1985-09-09 | Surface acoustic wave element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19889185A JPS6259409A (en) | 1985-09-09 | 1985-09-09 | Surface acoustic wave element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6259409A true JPS6259409A (en) | 1987-03-16 |
Family
ID=16398653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19889185A Pending JPS6259409A (en) | 1985-09-09 | 1985-09-09 | Surface acoustic wave element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6259409A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065213U (en) * | 1991-09-13 | 1994-01-21 | キンセキ株式会社 | Surface mount type piezoelectric vibrator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314436B2 (en) * | 1973-07-20 | 1978-05-17 |
-
1985
- 1985-09-09 JP JP19889185A patent/JPS6259409A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5314436B2 (en) * | 1973-07-20 | 1978-05-17 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065213U (en) * | 1991-09-13 | 1994-01-21 | キンセキ株式会社 | Surface mount type piezoelectric vibrator |
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