JPS625712A - High frequency noise elimination device - Google Patents
High frequency noise elimination deviceInfo
- Publication number
- JPS625712A JPS625712A JP14424785A JP14424785A JPS625712A JP S625712 A JPS625712 A JP S625712A JP 14424785 A JP14424785 A JP 14424785A JP 14424785 A JP14424785 A JP 14424785A JP S625712 A JPS625712 A JP S625712A
- Authority
- JP
- Japan
- Prior art keywords
- frequency noise
- high frequency
- circuit
- conductor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Filters And Equalizers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、基板に実装された回路において、その回路か
ら発生される高周波ノイズを除去する装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a device for removing high frequency noise generated from a circuit mounted on a circuit board.
従来の技術
近年、デジタル信号処理回路をセラミック基板上に実装
して高密度実装するものが実現されている。ところが、
このようなデジタル信号処理回路は高周波ノイズを発生
することが多く、その対策が問題となっている。2. Description of the Related Art In recent years, high-density mounting of digital signal processing circuits on ceramic substrates has been realized. However,
Such digital signal processing circuits often generate high frequency noise, and countermeasures against this have become a problem.
まず、図面を参照しながら、上述したような高周波ノイ
ズ除去装置について説明する。第３図は、従来の高周波
ノイズ除去装置の構成を示すものである。第３図におい
て、１１は高周波ノイズを発生する回路、１２はコンデ
ンサ、１３はコイル、１４はコンデンサ、１６は信号線
、１６は引出し線である。First, a high frequency noise removal device as described above will be explained with reference to the drawings. FIG. 3 shows the configuration of a conventional high frequency noise removal device. In FIG. 3, 11 is a circuit that generates high frequency noise, 12 is a capacitor, 13 is a coil, 14 is a capacitor, 16 is a signal line, and 16 is a lead line.
以上のように構成された高周波ノイズ除去装置において
、回路１１としてデジタル信号処理回路の場合を例にと
ると、デジタル信号処理回路は処理する信号よりも高い
周波数のクロック信号を用いており、そのクロック信号
は矩形波であることが多いため高調波ノイズを発生する
。これにより信号１６に本来必要とされる信号以外にこ
の高調波ノイズが洩れるため、信号１５のラインから外
部に高調波ノイズを輻射し、他の高周波回路に悪影響を
与える。In the high frequency noise removal device configured as described above, taking as an example the case where the circuit 11 is a digital signal processing circuit, the digital signal processing circuit uses a clock signal with a higher frequency than the signal to be processed. Since the signal is often a rectangular wave, it generates harmonic noise. As a result, this harmonic noise leaks in addition to the signal originally required for the signal 16, so that the harmonic noise is radiated to the outside from the line of the signal 15, and has an adverse effect on other high-frequency circuits.
そのため、第３図に示すように、１２，１３゜１４で構
成されるり、Ｃのフィルタを信号線１５に挿入すること
によって外部への信号線１６には高周波ノイズが洩れな
いような高周波ノイズ除去装置が構成されている。Therefore, as shown in FIG. 3, by inserting a filter of 12, 13° 14 or C into the signal line 15, high-frequency noise removal can be performed to prevent high-frequency noise from leaking to the signal line 16 to the outside. The device is configured.
発明が解決しようとする問題点
しかしながら、上記のような従来の構成では、各信号線
にり、Ｃのフィルタを挿入することが必要であシ、デジ
タル信号のように信号線が多い回路においては部品点数
が多くなってコストが高くなり、また実装密度も低下す
るといった問題点を有していた。Problems to be Solved by the Invention However, in the conventional configuration as described above, it is necessary to insert a C filter into each signal line, and in a circuit with many signal lines such as a digital signal, it is necessary to insert a C filter into each signal line. There are problems in that the number of parts increases, the cost increases, and the packaging density also decreases.
本発明は、上記問題点に鑑み、簡易な構成にして高周波
ノイズを除去することのできる高周波ノイズ除去装置を
提供するものである。In view of the above-mentioned problems, the present invention provides a high-frequency noise removal device that can remove high-frequency noise with a simple configuration.
問題点を解決するための手段
この目的を達成するだめに、本発明の高周波ノイズ除去
装置は、基板上に実装された回路の配線導体とその裏面
に形成された導体膜とによって、高周波ノイズ除去用の
容量を形成するように構成されている。Means for Solving the Problems In order to achieve this object, the high frequency noise removal device of the present invention eliminates high frequency noise by using the wiring conductor of the circuit mounted on the board and the conductor film formed on the back surface of the wiring conductor. is configured to form a capacity for
作用
この構成によって、基板は、特にセラミック基板の場合
は高い誘電率を有し、その両面に構成された導体間にお
いて容量を形成して高周波ノイズ除去用のフィルタを実
現できるものである。Function: With this configuration, the substrate has a high dielectric constant, especially in the case of a ceramic substrate, and a capacitance is formed between the conductors formed on both sides of the substrate, thereby realizing a filter for removing high frequency noise.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。第１図は、本発明の一実施例における高周波
ノイズ除去装置の構成を示すものである。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 shows the configuration of a high frequency noise removal device in one embodiment of the present invention.
図中、１はセラミック基板、２はセラミック基板１の第
１の面に実装された高周波ノイズを発生する回路、３は
コイル、４は表面の回路２の配線導体、６はその引出し
線、６は表面側に形成された導体、７はセラミック基板
１の第２の面で回路２の裏面にあたる部分に形成された
導体膜である。In the figure, 1 is a ceramic substrate, 2 is a circuit that generates high frequency noise mounted on the first surface of the ceramic substrate 1, 3 is a coil, 4 is a wiring conductor of the circuit 2 on the surface, 6 is its lead wire, 6 7 is a conductor formed on the front surface side, and 7 is a conductor film formed on the second surface of the ceramic substrate 1, which corresponds to the back surface of the circuit 2.
以上のように構成された装置について、以下その動作を
説明する。The operation of the apparatus configured as described above will be described below.
セラミック基板１上に実装された回路２の端子８よシ信
号が配線導体６を介して取シ出される。A signal from a terminal 8 of a circuit 2 mounted on a ceramic substrate 1 is taken out via a wiring conductor 6.
この信号はコイル３を介して配線導体４によって導かれ
、引出し線６よシ外部に引出される。This signal is guided by the wiring conductor 4 via the coil 3, and is drawn out to the outside via the lead wire 6.
今、回路２がその動作基本クロック信号を有する場合、
そのクロック信号は矩形波であるので、高調波ノイズを
発生し、その高調波ノイズが回路２よシ他の端子からの
信号に重畳されて外部に出力される。Now, if circuit 2 has its operating basic clock signal,
Since the clock signal is a rectangular wave, it generates harmonic noise, which is superimposed on signals from the circuit 2 and other terminals and output to the outside.
しかるに、本回路では、第１図すに示すように、セラミ
ック基板の表裏両面の配線導体６と７によってコンデン
サを形成し、これを用いて高周波ノイズが外部に漏出し
ないようにするだめのフィルタを構成する。このコンデ
ンサの容量値は基板１の誘電率、板厚、導体の面積によ
って決まり、セラミック基板（ム１２０５）の場合には
、板厚０．６ｆｌであると１１当、９１４ＰＦ程度とな
り、通常の紙フェノール基板（板厚１．６ｊｆｆ）の場
合の約６倍程度になる。この容量を用いることにより、
第１図すにおいて、導体７を回路２のアースに接続する
と区間１１および１２において導体７と相対する面積を
とることによって、基板上で容量の大きなコンデンサを
形成することができ、第２図のような等何回路が構成で
きる。このコンデンサ９゜１０の容量は除去する高周波
ノイズの周波数とコイル３の値によって求められる値と
する。However, in this circuit, as shown in Figure 1, a capacitor is formed by the wiring conductors 6 and 7 on both the front and back surfaces of the ceramic substrate, and this is used to create a filter to prevent high frequency noise from leaking to the outside. Configure. The capacitance value of this capacitor is determined by the dielectric constant, plate thickness, and area of the conductor of the substrate 1. In the case of a ceramic substrate (Mu1205), if the plate thickness is 0.6 fl, it will be about 11 capacitances, 914 PF, and it will be about 914 PF, compared to ordinary paper. It is about 6 times that of a phenol substrate (board thickness 1.6jff). By using this capacity,
In FIG. 1, when the conductor 7 is connected to the ground of the circuit 2, by taking the area facing the conductor 7 in sections 11 and 12, a capacitor with a large capacitance can be formed on the substrate, and as shown in FIG. How many circuits can be constructed like this? The capacitance of this capacitor 9.degree.10 is determined by the frequency of the high frequency noise to be removed and the value of the coil 3.
以上のように、本実施例によれば、基板両面に設けた導
体間の容量を利用することによって、きわめて簡単に、
追加コンデンサを用いることなく高周波ノイズ除去用の
フィルタを構成することができる。As described above, according to this embodiment, by utilizing the capacitance between the conductors provided on both sides of the substrate,
A filter for high frequency noise removal can be configured without using an additional capacitor.
発明の効果
以上のように、本発明は基板に高周波ノイズを発生する
回路を実装したときに、その基板の表裏両面に設けた導
体間で高周波ノイズ除去用のコンデンサを形成するよう
にしたことにより、簡単な構成で高周波ノイズ除去用の
容量を実現でき、部品点数を削減して低コストにでき、
高密度実装も可能にできるという実用的効果の大なるも
のである。Effects of the Invention As described above, the present invention has a structure in which, when a circuit that generates high frequency noise is mounted on a board, a capacitor for removing high frequency noise is formed between the conductors provided on both the front and back sides of the board. , the capacitance for high-frequency noise removal can be achieved with a simple configuration, the number of parts can be reduced, and costs can be reduced.
This has a great practical effect in that high-density packaging is also possible.
第１図ａ、ｂは本発明の一実施例における高周波ノイズ
除去装置の構成を示す断面図および平面図、第２図はそ
の等価回路図、第３図は従来例の高周波ノイズ除去装置
の回路図である。
１・・・・・・セラミック基板、２・・・・・・高周波
ノイズ発生回路、４，６・・・・・・表面導体、７・・
・・・・裏面導体。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名イー
ーーｔシ膜フ７】１氾反
４．６一−−秩面４一体
δ−了１ｔＬ銖
７−、Ｉ面帽ト1a and 1b are cross-sectional views and plan views showing the configuration of a high-frequency noise removing device according to an embodiment of the present invention, FIG. 2 is an equivalent circuit diagram thereof, and FIG. 3 is a circuit of a conventional high-frequency noise removing device. It is a diagram. 1...Ceramic substrate, 2...High frequency noise generation circuit, 4, 6...Surface conductor, 7...
...Back conductor. Name of agent: Patent attorney Satoshi Nakao and one other person
Claims (1)
回路に接続された配線導体と、前記回路の裏面にあたる
基板の第２の面に設けられ所定の面積を有する導体膜と
を備え、前記配線導体と導体膜との間に形成される容量
により前記高周波ノイズを除去するようにしたことを特
徴とする高周波ノイズ除去装置。A wiring conductor connected to a circuit that generates high frequency noise mounted on a first surface of a substrate, and a conductive film having a predetermined area provided on a second surface of the substrate corresponding to the back surface of the circuit, A high frequency noise removal device characterized in that the high frequency noise is removed by a capacitance formed between a wiring conductor and a conductor film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14424785A JPS625712A (en) | 1985-07-01 | 1985-07-01 | High frequency noise elimination device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14424785A JPS625712A (en) | 1985-07-01 | 1985-07-01 | High frequency noise elimination device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625712A true JPS625712A (en) | 1987-01-12 |
Family
ID=15357660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14424785A Pending JPS625712A (en) | 1985-07-01 | 1985-07-01 | High frequency noise elimination device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625712A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476120U (en) * | 1990-11-16 | 1992-07-02 | ||
| EP1196017A2 (en) * | 2000-03-21 | 2002-04-10 | Diehl Avionik Systeme GmbH | Filtering device |
-
1985
- 1985-07-01 JP JP14424785A patent/JPS625712A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476120U (en) * | 1990-11-16 | 1992-07-02 | ||
| EP1196017A2 (en) * | 2000-03-21 | 2002-04-10 | Diehl Avionik Systeme GmbH | Filtering device |
| EP1196017A3 (en) * | 2000-03-21 | 2006-06-07 | Diehl Avionik Systeme GmbH | Filtering device |
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