JPS62569B2 - - Google Patents
Info
- Publication number
- JPS62569B2 JPS62569B2 JP56215745A JP21574581A JPS62569B2 JP S62569 B2 JPS62569 B2 JP S62569B2 JP 56215745 A JP56215745 A JP 56215745A JP 21574581 A JP21574581 A JP 21574581A JP S62569 B2 JPS62569 B2 JP S62569B2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- solid electrolytic
- capacitor element
- cathode
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 55
- 239000007787 solid Substances 0.000 claims description 55
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000003973 paint Substances 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Description
【発明の詳細な説明】
本発明はチツプ状固体電解コンデンサに関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped solid electrolytic capacitor.
チツプタンタル固体電解コンデンサは、一般
に、第１図のように陽極導出線１を具備する弁作
用金属であるタンタル金属の表面に誘電体性酸化
皮膜を形成させ、その表面に電解質である二酸化
マンガン層を形成させ、更にその上にコロイダル
カーボン層、銀塗料層、半田層などを順次積層形
成させて固体電解コンデンサ素子２を得、この固
体電解コンデンサ素子２を薄板状コム金属端子３
の陰極部４ｂに形成された断面コ字状の固定部５
に挿入し、陽極導出線１と薄板状コム金属端子３
の陽極部４ａとを溶接により接続し、固定部５と
固体電解コンデンサ素子２の陰極部とを半田６で
接続し、薄板状コム金属端子３の陽極部４ａ及び
陰極部４ｂの一部が外部に引出されるように樹脂
外装７し、外部に突出した陽極部４ａ及び陰極部
４ｂを樹脂外装７の表面に沿つて折曲げ加工され
ている。 Chip tantalum solid electrolytic capacitors generally have a dielectric oxide film formed on the surface of tantalum metal, which is a valve metal, and which has an anode lead wire 1 as shown in Fig. 1, and a manganese dioxide layer, which is an electrolyte, on the surface. A colloidal carbon layer, a silver paint layer, a solder layer, etc. are sequentially formed on the solid electrolytic capacitor element 2, and this solid electrolytic capacitor element 2 is connected to a thin comb metal terminal 3.
A fixing part 5 having a U-shaped cross section formed on the cathode part 4b of
Insert the anode lead wire 1 and thin comb metal terminal 3 into
The fixing part 5 and the cathode part of the solid electrolytic capacitor element 2 are connected by solder 6, and part of the anode part 4a and cathode part 4b of the thin comb metal terminal 3 is connected to the outside by welding. A resin sheath 7 is formed so as to be pulled out, and the anode portion 4a and cathode portion 4b protruding to the outside are bent along the surface of the resin sheath 7.
しかしながら、このような従来のチツプ状固体
電解コンデンサにおいては、固体電解コンデンサ
素子２の陰極部４ｂと薄板状コム金属端子３の固
定部５との接続は、半田６付け又は、導電性接着
剤によつて行われているが、次工程以降の取扱い
及び樹脂外装７を行うためのモールド成形工程な
どでこの接続部がはずれ易いという欠点があつ
た。この原因には種々の要因があるが、その第１
は二酸化マンガン層とコロイダルカーボン層との
接着力が弱いこと、その第２はコロイダルカーボ
ン層とAg塗料層との接着力が弱いこと、その第
３はAg塗料層と固定部５との半田６付け又は導
電性接着剤による接続が不充分であることなどで
ある。 However, in such conventional chip-shaped solid electrolytic capacitors, the connection between the cathode part 4b of the solid electrolytic capacitor element 2 and the fixing part 5 of the thin comb metal terminal 3 is done by soldering 6 or using a conductive adhesive. However, this method has the disadvantage that the connection part is likely to come off during handling in subsequent steps and the molding step for forming the resin sheath 7. There are various reasons for this, but the first one is
The second reason is that the adhesive force between the manganese dioxide layer and the colloidal carbon layer is weak, the second reason is that the adhesive force between the colloidal carbon layer and the Ag paint layer is weak, and the third reason is that the solder 6 between the Ag paint layer and the fixing part 5 is weak. Inadequate bonding or conductive adhesive connections.
要因の第１及び第２は二酸化マンガンが多孔質
で軟らかい層であること、及びコロイダルカーボ
ン層も接着力の弱いコロイド溶液を用いているこ
とに起因している。これを本質的に改良すること
は現状の技術レベルでは非常に困難である。要因
の第３は半田量又は半田付け面積及び半田の溶融
のさせ方、また導電性の接着剤を用いる場合には
接着剤の接着力、接着剤の量及び接着面積に起因
するところが大きい。しかしながら、この第３の
要因を改善しても限界がある。それは、第１の要
因及び第２の要因に起因するところが大きいから
である。即ち、固定部５と固体電解コンデンサ素
子２の最外周の陰極層（銀塗料層）とを強固に接
続しても、二酸化マンガン層とコロイダルカーボ
ン層、コロイダルカーボン層と銀塗料層との接着
力が弱いためその部分ではずれてしまうからであ
る。 The first and second factors are due to the fact that manganese dioxide is a porous and soft layer, and the colloidal carbon layer also uses a colloidal solution with weak adhesive strength. It is extremely difficult to essentially improve this at the current technological level. The third factor is largely due to the amount of solder or soldering area, how the solder is melted, and when a conductive adhesive is used, the adhesive strength of the adhesive, the amount of adhesive, and the adhesive area. However, even if this third factor is improved, there are limits. This is largely due to the first and second factors. That is, even if the fixed part 5 and the outermost cathode layer (silver paint layer) of the solid electrolytic capacitor element 2 are firmly connected, the adhesive strength between the manganese dioxide layer and the colloidal carbon layer, and between the colloidal carbon layer and the silver paint layer This is because it is weak and will come off at that part.
本発明は上記の点に鑑み、固体電解コンデンサ
素子を固定部に確実に固定することができるチツ
プ状固体電解コンデンサを得ることを目的とす
る。 In view of the above points, the present invention aims to provide a chip-shaped solid electrolytic capacitor that can securely fix a solid electrolytic capacitor element to a fixed part.
すなわち本発明は、陽極導出線を有する固体電
解コンデンサ素子と、この固体電解コンデンサ素
子を覆う樹脂外装と、前記固体電解コンデンサ素
子の陽極導出線及び陰極部にそれぞれ接続されか
つ一部が前記樹脂外装の外部に突出する陽極部及
び陰極部を有する薄板状コム金属端子とを設け、
この薄板状コム金属端子の陰極部に、前記固体電
解コンデンサ素子の陰極部の上面及び両側面にそ
れぞれ対向するウエブ部及びフランジ部から成る
断面略コ字状の固定部を設け、前記フランジ部を
屈曲させて前記固体電解コンデンサ素子の両側面
に当接させるか、または前記フランジ部の先端を
前記固体電解コンデンサ素子の下面よりも下方へ
突出させたものであり、固体電解コンデンサ素子
の両側面に当接可能なフランジ部により固体電解
コンデンサ素子を挾み込むか、あるいは固体電解
コンデンサ素子の下面よりも下方へ突出するフラ
ンジ部を用いて、固体電解コンデンサ素子の全周
にわたつて半田または導電性接着剤を設けたり、
フランジ部の先端部を内側へ折曲したりすること
により、固体電解コンデンサ素子を固定部に強固
に固定できるのである。 That is, the present invention provides a solid electrolytic capacitor element having an anode lead-out wire, a resin exterior covering the solid electrolytic capacitor element, and a part of the resin exterior that is connected to the anode lead-out wire and the cathode portion of the solid electrolytic capacitor element, respectively. a thin comb metal terminal having an anode portion and a cathode portion protruding to the outside;
The cathode portion of the thin comb metal terminal is provided with a fixing portion having a substantially U-shaped cross section and consisting of a web portion and a flange portion facing each other on the upper surface and both side surfaces of the cathode portion of the solid electrolytic capacitor element. The solid electrolytic capacitor element is bent so as to come into contact with both side surfaces of the solid electrolytic capacitor element, or the tip of the flange portion is made to protrude below the lower surface of the solid electrolytic capacitor element. Either sandwich the solid electrolytic capacitor element with a contactable flange part, or use a flange part that protrudes below the bottom surface of the solid electrolytic capacitor element to apply solder or conductive material around the entire circumference of the solid electrolytic capacitor element. Install adhesive or
By bending the tip of the flange portion inward, the solid electrolytic capacitor element can be firmly fixed to the fixed portion.
以下本発明の一実施例を図面に基づいて説明す
る。第２図Ａはチツプ状固体電解コンデンサの斜
視図、同図ＢはＡにおける−線に沿う断面
図、第３図Ａは組立前の薄板状コム金属端子の陰
極部の斜視図、同図Ｂは同陽極部の斜視図、同図
Ｃは同固定部の断面図であり、第１図に示す構成
要素と同一の構成要素には同一の符号を付してそ
の説明を省略する。 An embodiment of the present invention will be described below based on the drawings. Figure 2A is a perspective view of a chip-shaped solid electrolytic capacitor, Figure B is a sectional view taken along the - line in A, Figure 3A is a perspective view of the cathode portion of a thin plate-shaped comb metal terminal before assembly, Figure B 1 is a perspective view of the anode portion, and FIG. 1C is a cross-sectional view of the fixing portion, and the same components as those shown in FIG.
薄板状コム金属端子３の陽極部４ｂに形成され
た固定部８は、平板状のウエブ部８ａと、このウ
エブ部８ａの両端から下方に突出する一対のフラ
ンジ部８ｂとから構成されており、フランジ部８
ｂは中央部が折曲されて先端が固体電解コンデン
サ素子２の両側面に当接している。前記一対のフ
ランジ部８ｂの先端間の間隔は、固体電解コンデ
ンサ素子２を固定部８に挿入していない状態では
固体電解コンデンサ素子２の幅よりも狭く形成さ
れており、一対のフランジ部８ｂは固体電解コン
デンサ素子２をバネアクシヨンにより強固に挾み
込んでいる。 The fixing part 8 formed on the anode part 4b of the thin comb metal terminal 3 is composed of a flat web part 8a and a pair of flange parts 8b protruding downward from both ends of the web part 8a. Flange part 8
b is bent at the center, and its tips are in contact with both side surfaces of the solid electrolytic capacitor element 2. The distance between the tips of the pair of flange parts 8b is narrower than the width of the solid electrolytic capacitor element 2 when the solid electrolytic capacitor element 2 is not inserted into the fixing part 8. The solid electrolytic capacitor element 2 is firmly sandwiched by spring action.
次に製造方法を説明する。先ず固定部５の内側
に半田又は導電性接着剤を予め附着させるか、あ
るいは固体電解コンデンサ素子２の陰極部に同様
な処理を施し、これを固定部８に挿入し、固定部
８のフランジ部８ｂ，８ｂにより固体電解コンデ
ンサ素子２を挾み込む。次に陽極導出線１と薄板
状コム金属端子３の陽極部４ａとを溶接により接
続し、この後、固定部８のウエブ部８ａと固体電
解コンデンサ素子２の上面とがよく密接するよう
に上下より若干の圧力を加えながら加熱して接続
させる。この後、通常の方法で樹脂外装７を形成
し、陽極部４ａ及び陰極部４ｂを樹脂外装７の表
面に沿つて折曲することによりチツプ状固体電解
コンデンサが得られる。 Next, the manufacturing method will be explained. First, solder or conductive adhesive is applied to the inside of the fixing part 5 in advance, or a similar treatment is applied to the cathode part of the solid electrolytic capacitor element 2, and this is inserted into the fixing part 8, and the flange part of the fixing part 8 is The solid electrolytic capacitor element 2 is sandwiched between 8b and 8b. Next, the anode lead wire 1 and the anode part 4a of the thin comb metal terminal 3 are connected by welding, and then the web part 8a of the fixing part 8 and the upper surface of the solid electrolytic capacitor element 2 are moved up and down so that they are in close contact with each other. Heat and connect while applying a little more pressure. Thereafter, a resin sheath 7 is formed using a conventional method, and the anode portion 4a and the cathode portion 4b are bent along the surface of the resin sheath 7 to obtain a chip-shaped solid electrolytic capacitor.
かくして得られたチツプ状固体電解コンデンサ
は、固定部８のフランジ部８ｂ，８ｂのバネアク
シヨンにより固体電解コンデンサ素子２が挾み込
まれているので、固体電解コンデンサ素子２が固
定部８に強固に固定され、トランフアーモールド
による樹脂外装を行なつても接続不良は非常に少
なくなるかほとんど発生しないので、信頼性が非
常に高い。 In the thus obtained chip-shaped solid electrolytic capacitor, the solid electrolytic capacitor element 2 is sandwiched between the spring action of the flange parts 8b, 8b of the fixing part 8, so that the solid electrolytic capacitor element 2 is firmly fixed to the fixing part 8. Even if resin cladding is performed using transfer molding, connection failures will be very low or almost non-existent, resulting in extremely high reliability.
第４図Ａ〜Ｄはそれぞれ別の実施例を示してお
り、Ａ，Ｂのようにフランジ部８ｂの形状を変化
させてもよく、またＣのようにフランジ８ｂの先
端部を固体電解コンデンサ素子２の下面よりも下
方に突出させて固体電解コンデンサ素子２の全周
にわたつて半田６または導電性接着剤で覆つても
同様の効果が得られる。さらにまたＤのように、
フランジ８ｂの先端部を固体電解コンデンサ素子
２の下面よりも下方に突出させかつこの先端部を
内側に折曲して固体電解コンデンサ素子２を包み
込むようにしても同様の効果が得られる。 4A to 4D show different embodiments, and the shape of the flange portion 8b may be changed as shown in A and B, and the tip of the flange 8b may be replaced with a solid electrolytic capacitor element as shown in C. A similar effect can be obtained by covering the entire circumference of the solid electrolytic capacitor element 2 with solder 6 or a conductive adhesive so as to protrude below the lower surface of the solid electrolytic capacitor element 2 . Furthermore, like D,
A similar effect can be obtained by making the tip of the flange 8b protrude below the lower surface of the solid electrolytic capacitor element 2 and bending the tip inward to wrap around the solid electrolytic capacitor element 2.
以上説明したように、本発明にかかるチツプ状
固体電解コンデンサによれば、固体電解コンデン
サ素子を確実に固定部に固定し得、したがつて接
触不良を生じることがないので、高い信頼性を得
ることができる。 As explained above, according to the chip-shaped solid electrolytic capacitor according to the present invention, the solid electrolytic capacitor element can be securely fixed to the fixed part, and therefore no contact failure occurs, so that high reliability can be obtained. be able to.
第１図Ａは従来のチツプ状固体電解コンデンサ
の斜視図、同図ＢはＡにおける−線に沿う断
面図、第２図Ａは本発明の一実施例におけるチツ
プ状固体電解コンデンサの斜視図、同図ＢはＡに
おける−線に沿う断面図、第３図Ａは組立前
の薄板状コム金属端子の陰極部の斜視図、同図Ｂ
は同陽極部の斜視図、同図Ｃの固定部の断面図、
第４図Ａ〜Ｄはそれぞれ別の実施例における固定
部の断面図である。
１……陽極導出線、２……固体電解コンデンサ
素子、３……薄板状コム金属端子、４ａ……陽極
部、４ｂ……陰極部、６……半田、７……外装、
８……固定部、８ａ……ウエブ部、８ｂ……フラ
ンジ部。
FIG. 1A is a perspective view of a conventional chip-shaped solid electrolytic capacitor, FIG. 1B is a sectional view taken along the - line in A, and FIG. Figure B is a sectional view taken along the - line in A, Figure 3A is a perspective view of the cathode part of the thin comb metal terminal before assembly, Figure B
is a perspective view of the anode part, a cross-sectional view of the fixed part in Figure C,
FIGS. 4A to 4D are cross-sectional views of fixing portions in different embodiments, respectively. DESCRIPTION OF SYMBOLS 1... Anode lead wire, 2... Solid electrolytic capacitor element, 3... Thin comb metal terminal, 4a... Anode part, 4b... Cathode part, 6... Solder, 7... Exterior,
8... fixed part, 8a... web part, 8b... flange part.
Claims (1)
と、この固体電解コンデンサ素子を覆う樹脂外装
と、前記固体電解コンデンサ素子の陽極導出線及
び陰極部にそれぞれ接続されかつ一部が前記樹脂
外装の外部に突出する陽極部及び陰極部を有する
薄板状コム金属端子とを設け、この薄板状コム金
属端子の陰極部に、前記固体電解コンデンサ素子
の陰極部の上面及び両側面にそれぞれ対向するウ
エブ部及びフランジ部から成る断面略コ字状の固
定部を設け、前記フランジ部を屈曲させて前記固
体電解コンデンサ素子の両側面に当接させるか、
または前記フランジ部の先端を前記固体電解コン
デンサ素子の下面よりも下方へ突出させたチツプ
状固体電解コンデンサ。 ２ フランジ部は、その下端が固体電解コンデン
サ素子の下面よりも下方へ突出し、固体電解コン
デンサ素子は、全周にわたつて半田または導電性
接着剤で包み込まれている特許請求の範囲第１項
記載のチツプ状固体電解コンデンサ。 ３ フランジ部は、その下端部が固体電解コンデ
ンサ素子の下面よりも下方へ突出しかつ内側に折
曲されている特許請求の範囲第１項記載のチツプ
状固体電解コンデンサ。[Scope of Claims] 1. A solid electrolytic capacitor element having an anode lead-out wire, a resin exterior covering the solid electrolytic capacitor element, and a part of the solid electrolytic capacitor element connected to the anode lead-out wire and the cathode portion of the solid electrolytic capacitor element. A thin plate-shaped comb metal terminal having an anode part and a cathode part protruding to the outside of the resin casing is provided, and the cathode part of the thin plate-shaped comb metal terminal is opposed to the upper surface and both sides of the cathode part of the solid electrolytic capacitor element, respectively. a fixing part having a substantially U-shaped cross section consisting of a web part and a flange part is provided, and the flange part is bent to abut on both sides of the solid electrolytic capacitor element, or
Or a chip-shaped solid electrolytic capacitor in which the tip of the flange portion protrudes below the lower surface of the solid electrolytic capacitor element. 2. The lower end of the flange portion protrudes below the lower surface of the solid electrolytic capacitor element, and the solid electrolytic capacitor element is wrapped around the entire circumference with solder or conductive adhesive, as set forth in claim 1. chip solid electrolytic capacitor. 3. The chip-shaped solid electrolytic capacitor according to claim 1, wherein the flange portion has a lower end portion that protrudes below the lower surface of the solid electrolytic capacitor element and is bent inward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56215745A JPS58115811A (en) | 1981-12-28 | 1981-12-28 | Chip-shaped solid electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56215745A JPS58115811A (en) | 1981-12-28 | 1981-12-28 | Chip-shaped solid electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58115811A JPS58115811A (en) | 1983-07-09 |
| JPS62569B2 true JPS62569B2 (en) | 1987-01-08 |
Family
ID=16677499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56215745A Granted JPS58115811A (en) | 1981-12-28 | 1981-12-28 | Chip-shaped solid electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58115811A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6117727U (en) * | 1984-07-04 | 1986-02-01 | 関西日本電気株式会社 | solid electrolytic capacitor |
| JPH0518025U (en) * | 1991-08-12 | 1993-03-05 | 関西日本電気株式会社 | Solid electrolytic capacitor |
| KR100568280B1 (en) * | 2003-11-14 | 2006-04-05 | 삼성전기주식회사 | A solid electrolytic condenser and it's manufactuer |
| WO2021153522A1 (en) * | 2020-01-28 | 2021-08-05 | パナソニックＩｐマネジメント株式会社 | Electrolytic capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140619A (en) * | 1980-04-02 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Chip-shaped solid electrolytic condenser and method of manufacturing same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5481442U (en) * | 1977-11-19 | 1979-06-09 |
-
1981
- 1981-12-28 JP JP56215745A patent/JPS58115811A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140619A (en) * | 1980-04-02 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Chip-shaped solid electrolytic condenser and method of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58115811A (en) | 1983-07-09 |
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