JPS6256661B2 - - Google Patents

Info

Publication number
JPS6256661B2
JPS6256661B2 JP57142846A JP14284682A JPS6256661B2 JP S6256661 B2 JPS6256661 B2 JP S6256661B2 JP 57142846 A JP57142846 A JP 57142846A JP 14284682 A JP14284682 A JP 14284682A JP S6256661 B2 JPS6256661 B2 JP S6256661B2
Authority
JP
Japan
Prior art keywords
inspection
semiconductor wafer
defective
semiconductor wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57142846A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5932146A (ja
Inventor
Seiichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14284682A priority Critical patent/JPS5932146A/ja
Publication of JPS5932146A publication Critical patent/JPS5932146A/ja
Publication of JPS6256661B2 publication Critical patent/JPS6256661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Sorting Of Articles (AREA)
JP14284682A 1982-08-18 1982-08-18 半導体ウエハ−の検査装置 Granted JPS5932146A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14284682A JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14284682A JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Publications (2)

Publication Number Publication Date
JPS5932146A JPS5932146A (ja) 1984-02-21
JPS6256661B2 true JPS6256661B2 (de) 1987-11-26

Family

ID=15324968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14284682A Granted JPS5932146A (ja) 1982-08-18 1982-08-18 半導体ウエハ−の検査装置

Country Status (1)

Country Link
JP (1) JPS5932146A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6188240U (de) * 1984-11-15 1986-06-09
JPS6196544U (de) * 1984-11-30 1986-06-21
KR100445457B1 (ko) 2002-02-25 2004-08-21 삼성전자주식회사 웨이퍼 후면 검사 장치 및 검사 방법
CN217830844U (zh) * 2022-06-14 2022-11-18 天津市环欧新能源技术有限公司 一种硅片分选机构及设有该分选机构的分选机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (de) * 1974-05-10 1975-11-21
JPS5572875A (en) * 1978-11-27 1980-06-02 Nec Corp Sorting method for semiconductor element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145077A (de) * 1974-05-10 1975-11-21
JPS5572875A (en) * 1978-11-27 1980-06-02 Nec Corp Sorting method for semiconductor element

Also Published As

Publication number Publication date
JPS5932146A (ja) 1984-02-21

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