JPS6251742U - - Google Patents
Info
- Publication number
- JPS6251742U JPS6251742U JP1985142783U JP14278385U JPS6251742U JP S6251742 U JPS6251742 U JP S6251742U JP 1985142783 U JP1985142783 U JP 1985142783U JP 14278385 U JP14278385 U JP 14278385U JP S6251742 U JPS6251742 U JP S6251742U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- chip
- bump members
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1412—Layout
- H01L2224/1414—Circular array, i.e. array with radial symmetry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985142783U JPS6251742U (es) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985142783U JPS6251742U (es) | 1985-09-20 | 1985-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6251742U true JPS6251742U (es) | 1987-03-31 |
Family
ID=31051838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985142783U Pending JPS6251742U (es) | 1985-09-20 | 1985-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6251742U (es) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119740A (ja) * | 1989-10-02 | 1991-05-22 | Hitachi Ltd | 液晶ディスプレイ装置用半導体装置 |
JPH03159144A (ja) * | 1989-11-16 | 1991-07-09 | Hitachi Ltd | 半導体装置 |
JPH05175274A (ja) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | チップ部品 |
JP2010529673A (ja) * | 2007-06-07 | 2010-08-26 | シリコン・ワークス・カンパニー・リミテッド | 半導体チップのパッド配置構造 |
-
1985
- 1985-09-20 JP JP1985142783U patent/JPS6251742U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03119740A (ja) * | 1989-10-02 | 1991-05-22 | Hitachi Ltd | 液晶ディスプレイ装置用半導体装置 |
JPH03159144A (ja) * | 1989-11-16 | 1991-07-09 | Hitachi Ltd | 半導体装置 |
JPH05175274A (ja) * | 1991-12-26 | 1993-07-13 | Matsushita Electric Ind Co Ltd | チップ部品 |
JP2010529673A (ja) * | 2007-06-07 | 2010-08-26 | シリコン・ワークス・カンパニー・リミテッド | 半導体チップのパッド配置構造 |