JPS6250162A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6250162A JPS6250162A JP60192208A JP19220885A JPS6250162A JP S6250162 A JPS6250162 A JP S6250162A JP 60192208 A JP60192208 A JP 60192208A JP 19220885 A JP19220885 A JP 19220885A JP S6250162 A JPS6250162 A JP S6250162A
- Authority
- JP
- Japan
- Prior art keywords
- metal silicide
- thermal head
- heat
- conductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
- Details Of Resistors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッドに係り、特に耐酸化性のない金
属にて形成された導体パターンの酸化防止に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a thermal head, and particularly to preventing oxidation of a conductor pattern formed of a metal with no oxidation resistance.
第2図は従来のサーマルヘッドを説明するだめの断面側
面図であり、図において、(1)は発熱基板、(2)は
発熱基板上に形成された導体リード、(3)は発熱基板
(1)と導体リード(2)層間に形成され導体IJ−ド
(2)間に構成された発熱抵抗体、(4)はこの発熱抵
抗体(3)を摩耗および酸化から守るだめの抵抗体保護
層、(5)は導体リード(2)が酸化するのを防止する
酸化防止層である。FIG. 2 is a cross-sectional side view for explaining a conventional thermal head. In the figure, (1) is a heat-generating board, (2) is a conductor lead formed on the heat-generating board, and (3) is a heat-generating board ( A heating resistor is formed between the conductor lead (1) and the conductor lead (2), and (4) is a resistor protector that protects the heating resistor (3) from wear and oxidation. Layer (5) is an anti-oxidation layer that prevents the conductor leads (2) from oxidizing.
以上のように構成される従来のサーマルヘッドは酸化防
止層(5)で覆われていない導体リード(2)へ外部回
路(図示せず)より電力、信号等が給電され導体リード
(2)間に構成された発熱抵抗体(3)が発熱しプラテ
ン(図示せず)との間に挾まれた感熱紙又は転写紙(図
示せず)を印写する。In the conventional thermal head configured as described above, power, signals, etc. are supplied from an external circuit (not shown) to the conductor leads (2) that are not covered with the anti-oxidation layer (5), and between the conductor leads (2). A heating resistor (3) configured as above generates heat and prints on thermal paper or transfer paper (not shown) held between a platen (not shown).
従来のサーマルヘッドは、以上のように導体リード(2
)がアルミニウム、銅、銀、ニッケル、スズ等の金以外
の電気の良導体で形成されているので実使用での環境状
態で電流と湿度との相乗作用で腐食され初期電気の良導
体であったものが次第に不良導体となりサーマルヘッド
によって印写できなくなるという欠点があった。その部
分まで酸化防止層(5)を延長すれば腐食は防止できる
が、そうすると酸化防止層(5)は絶縁物であるので、
導体リード外部回路との接続が出来なくなり不都合であ
る0
本発明は以上の点に鑑み、導体リードが湿度によって不
良導体となることなく、常に良導体を維持し印写できる
サーマルヘッドを得ることを目的とする。The conventional thermal head has two conductor leads as described above.
) are made of good electrical conductors other than gold, such as aluminum, copper, silver, nickel, and tin, so they corrode due to the synergistic effects of current and humidity in the actual environment, and were initially good electrical conductors. However, it has the disadvantage that it gradually becomes a poor conductor and cannot be printed by a thermal head. Corrosion can be prevented by extending the anti-oxidation layer (5) to that part, but then, since the anti-oxidation layer (5) is an insulator,
In view of the above, the present invention aims to provide a thermal head that can always maintain good conductivity and print without causing the conductor lead to become a bad conductor due to humidity. shall be.
本発明のサーマルヘッドはアルミニウム、銅。 The thermal head of the present invention is made of aluminum and copper.
銀、ニッケル、スズ等で形成された導体リードの露出部
を金属珪化物で覆ったものである。The exposed parts of conductor leads made of silver, nickel, tin, etc. are covered with metal silicide.
本発明における導体リードの露出部は金属珪化物で覆わ
れているため湿度による腐食を防止でき常に外部回路よ
り電力および信号を給電できるので発熱抵抗体で正常な
印写ができる。In the present invention, the exposed portions of the conductor leads are covered with metal silicide to prevent corrosion due to humidity, and since power and signals can always be supplied from an external circuit, normal printing can be performed using the heating resistor.
以下、従来に相当する部分には同一符号を付して示す第
1図の実施例について本発明を説明する。Hereinafter, the present invention will be explained with reference to the embodiment shown in FIG. 1, in which parts corresponding to conventional ones are denoted by the same reference numerals.
図において、(6)は導体リード(2)の露出部を覆っ
た金属珪化物層であり、上記以外の構成は従来と同様で
あるのでその説明を省略する。In the figure, (6) is a metal silicide layer that covers the exposed portion of the conductor lead (2), and the configuration other than the above is the same as the conventional one, so a description thereof will be omitted.
以上のように構成される本発明のサーマルヘッドは、導
体リード(2)がアルミニウム、銅、銀、ニッケル、ス
ズ等の金以外の電気の良導体の表面を耐腐食性の高い金
属珪化物層(6)で覆っであるので、実使用での環境状
態で電流と湿度との相乗作用で金属珪化物層(6)が腐
食されることがないため下部の導体リード(2)も腐食
されることがないため正常な印写ができなくなるという
重大欠陥になること、はない。In the thermal head of the present invention configured as described above, the conductor lead (2) covers the surface of a good electrical conductor other than gold, such as aluminum, copper, silver, nickel, or tin, with a highly corrosion-resistant metal silicide layer ( 6), the metal silicide layer (6) will not be corroded due to the synergistic effect of current and humidity under the actual environmental conditions, so the lower conductor lead (2) will also not be corroded. There is no serious defect such as not being able to print normally due to lack of it.
なお、上記実施例では導体リード(2)および金属珪化
物層(6)を発熱基板(1)の表面だけに形成したもの
を示したが、発熱基板(1)の側面および裏面に形成し
たものでもよい。In addition, in the above example, the conductor lead (2) and the metal silicide layer (6) were formed only on the surface of the heat generating substrate (1), but the conductor lead (2) and the metal silicide layer (6) were formed on the side and back surface of the heat generating substrate (1). But that's fine.
さらに発熱基板(1)に穴を設け、その穴の側面に形成
したものでもよい。金属珪化物層(6)の形成方法とし
ては、印刷法、蒸着法、スパッタリング法。Furthermore, a hole may be provided in the heat-generating substrate (1) and formed on the side surface of the hole. Methods for forming the metal silicide layer (6) include printing, vapor deposition, and sputtering.
イオンプレーティング法等がある。There are ion plating methods, etc.
以上のように、本発明によれば金属珪化物層を導体リー
ドの表面に設けたので、実使用での環境状態で電流と湿
度との相乗作用で導体リードが耐腐食性の高い金属珪化
物層で覆われているため腐食されることがなく正常な印
写を常に行うことができる効果がある。As described above, according to the present invention, since the metal silicide layer is provided on the surface of the conductor lead, the conductor lead becomes a metal silicide layer with high corrosion resistance due to the synergistic effect of current and humidity under the actual environmental conditions. Since it is covered with a layer, it is not corroded and has the effect that normal printing can always be performed.
第1図は本発明の一実施例によるサーマルヘッドを示す
断面側面図、第2図は、従来のサーマルヘッドを示す断
面側面図である。
図において、(1)は発熱基板、(2)は導体リード、
(3)は発熱抵抗体、(4)は抵抗体保護層、(5)は
酸化防止層、(6)は金属珪化物層である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional side view showing a thermal head according to an embodiment of the present invention, and FIG. 2 is a cross-sectional side view showing a conventional thermal head. In the figure, (1) is a heat generating board, (2) is a conductor lead,
(3) is a heating resistor, (4) is a resistor protective layer, (5) is an oxidation prevention layer, and (6) is a metal silicide layer. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (5)
電気の良導体で形成されたパターンを備え、上記導体パ
ターンが酸化防止層で覆われていない部分を金属珪化物
を主成分とする材料で覆つたことを特徴とするサーマル
ヘッド。(1) A heat-generating substrate and a pattern made of a good electrical conductor other than gold formed on the heat-generating substrate, and the portion of the conductive pattern not covered with the anti-oxidation layer is mainly composed of metal silicide. A thermal head characterized by being covered with a material.
する特許請求の範囲第1項に記載のサーマルヘッド。(2) The thermal head according to claim 1, wherein the metal silicide is formed by a printing method.
する特許請求の範囲第1項に記載のサーマルヘッド。(3) The thermal head according to claim 1, wherein the metal silicide is formed by a vapor deposition method.
とを特徴とする特許請求の範囲第1項に記載のサーマル
ヘッド。(4) The thermal head according to claim 1, wherein the metal silicide is formed by a sputtering method.
したことを特徴とする特許請求の範囲第1項に記載のサ
ーマルヘッド。(5) The thermal head according to claim 1, wherein the metal silicide is formed by an ion plating method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60192208A JPS6250162A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60192208A JPS6250162A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6250162A true JPS6250162A (en) | 1987-03-04 |
Family
ID=16287460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60192208A Pending JPS6250162A (en) | 1985-08-29 | 1985-08-29 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6250162A (en) |
-
1985
- 1985-08-29 JP JP60192208A patent/JPS6250162A/en active Pending
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