JPS6249606A - Coil mounting method - Google Patents

Coil mounting method

Info

Publication number
JPS6249606A
JPS6249606A JP60191666A JP19166685A JPS6249606A JP S6249606 A JPS6249606 A JP S6249606A JP 60191666 A JP60191666 A JP 60191666A JP 19166685 A JP19166685 A JP 19166685A JP S6249606 A JPS6249606 A JP S6249606A
Authority
JP
Japan
Prior art keywords
core
coil
soldered
soldering
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60191666A
Other languages
Japanese (ja)
Inventor
Norio Sato
佐藤　憲雄
Sadao Yanaka
谷中　定雄
Riichi Naganuma
長沼　理市
Hiromitsu Ogawa
小川　廣光
Eiji Mishiro
三代　英治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60191666A priority Critical patent/JPS6249606A/en
Publication of JPS6249606A publication Critical patent/JPS6249606A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To improve the adhesion of a core and to prevent the inflow of resin into a winding part by a method wherein metal portions which can be soldered are formed on the core and soldered to soldering patterns of a circuit substrate to be connected and fixed thereto. CONSTITUTION:A conductive metallic paste 4 is baked on a plurality of places on the side of a core 2 whereon it is connected to a circuit substrate 1. A part of the core bearing a coil, on which a winding is not provided but the paste 4 is baked, is connected and fixed to a pattern 11 on the substrate 1 by means of solder 5. Lead wires 6 at both ends of the coil wound on the core 2 are soldered to conductor patterns 12 respectively. By this method, the adhesion of the core 2 is improved, and the inflow of resin into a winding part is prevented.

Description

【発明の詳細な説明】 〔概要〕 コアの回路基板に接続する側の複数箇所に半田付は可能
な金属部分を形成し、基板上の半田付はパターンとを半
田で接続する。[Detailed Description of the Invention] [Summary] Metal parts that can be soldered are formed at multiple locations on the side of the core to be connected to the circuit board, and the solder is connected to the pattern on the board by soldering.

〔産業上の利用分野〕[Industrial application field]

本発明は、コイルの搭載方法に係り、とくに回路基板に
半田付可能な構成としたコイルの搭載方法に関する。The present invention relates to a method for mounting a coil, and particularly to a method for mounting a coil configured to be solderable to a circuit board.

近年、電子回路に用いられるリングコアに巻線を施した
インダクタンス等は、他の電子回路部品と同様に回路基
板に搭載されるようになっているが、この搭載方法は一
般に樹脂系の接着剤で接着されている。ところが使用周
波数の高い電子装置においては回路基板を高周波損失の
少ないセラミック基板が用いられるようになり、従来の
接着剤では強度的および電気的特性等に難点があるので
、このような問題のないコイルの搭載方法の出現が強く
要望されている。In recent years, inductances, which are wire-wound ring cores used in electronic circuits, have come to be mounted on circuit boards like other electronic circuit components, but this mounting method is generally done using resin-based adhesives. It is glued. However, in electronic devices that use high frequencies, ceramic substrates with low high-frequency loss are now being used as circuit boards, and conventional adhesives have drawbacks in terms of strength and electrical properties, so we are developing coils that do not have these problems. There is a strong demand for a new mounting method.

〔従来の技術〕[Conventional technology]

従来のコイルの回路基板への搭載方法は、リングコアに
所定のワイヤを巻回して樹脂系の接着剤で回路基板に接
着し、コイルのリード線を回路基板上に形成した導体パ
ターンに接続する構造である。The conventional method for mounting a coil on a circuit board is to wind a predetermined wire around a ring core, adhere it to the circuit board with a resin adhesive, and connect the coil lead wire to a conductor pattern formed on the circuit board. It is.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来のコイルの搭載方法にあっては、ガラスエボキ
シ樹脂等でなる回路基板への接着にはさほど支障はない
が、使用する周波数が高くなると、高周波損失の少ない
アルミナ基板を用いるので、基板材料と接着剤の膨張係
数差によって強度な接着性が得られない問題があり、さ
らには高周波のコイル部品は小形となり巻線部に樹脂が
流れ込んで電気的特性を悪化させるという問題点があっ
た。With the conventional coil mounting method described above, there is no problem in adhering to a circuit board made of glass epoxy resin, etc., but as the frequency used increases, alumina substrates with low high frequency loss are used, so the board material There was a problem that strong adhesiveness could not be obtained due to the difference in the expansion coefficients of the adhesive and the adhesive, and there was also the problem that high-frequency coil parts became smaller and resin flowed into the windings, worsening the electrical characteristics.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、上記の問題点を解決して強度の接着性を確保
し電気的特性に影響を与えないコイルの搭載方法を提供
するものである。The present invention solves the above-mentioned problems and provides a coil mounting method that ensures strong adhesiveness and does not affect electrical characteristics.

すなわち、コアに半田付は可能な金属部分を形成し、こ
の金属部分を回路基板の半田付はパターンに半田付けし
て接続固定することによって解決される。That is, a metal part that can be soldered is formed on the core, and the soldering of this metal part to the circuit board is solved by soldering the metal part to the pattern and fixing the connection.

〔作用〕[Effect]

上記コイルの搭載方法は、コアの回路基板に接続する側
の複数箇所の半田付は可能な金属部分と回路基板上のパ
ターンとを半田で接続するようにした。The method for mounting the coil is to connect the metal portions of the core that can be soldered at multiple locations on the side connected to the circuit board with the patterns on the circuit board using solder.

〔実施例〕〔Example〕

第１図は、本発明に係るコイルの一実施例を説明する斜
視図である。FIG. 1 is a perspective view illustrating an embodiment of a coil according to the present invention.

図において、フェライトなどの磁性体材料からなるコア
２の回路基板１に接続する側の複数箇所に、導電金属ペ
ースト４を焼付ける。そしてこのコア２にワイヤ３を所
定回数巻回したコイル或いはチップ形コイルである。In the figure, conductive metal paste 4 is baked at multiple locations on the side of the core 2 made of a magnetic material such as ferrite that is connected to the circuit board 1 . The core 2 is a coil or a chip-shaped coil in which a wire 3 is wound a predetermined number of times.

第２図は、本発明の詳細な説明する斜視図で、第１図と
同等の部分については同一符号を付している。FIG. 2 is a perspective view illustrating the present invention in detail, and the same parts as in FIG. 1 are designated by the same reference numerals.

図において、誘電体たとえばアルミナ基板１にコイルを
半田付は固定するパターン１１と、リード線６を半田付
する導体パターン１２を形成したアルミナ基板１上に、
コイルを搭載して巻線されていない部分の導電金属ペー
スト４を焼付けた部分と、パターン１１とを半田５で接
続固定する。そしてコア２に巻線されたコアの両端のリ
ード線６を導体パターン１２に半、田付けする。In the figure, a pattern 11 for soldering and fixing a coil to a dielectric material, for example, an alumina substrate 1, and a conductor pattern 12 for soldering a lead wire 6 are formed on an alumina substrate 1.
The part where the coil is mounted and where the conductive metal paste 4 is baked, which is not wound, and the pattern 11 are connected and fixed with solder 5. Then, the lead wires 6 at both ends of the core 2 wound around the core 2 are soldered to the conductor pattern 12 by soldering.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように、本発明によればリング
コアの接着力が向上するとともに、要部のみ半田付は固
定し、接着樹脂を用いないので従来のように巻線部に樹
脂が流れ込まないので電気的特性に影響を与えず、信頼
性の向上に極めて有効である。As is clear from the above explanation, according to the present invention, the adhesive force of the ring core is improved, and since only the main parts are soldered and fixed, and no adhesive resin is used, resin does not flow into the winding part as in the past. Therefore, it does not affect electrical characteristics and is extremely effective in improving reliability.

なお、導電金属ペーストに限らず、他の半田付は可能な
膜形成手段によることは勿論台まれる。Note that soldering is not limited to the conductive metal paste, and other soldering methods may be used, of course, using any possible film forming means.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明のコイルの一実施を説明する斜視図、 第２図は、本発明の詳細な説明する斜視図である。 図において、１はアルミナ基板、２はコア、３はワイヤ
、４は導電金属ペースト、５は半田、６はリード線、１
１はパターン、１２は導体パターン、をそれぞれ示す。FIG. 1 is a perspective view illustrating one implementation of the coil of the present invention, and FIG. 2 is a perspective view illustrating details of the present invention. In the figure, 1 is an alumina substrate, 2 is a core, 3 is a wire, 4 is a conductive metal paste, 5 is a solder, 6 is a lead wire, 1
1 represents a pattern, and 12 represents a conductor pattern.

Claims (1)

【特許請求の範囲】[Claims] コア（２）に半田付け可能な金属部分（４）を形成し、
該金属部分（４）を回路基板（１）の半田付けパターン
（１１）に半田付けして固定することを特徴とするコイ
ルの搭載方法。forming a solderable metal part (4) on the core (2);
A method for mounting a coil, characterized in that the metal part (4) is fixed by soldering to a soldering pattern (11) of a circuit board (1).
JP60191666A 1985-08-29 1985-08-29 Coil mounting method Pending JPS6249606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60191666A JPS6249606A (en) 1985-08-29 1985-08-29 Coil mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60191666A JPS6249606A (en) 1985-08-29 1985-08-29 Coil mounting method

Publications (1)

Publication Number Publication Date
JPS6249606A true JPS6249606A (en) 1987-03-04

Family

ID=16278434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60191666A Pending JPS6249606A (en) 1985-08-29 1985-08-29 Coil mounting method

Country Status (1)

Country Link
JP (1) JPS6249606A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450918A (en) * 1977-09-30 1979-04-21 Matsushita Electric Ind Co Ltd Iron core manufacture
JPS57126113A (en) * 1981-01-27 1982-08-05 Matsushita Electric Ind Co Ltd Magnetic core
JPS5877009U (en) * 1981-11-19 1983-05-24 神鋼電機株式会社 Laminated core for electrical equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5450918A (en) * 1977-09-30 1979-04-21 Matsushita Electric Ind Co Ltd Iron core manufacture
JPS57126113A (en) * 1981-01-27 1982-08-05 Matsushita Electric Ind Co Ltd Magnetic core
JPS5877009U (en) * 1981-11-19 1983-05-24 神鋼電機株式会社 Laminated core for electrical equipment

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