JPS6248594B2 - - Google Patents
Info
- Publication number
- JPS6248594B2 JPS6248594B2 JP56173919A JP17391981A JPS6248594B2 JP S6248594 B2 JPS6248594 B2 JP S6248594B2 JP 56173919 A JP56173919 A JP 56173919A JP 17391981 A JP17391981 A JP 17391981A JP S6248594 B2 JPS6248594 B2 JP S6248594B2
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- individual
- insulating substrate
- terminal
- individual electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- 238000007650 screen-printing Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】
この発明は感熱紙の印字に用いるサーマルヘツ
ドの構成に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a thermal head used for printing on thermal paper.
絶縁性基板上に形成された2つの電極の間に接
続された抵抗体に電圧を印加し、この抵抗体を発
熱させて数字、文字、記号などを感熱紙に熱印字
するように構成したサーマルヘツドでは、生産性
が良く且つ高精度のものが要求される。 A thermal printer that applies voltage to a resistor connected between two electrodes formed on an insulating substrate, causes the resistor to generate heat, and thermally prints numbers, letters, symbols, etc. on thermal paper. The head is required to have good productivity and high precision.
従来用いられているサーマルヘツドの平面図を
第1図に示す。図において、1はセラミツクなど
よりなる絶縁性基板、2は抵抗体3の共通電極を
構成する共通電極導体、4は発熱抵抗体3a〜3
cに対応した個別電極導体である。 FIG. 1 shows a plan view of a conventionally used thermal head. In the figure, 1 is an insulating substrate made of ceramic or the like, 2 is a common electrode conductor constituting the common electrode of the resistor 3, and 4 is the heating resistor 3a to 3.
It is an individual electrode conductor corresponding to c.
共通電極導体2、抵抗体3、個別電極導体4は
夫々導電性ペースト、抵抗性ペースト、導電性ペ
ーストを用いてスクリーン印刷などの手法により
形成される。このように構成されたサーマルヘツ
ドにおいては、共通電極導体2と個別電極導体4
に所定のパルス電圧を印加して発熱抵抗体3a〜
3cを発熱させて抵抗体3に接してその上方に配
置された感熱紙(図示省略)に印字する。 The common electrode conductor 2, the resistor 3, and the individual electrode conductor 4 are formed using a conductive paste, a resistive paste, and a conductive paste, respectively, by a method such as screen printing. In the thermal head configured in this way, the common electrode conductor 2 and the individual electrode conductors 4
By applying a predetermined pulse voltage to the heating resistors 3a~
3c generates heat and prints on thermal paper (not shown) placed above and in contact with the resistor 3.
従来のサーマルヘツドは以上のように構成され
ているので、例えば1mmの間に6個ないし8個の
発熱抵抗体3を形成しようとすると、極めて高い
印刷精度が要求されると共に抵抗値のバラツキな
どの問題からサーマルヘツドの歩留りが悪く、ま
た抵抗体の印刷成形において、中央部が凹状にな
り、その周辺部がだれて印字パターンが悪くなる
こと、さらに各々の発熱抵抗体の温度上昇に時間
を要するなどの欠点があつた。 Conventional thermal heads are constructed as described above, so if you try to form, for example, 6 to 8 heating resistors 3 within a 1 mm space, extremely high printing accuracy is required and variations in resistance values occur. Due to this problem, the yield of thermal heads is poor, and when printing resistors, the center part becomes concave and the peripheral part sag, resulting in poor printing patterns.Furthermore, it takes time for the temperature of each heating resistor to rise. There were some drawbacks, such as the need for
この発明は上記のような従来のものの欠点を鑑
みてなされたもので、絶縁基板、この絶縁基板面
上に配設され電源の一方の出力端子に選択的に接
続される複数の個別電極、上記絶縁基板面上に上
記複数の個別電極と間隙をもつて対向し、複数の
個別電極の群を取り囲むように配設され、上記電
源の他方の出力端子に接続されるコ字状共通電
極、および上記複数の個別電極と上記間隙を形成
する上記絶縁基板面と上記共通電極と、各個別電
極間の間〓の絶縁基板面と終端個別電極および共
通電極終端部間の間隙の絶縁基板面とを少なくと
も上記間〓部で一体となつて覆うように形成され
た抵抗体層を備え、上記終端個別電極と共通電極
終端部間の抵抗値をR32上記個別電極間の抵抗値
をR31、上記各個別電極と共通電極間の抵抗値を
R30とするとき、R31=R30/2、R32=R30、各個
別電極と共通電極間の抵抗値が等しいものを用い
ることにより、印字性能を向上させたサーマルヘ
ツドの提供を目的としている。 The present invention has been made in view of the drawbacks of the conventional products as described above, and includes an insulating substrate, a plurality of individual electrodes disposed on the surface of the insulating substrate and selectively connected to one output terminal of a power source, and the above-described invention. a U-shaped common electrode that is arranged on an insulating substrate surface to face the plurality of individual electrodes with a gap, surround a group of the plurality of individual electrodes, and is connected to the other output terminal of the power source; The insulating substrate surface forming the gap with the plurality of individual electrodes, the common electrode, the insulating substrate surface between the individual electrodes and the insulating substrate surface in the gap between the terminal individual electrode and the terminal end of the common electrode. A resistor layer is formed so as to integrally cover at least the intermediate portion, and the resistance value between the terminal individual electrode and the common electrode terminal portion is R 32 and the resistance value between the individual electrodes is R 31 . The resistance value between each individual electrode and the common electrode is
When R 30 , R 31 = R 30 /2, R 32 = R 30 , and the purpose is to provide a thermal head with improved printing performance by using the same resistance value between each individual electrode and the common electrode. It is said that
以下、この発明の一実施例を第2図および第3
図について説明する。第2図において、1はセラ
ミツクなどの材料よりなる絶縁性基板、20は共
通電極導体、20aは共通電極導体20の終端
部、40は個別電極導体、30は個別電極導体4
0と共通電極導体20との間に形成された帯状の
抵抗体層、30a〜30eは発熱抵抗体、31は
隣接する個別電極導体40の間に形成された補助
抵抗体、32は個別電極導体40の両端部と共通
電極導体20の終端部20aとの間に形成された
終端抵抗体である。共通電極導体20および個別
電極導体40は導電性ペーストを用い、抵抗体層
30は抵抗ペーストを用いてスクリーン印刷など
の手法で形成される。 An embodiment of the present invention will be described below with reference to FIGS. 2 and 3.
The diagram will be explained. In FIG. 2, 1 is an insulating substrate made of a material such as ceramic, 20 is a common electrode conductor, 20a is the terminal end of the common electrode conductor 20, 40 is an individual electrode conductor, and 30 is an individual electrode conductor 4.
0 and the common electrode conductor 20, 30a to 30e are heating resistors, 31 is an auxiliary resistor formed between adjacent individual electrode conductors 40, and 32 is an individual electrode conductor. 40 and the terminal end 20a of the common electrode conductor 20. The common electrode conductor 20 and the individual electrode conductors 40 are formed using a conductive paste, and the resistor layer 30 is formed using a resistive paste by a method such as screen printing.
このような構成にすると、抵抗体30は所定寸
法で帯状に形成すればよく、製造工程が簡単で発
熱抵抗体部の抵抗値バラツキを小さく出来ると共
に抵抗体層30の形状が帯状である事からスクリ
ーン印刷効果によつて発熱抵抗体30の中央部が
平坦になり、良好な印字性能が得られる。 With this configuration, the resistor 30 only needs to be formed into a band shape with predetermined dimensions, the manufacturing process is simple, and the variation in resistance value of the heating resistor portion can be reduced, and the shape of the resistor layer 30 is band-shaped. Due to the screen printing effect, the central portion of the heating resistor 30 becomes flat, and good printing performance can be obtained.
第3図は第2図に示したサーマルヘツドの電気
的等価回路で、R30a〜R30e,R31,R32は夫々発
熱抵抗体30a〜30e、補助抵抗体31、終端
抵抗体32の抵抗値である。C20およびC40は夫々
共通電極導体20および個別電極導体40に対応
する端子である。 FIG. 3 is an electrical equivalent circuit of the thermal head shown in FIG. 2, where R 30a to R 30e , R 31 , and R 32 are the resistances of the heating resistors 30a to 30e, the auxiliary resistor 31, and the terminating resistor 32, respectively. It is a value. C 20 and C 40 are terminals corresponding to the common electrode conductor 20 and the individual electrode conductor 40, respectively.
この発明において、R31=R30/2、R32=R30、
R30a=R30b=R30c=R30d=R30e=R30であるの
で、各端子a〜eと端子C20との間の抵抗値はい
ずれもR30/3となる。すなわち、各端子a〜e
より右側および左側を見た抵抗値はいずれもR30
となり、R31=R30/2であることから、各発熱抵
抗体にかかる電圧が実質的に同じになり均質な印
字が得られる。端子aと端子C20との間に電圧Va
を印加すると、端子C20と各端子b〜eとの間に
印加される電圧は夫々Va/2,Va/4,Va/
8,Va/16となる。端子bと端子C20との間に電
圧Vbを印加してR30bを発熱させて感熱紙に印字
する場合を考えてみると、R30bの消費電力はVb
2/R30、端子aおよびcと端子C20との間に印加
される電圧はいずれもVb/2となるのでR30bの
隣接抵抗体R30aおよびR30cの消費電力はいずれ
も1/4・Vb 2/R30となり、一方、端子aとb、
および端子
bとcとの間に形成されるR31の消費電力はいず
れも1/8・Vb 2/R30となる。R30bに隣接する
R30aおよび
R30c、端子bと隣接する端子aおよびcとの間
に接続されるR31に印加される電力がR30bのそれ
に比べて十分小さいので感熱紙の印字可能電力に
至らず、したがつて所定の抵抗体のみに印字する
事ができる。 In this invention, R 31 =R 30 /2, R 32 =R 30 ,
Since R 30a = R 30b = R 30c = R 30d = R 30e = R 30 , the resistance values between each terminal a to e and terminal C 20 are all R 30 /3. That is, each terminal a to e
Resistance values looking to the right and left are both R 30
Since R 31 =R 30 /2, the voltage applied to each heating resistor becomes substantially the same, resulting in homogeneous printing. Voltage V a between terminal a and terminal C 20
is applied, the voltages applied between terminal C 20 and each terminal b to e are V a /2, V a /4, and V a /, respectively.
8, V a /16. Considering the case where a voltage V b is applied between terminal b and terminal C 20 to cause R 30b to generate heat and print on thermal paper, the power consumption of R 30b is V b
2 /R 30 , the voltages applied between terminals a and c and terminal C 20 are both V b /2, so the power consumption of resistors R 30a and R 30c adjacent to R 30b are both 1/2. 4・V b 2 /R 30 , while terminals a and b,
And the power consumption of R 31 formed between terminals b and c is 1/8·V b 2 /R 30 . Since the power applied to R 30a and R 30c adjacent to R 30b and R 31 connected between terminal b and adjacent terminals a and c are sufficiently small compared to that of R 30b , the power that can be printed on thermal paper is Therefore, it is possible to print only on predetermined resistors.
端子aあるいはeと端子C20との間に電圧を印
加して、R30a又はR30eを発熱させる場合には、
R32にはR30a又はR30eと同じ電力が印加されるの
で、R30aあるいはR30eに相当する抵抗体上に配
置された感熱紙に独立した印字ができない。しか
しながら、端子aおよびeを電圧印加端子とせず
に非電圧印加端子とすれば全く問題なく、独立し
た印字ができる。 When applying a voltage between terminal a or e and terminal C 20 to cause R 30a or R 30e to generate heat,
Since the same power as R 30a or R 30e is applied to R 32 , independent printing cannot be performed on the thermal paper placed on the resistor corresponding to R 30a or R 30e . However, if terminals a and e are used as non-voltage application terminals instead of voltage application terminals, independent printing can be performed without any problem.
上記説明のように、この発明においてR31=
R30/2、R32=R30としたので、R31の消費電力を
少なくでき、感熱紙の印字ニジミを小さく出来
る。 As explained above, in this invention R 31 =
Since R 30 /2 and R 32 = R 30 , the power consumption of R 31 can be reduced and printing blur on thermal paper can be reduced.
以上、述べたように、この発明によれば、絶縁
基板、この絶縁基板面上に配設され電源の一方の
出力端子に選択的に接続される複数の個別電極、
上記絶縁基板面上に上記複数の個別電極と間〓を
もつて対向し、複数の個別電極の群を取り囲むよ
うに配設され、上記電源の他方の出力端子に接続
されるコ字状共通電極、および上記複数の個別電
極と上記間〓を形成する上記絶縁基板面と上記共
通電極と、各個別電極間の間〓の絶縁基板面と、
終端個別電極および共通電極終端部間の間〓の絶
縁自板面とを少なくとも上記間〓部で一体となつ
て覆うように形成された抵抗体層を備え、上記終
端個別電極と共通電極終端部間の抵抗値をR33上
記個別電極間の抵抗値をR31、上記各個別電極と
共通電極間の抵抗値をR30とするとき、R31=
R30/2、R32=R30、各個別電極と共通電極間の
抵抗値が等しいものを用いているので、製造工程
が簡単で抵抗値のバラツキが少なく、また抵抗体
層の発熱抵抗体部の中央部が凹状にならず印字性
能がよくなるとともに、印字ニジミが少なく、均
質な印字が得られるなどの効果がある。 As described above, according to the present invention, an insulating substrate, a plurality of individual electrodes disposed on the surface of the insulating substrate and selectively connected to one output terminal of a power source,
A U-shaped common electrode is disposed on the surface of the insulating substrate, facing the plurality of individual electrodes with a distance therebetween, surrounding the group of the plurality of individual electrodes, and connected to the other output terminal of the power source. , and the insulating substrate surface forming the space between the plurality of individual electrodes and the common electrode, and the insulating substrate surface between the individual electrodes,
a resistor layer formed so as to integrally cover the insulating self-plate surface between the terminal individual electrode and the common electrode terminal part at least in the said intervening part; When the resistance value between the individual electrodes is R 33 , the resistance value between the individual electrodes is R 31 , and the resistance value between each individual electrode and the common electrode is R 30 , R 31 =
R 30 /2, R 32 = R 30 , since the resistance value between each individual electrode and the common electrode is the same, the manufacturing process is simple, there is little variation in resistance value, and the heating resistor in the resistor layer The printing performance is improved because the central part of the print area does not become concave, and there are fewer bleeds in the print, resulting in more uniform print.
第1図は従来のサーマルヘツドを示す平面図、
第2図はこの発明の一実施例によるサーマルヘツ
ドを示す平面図、第3図は第2図に示したサーマ
ルヘツドの電気的等価回路図である。
1は絶縁基板、2,20は共通電極、30は抵
抗体層、3a〜3c,30a〜30eは発熱抵抗
体部、31は補助抵抗体部、32は終端抵抗体、
40は個別電極、20aは終端部を示す。なお、
図中、同一符号は同一又は相当する部分を示す。
Figure 1 is a plan view showing a conventional thermal head.
FIG. 2 is a plan view showing a thermal head according to an embodiment of the present invention, and FIG. 3 is an electrical equivalent circuit diagram of the thermal head shown in FIG. 2. 1 is an insulating substrate, 2 and 20 are common electrodes, 30 is a resistor layer, 3a to 3c, 30a to 30e are heating resistor parts, 31 is an auxiliary resistor part, 32 is a terminating resistor,
40 is an individual electrode, and 20a is a terminal end. In addition,
In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
の一方の出力端子に選択的に接続される複数の個
別電極、上記絶縁基板面上に上記複数の個別電極
と間〓をもつて対向し、複数の個別電極の群を取
り囲むように配設され、上記電源の他方の出力端
子に接続されるコ字状共通電極、および上記複数
の個別電極と上記間〓を形成する上記絶縁基板面
と上記共通電極と、各個別電極間の間〓の絶縁基
板面と、終端個別電極および共通電極終端部間の
間〓の絶縁基板面とを少なくとも上記間〓部で一
体となつて覆うように形成された抵抗体層を備
え、上記終端個別電極と共通電極終端部間の抵抗
値をR32上記個別電極間の抵抗値をR31、上記各個
別電極と共通電極間の抵抗値をR30とするとき、
R31=R30/2、R32=R30、各個別電極と共通電極
間の抵抗が等しいサーマルヘツド。1. An insulating substrate, a plurality of individual electrodes disposed on the surface of the insulating substrate and selectively connected to one output terminal of the power source, and a plurality of individual electrodes disposed on the surface of the insulating substrate, facing the plurality of individual electrodes with a gap between them. , a U-shaped common electrode arranged to surround a group of a plurality of individual electrodes and connected to the other output terminal of the power source, and the insulating substrate surface forming a space between the plurality of individual electrodes and the The surface of the insulating substrate between the common electrode and each individual electrode, and the surface of the insulating substrate between the terminating individual electrode and the terminal end of the common electrode are integrally formed to cover at least the terminating portion of the common electrode. The resistance value between the terminal individual electrode and the terminal end of the common electrode is R 32 The resistance value between the individual electrodes is R 31 , and the resistance value between each of the individual electrodes and the common electrode is R 30 . and when,
R 31 = R 30 /2, R 32 = R 30 , thermal head with equal resistance between each individual electrode and the common electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56173919A JPS5874375A (en) | 1981-10-29 | 1981-10-29 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56173919A JPS5874375A (en) | 1981-10-29 | 1981-10-29 | Thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5874375A JPS5874375A (en) | 1983-05-04 |
JPS6248594B2 true JPS6248594B2 (en) | 1987-10-14 |
Family
ID=15969501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56173919A Granted JPS5874375A (en) | 1981-10-29 | 1981-10-29 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5874375A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5021736A (en) * | 1973-06-25 | 1975-03-07 |
-
1981
- 1981-10-29 JP JP56173919A patent/JPS5874375A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5021736A (en) * | 1973-06-25 | 1975-03-07 |
Also Published As
Publication number | Publication date |
---|---|
JPS5874375A (en) | 1983-05-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4343833A (en) | Method of manufacturing thermal head | |
US3961155A (en) | Thermal printing element arrays | |
JPS59227101A (en) | Thick film resistor | |
JPS6248594B2 (en) | ||
JPS5867474A (en) | Thermal head | |
JPH07108694A (en) | Thermal head, and printer using the head | |
JPS6213367A (en) | Thermal head | |
JPH0239955A (en) | Thermal head | |
JPS60192658A (en) | Thick film type thermal head | |
JPH01286864A (en) | Thermal head | |
JPS6242467Y2 (en) | ||
JP2929649B2 (en) | Thermal head and method of manufacturing the same | |
JPS6016353B2 (en) | Thermal head manufacturing method | |
JP2001246770A (en) | Thermal print head and method of making the same | |
JPH04338556A (en) | Thermal printing head | |
JP3320151B2 (en) | Thermal print head | |
JPH0550630A (en) | Thermal head and manufacture thereof | |
JPS6248572A (en) | Thermal head | |
JP3114057B2 (en) | Thermal stamp head | |
JPS63267568A (en) | Manufacture of thermal head | |
JP2519399Y2 (en) | Thermal head array structure | |
JP2554556B2 (en) | Thermal print head | |
JPS61287766A (en) | Thermal printing head | |
JPS61293871A (en) | Thin film type thermal head | |
JPS62236763A (en) | Plane thermal head |