JPS6247980U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例によるバーンイン
用ソケツトの断面図、第２図は第１図のソケツト
に半導体装置を挿入し高温での状態を示す断面図
、第３図は従来のバーンイン用ソケツトの断面図
、第４図は第３図のソケツトに半導体装置を挿入
した状態を示す断面図である。 １…絶縁基体、５…半導体装置、６…リード、
１１，１２…接触片、１３…接触部。なお、図中
同一符号は同一又は相当部分を示す。 Fig. 1 is a cross-sectional view of a burn-in socket according to an embodiment of this invention, Fig. 2 is a cross-sectional view showing the state at high temperature when a semiconductor device is inserted into the socket of Fig. 1, and Fig. 3 is a conventional burn-in socket. FIG. 4 is a cross-sectional view of the socket, showing a state in which a semiconductor device is inserted into the socket of FIG. DESCRIPTION OF SYMBOLS 1... Insulating base, 5... Semiconductor device, 6... Lead,
11, 12...Contact piece, 13...Contact part. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 対向面により接触部を形成する１対宛の接触片
が絶縁基体に複数個所に埋込み支持されており、
半導体装置のリードが上記接触片間の接触部に差
込まれ通電されるようにしたソケツトにおいて、
上記１対の接触片のうち少なくともその一方は形
状記憶合金からなり、常温では上記接触部を開い
た形状をなしており、所定の上昇温度では接触部
を閉じた形状になるようにしたことを特徴とする
バーンイン用ソケツト。 A pair of contact pieces forming a contact portion by opposing surfaces are embedded and supported at multiple locations in the insulating base,
In a socket in which a lead of a semiconductor device is inserted into a contact portion between the contact pieces and is energized,
At least one of the pair of contact pieces is made of a shape memory alloy, and the contact portion has an open shape at normal temperature, and the contact portion has a closed shape at a predetermined temperature rise. Features a burn-in socket.