JPS6242245U - - Google Patents
Info
- Publication number
- JPS6242245U JPS6242245U JP13245285U JP13245285U JPS6242245U JP S6242245 U JPS6242245 U JP S6242245U JP 13245285 U JP13245285 U JP 13245285U JP 13245285 U JP13245285 U JP 13245285U JP S6242245 U JPS6242245 U JP S6242245U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- stamping
- head
- marking
- stamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
Description
第１図はこの考案の半導体ＩＣ捺印装置の一実
施例を示し、Ａは一部省略の正面図、Ｂは側断面
図、第２図は従来の装置を示し、Ａは一部省略の
正面図、Ｂは側断面図である。
１……捺印ヘツド、２……ゴム印、４……半導
体ＩＣ、８……イジエクトピン、９……スプリン
グ。
Fig. 1 shows an embodiment of the semiconductor IC marking device of this invention, A is a partially omitted front view, B is a side sectional view, and Fig. 2 is a conventional device, A is a partially omitted front view. Figure B is a side sectional view. 1... Stamp head, 2... Rubber stamp, 4... Semiconductor IC, 8... Eject pin, 9... Spring.
Claims (1)
ヘツドが下降することにより、その捺印ヘツドの
下面に設けたゴム印で半導体ＩＣに対して捺印を
施すようにした半導体ＩＣ捺印装置において、 (b) 前記捺印ヘツドの下面に、突出する方向に
スプリング力が付与された出没自在なイジエクト
ピンを、ヘツド下降時、前記捺印位置の半導体Ｉ
Ｃ上面に先端が当接するように設けたことを特徴
とする半導体ＩＣ捺印装置。[Scope of Claim for Utility Model Registration] (a) By lowering the stamping head onto the semiconductor IC transported to the stamping position, a rubber stamp provided on the underside of the stamping head is used to stamp the semiconductor IC. In the semiconductor IC marking device, (b) a retractable eject pin to which a spring force is applied in the projecting direction is attached to the lower surface of the marking head, and when the head is lowered, the semiconductor IC at the marking position is moved.
1. A semiconductor IC stamping device, characterized in that the tip is provided so as to come into contact with the upper surface of the semiconductor IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13245285U JPS6242245U (en) | 1985-08-31 | 1985-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13245285U JPS6242245U (en) | 1985-08-31 | 1985-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242245U true JPS6242245U (en) | 1987-03-13 |
Family
ID=31031848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13245285U Pending JPS6242245U (en) | 1985-08-31 | 1985-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242245U (en) |
-
1985
- 1985-08-31 JP JP13245285U patent/JPS6242245U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6242245U (en) | ||
| JPS6171433U (en) | ||
| JPH02135190U (en) | ||
| JPS59132912U (en) | sliding mechanism | |
| JPH0199067U (en) | ||
| JPH03126594U (en) | ||
| JPS6394740U (en) | ||
| JPS6334535U (en) | ||
| JPS59106639U (en) | mold lift device | |
| JPS6261436U (en) | ||
| JPH0231773U (en) | ||
| JPS62115274U (en) | ||
| JPS6394738U (en) | ||
| JPS639787U (en) | ||
| JPH0287600U (en) | ||
| JPS61200610U (en) | ||
| JPS6196633U (en) | ||
| JPS6394739U (en) | ||
| JPS63170193U (en) | ||
| JPS6060305U (en) | Spike pin with retractable mechanism for spiked tires | |
| JPS63106199U (en) | ||
| JPS6220716U (en) | ||
| JPS63184643U (en) | ||
| JPS6336927U (en) | ||
| JPH0381386U (en) |