JPS6241578U - - Google Patents

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Publication number
JPS6241578U
JPS6241578U JP13393585U JP13393585U JPS6241578U JP S6241578 U JPS6241578 U JP S6241578U JP 13393585 U JP13393585 U JP 13393585U JP 13393585 U JP13393585 U JP 13393585U JP S6241578 U JPS6241578 U JP S6241578U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
laminated
card
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13393585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13393585U priority Critical patent/JPS6241578U/ja
Publication of JPS6241578U publication Critical patent/JPS6241578U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実施例を示すもので、第１図は
第２図Ａ―Ａ線に於けるＩＣカードの断面図、第
２図はＩＣカードの平面図、第３図はＩＣモジユ
ールの平面図、第４図は薄板の平面図である。 １……ＩＣカード、５……磁気ストライプ、１
０……センターコア、１２，１４，１６，１８，
２０，２２……シート、４０……ＩＣモジユール
、４２……プリント基板、４４……ＩＣチツプ、
４８……端子、５０，６０……薄板。 The drawings show an embodiment of the present invention; FIG. 1 is a sectional view of the IC card taken along the line A-A in FIG. 2, FIG. 2 is a plan view of the IC card, and FIG. 3 is a plan view of the IC module. FIG. 4 is a plan view of the thin plate. 1...IC card, 5...magnetic stripe, 1
0...Center core, 12, 14, 16, 18,
20, 22... Sheet, 40... IC module, 42... Printed circuit board, 44... IC chip,
48... terminal, 50, 60... thin plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の一方にＩＣチツプが取付けられ
、他方に端子の形成されたＩＣモジユールを含む
ＩＣカードに於いて、ＩＣチツプを充分カバーす
る広さの金属薄板がその両側に積層され、かつプ
リント基板と接する薄板はプラスチツク材料のス
ペーサーシートを介して積層されていることを特
色とするＩＢカード。 In an IC card that includes an IC module with an IC chip attached to one side of a printed circuit board and a terminal formed on the other side, thin metal plates large enough to cover the IC chip are laminated on both sides, and the printed circuit board and An IB card characterized in that the contacting thin plates are laminated with a spacer sheet of plastic material interposed therebetween.
JP13393585U 1985-08-31 1985-08-31 Pending JPS6241578U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13393585U JPS6241578U (en) 1985-08-31 1985-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13393585U JPS6241578U (en) 1985-08-31 1985-08-31

Publications (1)

Publication Number Publication Date
JPS6241578U true JPS6241578U (en) 1987-03-12

Family

ID=31034703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13393585U Pending JPS6241578U (en) 1985-08-31 1985-08-31

Country Status (1)

Country Link
JP (1) JPS6241578U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128883A (en) * 1987-11-14 1989-05-22 Toshiba Corp Portable medium
WO1999032304A1 (en) * 1997-12-22 1999-07-01 Hitachi, Ltd. Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128883A (en) * 1987-11-14 1989-05-22 Toshiba Corp Portable medium
WO1999032304A1 (en) * 1997-12-22 1999-07-01 Hitachi, Ltd. Semiconductor device

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