JPS624128A - Automatic separation and feed mechanism in semiconductor element manufacture - Google Patents
Automatic separation and feed mechanism in semiconductor element manufactureInfo
- Publication number
- JPS624128A JPS624128A JP14180485A JP14180485A JPS624128A JP S624128 A JPS624128 A JP S624128A JP 14180485 A JP14180485 A JP 14180485A JP 14180485 A JP14180485 A JP 14180485A JP S624128 A JPS624128 A JP S624128A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor element
- stopper
- succeeding
- automatic separation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体素子の製造における自動分離供給機構に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an automatic separation and supply mechanism in the manufacture of semiconductor devices.
従来、半導体素子１の自白落下における分離供給方式は
第３図に示すように前ストッパ３によって最前列の半導
体素子１αを停止させる０次に第４図に示すように後ス
トッパ４によって後続の半導体素子１ｂを押さえて停止
させると同時に前ストッパ３を上昇させる。これにより
最前列の半導体素子１のみを分離落下させ、この様な第
３，４図に示す動作を交互に繰り返すことにより半導体
素子１を間欠的に連続して分離供給していた。Conventionally, the separation and supply method when the semiconductor element 1 falls freely is to stop the semiconductor element 1α in the front row by a front stopper 3 as shown in FIG. The front stopper 3 is raised at the same time as the element 1b is held down and stopped. As a result, only the semiconductor elements 1 in the front row were separated and dropped, and by repeating the operations shown in FIGS. 3 and 4 alternately, the semiconductor elements 1 were separated and supplied intermittently and continuously.
従来の方法によれば、第２図（５）、ａ３）に示すよう
に半導体素子１のモールド封止工程において発生する樹
脂バリ２が第５図に示すように供給レール５上の分離機
構で重なり合った場合、後ストッパ４で後続の半導体素
子１ｂを押しつけることにより樹脂バリ２で最前列の半
導体素子１αが固定され分離供給できないという欠点が
あった。According to the conventional method, resin burrs 2 generated during the mold sealing process of the semiconductor element 1 as shown in FIG. 2(5), a3) are removed by the separation mechanism on the supply rail 5 as shown in FIG. If they overlap, the rear stopper 4 presses the succeeding semiconductor element 1b, and the semiconductor element 1α in the front row is fixed by the resin burr 2, resulting in a drawback that separate supply cannot be performed.
この欠点を解決するために、第６図に示すように供給レ
ール５に段差５αを設けることで後ストツパ４によって
押さえられる半導体素子１ｂの樹脂バリ２の影響を回避
する方法がある。この方式は多種多様な半導体素子１の
品種が変わることにより、全長も変わるため供給レール
５０段差がそれぞれの長さに対応できない。In order to solve this problem, there is a method of avoiding the influence of the resin burr 2 on the semiconductor element 1b held down by the rear stopper 4 by providing a step 5α on the supply rail 5 as shown in FIG. In this system, as the variety of semiconductor elements 1 changes, the total length also changes, so the difference in level of the supply rail 50 cannot correspond to each length.
従来方法による品種対応は半導体素子１の長さが変わる
たびに長さに応じて段差をつけた供給レール５を交換し
なければならず、品種切り換えに多大に時間を要すると
いう欠点があった。The conventional method of adapting to different types has the drawback that each time the length of the semiconductor element 1 changes, the supply rail 5, which has a step depending on the length, must be replaced, and it takes a lot of time to change the type.
本発明は前記問題点を解消するもので、半導体素子の樹
脂パリの影響を受けずに個々に分離する自動分離機構を
提供するものである。The present invention solves the above problems and provides an automatic separation mechanism that separates semiconductor devices individually without being affected by resin particles.
本発明は相前後して滑走させる半導体素子の搬送路を前
ストッパで閉じ一旦半導体素子の流れを停止させ、最前
列の半導体素子を残して後続の半導体素子を後ストッパ
で押圧しその動きを規制し、次に前ストッパを開いて最
前列の半導体素子のみを滑走させる操作を繰り返し行い
半導体素子を個々に分離する自動分離供給機構において
、最前列の半導体素子に続く後続の半導体素子の停止位
置に、滑走により後続半導体素子の前側が乗り上げて該
素子の前記を最前列半導体素子の後端より上方に押し上
げる突起物を設けたことを特徴とする半導体素子製造に
おける自動分離供給機構である。In the present invention, a front stopper closes the conveyance path for semiconductor elements that are slid one after the other to temporarily stop the flow of semiconductor elements, and the rear stopper presses the succeeding semiconductor elements, leaving the semiconductor elements in the front row, to restrict their movement. Then, in an automatic separation and supply mechanism that repeatedly opens the front stopper and slides only the semiconductor chips in the front row, the semiconductor chips are separated into individual semiconductor chips. An automatic separation and supply mechanism for manufacturing semiconductor devices is provided with a protrusion that slides on the front side of a succeeding semiconductor device and pushes the front side of the device upwardly above the rear end of the front-row semiconductor device.
次に本発明の実施例を図により説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図に示すように、供給レール５において、最前列の
半導体素子１αに続く後続の半導体素子１ｂの停止位置
に突起物６を設け、前ストッパ３が上昇して後ストッパ
４が半導体素子１ｂを供給レール５に押しつけることに
よシ、半導体素子１αの先端を押し上げ、樹脂バリ２の
影響を回避するものである。また突起物６、前ストッパ
３、後ストッパ４を矢印Ａ、Ｂ、Ｃ方向に変位させて任
意の位置に設定することにより、長さの異なる品種にも
半導体素子１の先端持上り量を任意の量に設定し、他品
種にも共用性を持たせるようにしても良い。As shown in FIG. 1, on the supply rail 5, a protrusion 6 is provided at the stop position of the semiconductor device 1b following the semiconductor device 1α in the front row, so that the front stopper 3 is raised and the rear stopper 4 is stopped when the semiconductor device 1b is stopped. By pressing it against the supply rail 5, the tip of the semiconductor element 1α is pushed up and the influence of the resin burr 2 is avoided. In addition, by displacing the protrusion 6, front stopper 3, and rear stopper 4 in the directions of arrows A, B, and C and setting them at arbitrary positions, the amount of lifting of the tip of the semiconductor element 1 can be adjusted arbitrarily even for products with different lengths. It is also possible to set it to the amount of , so that it can be used in common with other varieties.
本発明は供給レール５にあらかじめ設けられた突起物６
があるため、後ストッパ４により供給レール５に押しつ
けられた時、後続の半導体素子１ｂの先端が持ち上がる
ので、樹脂バリ２の影響をうけずに安定した分離供給を
行うことができる。また供給レール５上の突起物６、前
ストッパ３、後ストッパ４の設定位置を任意に選ぶこと
により、長さの異なる他品種半導体素子１の先端持上り
量を任意の景に設定でき、他品種との共用性も簡単に対
応できる効果を有するものである。The present invention provides a projection 6 provided in advance on the supply rail 5.
Therefore, when the semiconductor element 1b is pressed against the supply rail 5 by the rear stopper 4, the tip of the succeeding semiconductor element 1b is lifted, so that stable separation and supply can be performed without being affected by the resin burr 2. In addition, by arbitrarily selecting the setting positions of the protrusion 6 on the supply rail 5, the front stopper 3, and the rear stopper 4, it is possible to set the tip lifting amount of semiconductor devices 1 of other types with different lengths to any desired value. It also has the effect of being easily compatible with other types of products.
第１図は本発明の実施例を示す正面図、第２図（５）は
半導体素子の正面図、ＣＢ）は同側面図、第３図。
第４図は分離供給の基本動作を示す図、第５図は樹脂パ
リによる影響を示す図、第６図は従来の解決方法を示す
図である。
ｌｃＬ、 ｌｂ・・・半導体素子 ２・・・樹脂パリ
３・・・前ストッパ ４・・・後ストッパ５・°
・供給レール ６・・・突起物特許出願人 九
州日本電気株式会社
（Ａ）
第２図
第４図FIG. 1 is a front view showing an embodiment of the present invention, FIG. 2 (5) is a front view of a semiconductor element, CB) is a side view of the same, and FIG. FIG. 4 is a diagram showing the basic operation of separation and supply, FIG. 5 is a diagram showing the influence of resin paris, and FIG. 6 is a diagram showing a conventional solution. lcL, lb...Semiconductor element 2...Resin pad 3...Front stopper 4...Rear stopper 5.°
・Supply rail 6...Protrusion patent applicant Kyushu NEC Co., Ltd. (A) Figure 2 Figure 4
Claims (1)
トッパで閉じ一旦半導体素子の流れを停止させ、最前列
の半導体素子を残して後続の半導体素子を後ストッパで
押圧しその動きを規制し、次に前ストッパを開いて最前
列の半導体素子のみを滑走させる操作を繰り返し行い半
導体素子を個々に分離する自動分離供給機構において、
最前列の半導体素子に続く後続の半導体素子の停止位置
に、滑走により後続半導体素子の前側が乗り上げ該素子
の前端を最前列半導体素子の後端より上方に押し上げる
突起物を設けたことを特徴とする半導体素子製造におけ
る自動分離供給機構。(1) A front stopper closes the conveyance path for semiconductor elements that are slid back and forth, and the flow of semiconductor elements is temporarily stopped, and the rear stopper presses the succeeding semiconductor elements, leaving the semiconductor elements in the front row, to restrict their movement. In an automatic separation and supply mechanism that separates semiconductor devices individually by repeatedly opening the front stopper and sliding only the semiconductor devices in the front row,
A protrusion is provided at the stop position of the succeeding semiconductor element following the semiconductor element in the front row, so that the front side of the succeeding semiconductor element rides on it due to sliding and pushes the front end of the semiconductor element upwardly above the rear end of the semiconductor element in the front row. Automatic separation and supply mechanism for semiconductor device manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14180485A JPS624128A (en) | 1985-06-28 | 1985-06-28 | Automatic separation and feed mechanism in semiconductor element manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14180485A JPS624128A (en) | 1985-06-28 | 1985-06-28 | Automatic separation and feed mechanism in semiconductor element manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624128A true JPS624128A (en) | 1987-01-10 |
Family
ID=15300513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14180485A Pending JPS624128A (en) | 1985-06-28 | 1985-06-28 | Automatic separation and feed mechanism in semiconductor element manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624128A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253228U (en) * | 1985-09-20 | 1987-04-02 | ||
| JPH01143199U (en) * | 1988-03-25 | 1989-10-02 | ||
| US5320479A (en) * | 1992-09-01 | 1994-06-14 | Spirol International Corporation | Packet feeding and stacking system |
| US6079547A (en) * | 1996-02-27 | 2000-06-27 | Yazaki Corporation | Connector supply method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4858558A (en) * | 1971-11-22 | 1973-08-16 | ||
| JPS5343651U (en) * | 1976-09-17 | 1978-04-14 | ||
| JPS57156919A (en) * | 1981-03-20 | 1982-09-28 | Daifuku Co Ltd | Device for sending cargo out from conveyor or the like |
-
1985
- 1985-06-28 JP JP14180485A patent/JPS624128A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4858558A (en) * | 1971-11-22 | 1973-08-16 | ||
| JPS5343651U (en) * | 1976-09-17 | 1978-04-14 | ||
| JPS57156919A (en) * | 1981-03-20 | 1982-09-28 | Daifuku Co Ltd | Device for sending cargo out from conveyor or the like |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253228U (en) * | 1985-09-20 | 1987-04-02 | ||
| JPH0530018Y2 (en) * | 1985-09-20 | 1993-07-30 | ||
| JPH01143199U (en) * | 1988-03-25 | 1989-10-02 | ||
| US5320479A (en) * | 1992-09-01 | 1994-06-14 | Spirol International Corporation | Packet feeding and stacking system |
| US6079547A (en) * | 1996-02-27 | 2000-06-27 | Yazaki Corporation | Connector supply method and device |
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