JPS6241087B2 - - Google Patents
Info
- Publication number
- JPS6241087B2 JPS6241087B2 JP15692778A JP15692778A JPS6241087B2 JP S6241087 B2 JPS6241087 B2 JP S6241087B2 JP 15692778 A JP15692778 A JP 15692778A JP 15692778 A JP15692778 A JP 15692778A JP S6241087 B2 JPS6241087 B2 JP S6241087B2
- Authority
- JP
- Japan
- Prior art keywords
- model
- mold
- resin
- silicone rubber
- surface layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 4
- 238000011415 microwave curing Methods 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000006112 glass ceramic composition Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 8
- 239000004576 sand Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
【発明の詳細な説明】
本発明はマイクロ波硬化用鋳型の模型に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern for a microwave curing mold.
本出願人は先に樹脂材より成る模型材料で模型
を製作し、該模型に熱硬化性樹脂又は熱可塑性樹
脂とマイクロ波に対する誘電物質を含有する耐火
物より成る鋳型材料を充填し、その後にマイクロ
波を照射して自己発熱によつて鋳型材料を硬化さ
せ、硬化した後に抜型して鋳型を製造する鋳型の
製造法を出願した。 The applicant first makes a model using a model material made of a resin material, fills the model with a mold material made of a thermosetting resin or a thermoplastic resin and a refractory material containing a microwave-resistant dielectric material, and then We have filed an application for a mold manufacturing method in which the mold material is hardened by self-heating by irradiation with microwaves, and after hardening, the mold is cut out to manufacture the mold.
この鋳型の製造法における模型材料としてはシ
リコンゴム又はフツ素ゴムが用いられている。 Silicone rubber or fluorine rubber is used as the model material in this mold manufacturing method.
しかしこれ等の模型材料はマイクロ波エネルギ
ー損失が大きく繰り返し使用すると、熱変形が起
り、硬化鋳型の寸法精度が得られなくなるおそれ
がある。又、これ等の模型材料は高価であるた
め、肉厚を極力薄くしたいが、剛性が不足し変形
し易いので肉薄化は困難であるとの不具合を有す
る。 However, when these model materials have a large microwave energy loss and are used repeatedly, thermal deformation may occur, and the dimensional accuracy of the hardened mold may not be obtained. Furthermore, since these model materials are expensive, it is desirable to make the wall thickness as thin as possible, but the problem is that it is difficult to make the wall thickness thinner because the material lacks rigidity and is easily deformed.
本発明は上記の事情に鑑みなされたものであ
り、その目的は熱変形が少なく、剛性のある安価
なマイクロ波硬化用鋳型の模型を提供することで
ある。 The present invention has been made in view of the above-mentioned circumstances, and its purpose is to provide a rigid and inexpensive mold model for microwave curing with little thermal deformation.
すなわち、シリコンゴム又はフツ素ゴムを表面
に使用し、断熱性・剛性・マイクロ波エネルギー
損失の少ないスチレン樹脂・アクリル樹脂・エポ
キシ樹脂にガラス繊維又はセラミツク質の混合物
を裏打ちした模型構造とすることで熱変形が少な
く、剛性のある安価な模型を得る事が出来た。 In other words, by using silicone rubber or fluorine rubber on the surface and lining the model with a mixture of glass fiber or ceramic material and styrene resin, acrylic resin, or epoxy resin, which has insulation properties, rigidity, and low microwave energy loss, We were able to obtain a rigid and inexpensive model with little thermal deformation.
以下図面を参照して実施例を説明する。 Examples will be described below with reference to the drawings.
模型１はシリコンゴムより成る表面層２（厚さ
10mm）の裏面にエポキシ樹脂90部とガラス繊維10
部の混合物より成る裏面層３を裏打ちした構造と
なつている。 Model 1 has a surface layer 2 made of silicone rubber (thickness
10mm) 90 parts epoxy resin and 10 parts glass fiber on the back side
It has a structure in which it is lined with a back layer 3 made of a mixture of
４は鋳型となる誘電物質１％を含有したシエル
砂である。 4 is shell sand containing 1% of a dielectric material which serves as a mold.
このような模型とすることで、シリコンゴムの
使用量を1/5に節減でき安価となると共に、模型
表面層２の熱変形が最小限に抑えることができ、
さらには中子取り模型の剛性が向上された。 By making such a model, the amount of silicone rubber used can be reduced to 1/5, making it cheaper, and the thermal deformation of the model surface layer 2 can be minimized.
Furthermore, the rigidity of the core model was improved.
第２図は他の実施例を示すもので、表面層２を
３mm、裏面層３をセラミツク質成型物とし、シエ
ル砂４を炭化砂50％を含有したシエル砂とした。
本発明は前述のように構成したので、熱変形が少
なく、剛性のある安価なマイクロ波硬化用鋳型の
模型を得ることができる。 FIG. 2 shows another example in which the surface layer 2 was 3 mm, the back layer 3 was a ceramic molded product, and the shell sand 4 was shell sand containing 50% carbonized sand.
Since the present invention is constructed as described above, it is possible to obtain a rigid and inexpensive microwave curing mold model with little thermal deformation.
第１図・第２図は本発明の異なる実施例を示す
断面図である。
１は模型、２は表面層、３は裏面層。
1 and 2 are sectional views showing different embodiments of the present invention. 1 is the model, 2 is the surface layer, and 3 is the back layer.
Claims (1)
２に断熱性・剛性を有し、かつマイクロ波エネル
ギ損失の少ないスチレン樹脂・アクリル樹脂・エ
ポキシ樹脂にガラス繊維又はセラミツク質の混合
物より成る裏面層３を裏打ちしたことを特徴とす
るマイクロ波硬化用鋳型の模型。1. A surface layer 2 made of silicone rubber or fluorine rubber has heat insulation properties and rigidity, and a back layer 3 made of a mixture of styrene resin, acrylic resin, epoxy resin, and glass fiber or ceramic material, which has low microwave energy loss. A model of a microwave curing mold characterized by being lined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15692778A JPS5584618A (en) | 1978-12-21 | 1978-12-21 | Model for mold for microwave hardening |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15692778A JPS5584618A (en) | 1978-12-21 | 1978-12-21 | Model for mold for microwave hardening |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5584618A JPS5584618A (en) | 1980-06-26 |
| JPS6241087B2 true JPS6241087B2 (en) | 1987-09-01 |
Family
ID=15638399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15692778A Granted JPS5584618A (en) | 1978-12-21 | 1978-12-21 | Model for mold for microwave hardening |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5584618A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346575B2 (en) * | 1987-05-06 | 1991-07-16 | Kanebo Ltd |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059064B2 (en) * | 1981-03-17 | 1985-12-23 | 株式会社小松製作所 | Method for manufacturing a model for microwave heating hardening molds |
| JPH01108707U (en) * | 1988-01-16 | 1989-07-24 |
-
1978
- 1978-12-21 JP JP15692778A patent/JPS5584618A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0346575B2 (en) * | 1987-05-06 | 1991-07-16 | Kanebo Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5584618A (en) | 1980-06-26 |
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