JPS6240847U - - Google Patents
Info
- Publication number
- JPS6240847U JPS6240847U JP13112085U JP13112085U JPS6240847U JP S6240847 U JPS6240847 U JP S6240847U JP 13112085 U JP13112085 U JP 13112085U JP 13112085 U JP13112085 U JP 13112085U JP S6240847 U JPS6240847 U JP S6240847U
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- driving
- output signal
- input
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Facsimiles In General (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図及
び第３図はそれぞれ従来の密着形センサの第１及
び第２の例の斜視図である。 １……基板、２……光電変換素子群、３……個
別配線、４，４′……駆動用ＩＣチツプ、５……
ボンデイングワイヤ、６……駆動用ＩＣ接続配線
層、７……入出力用信号配線端子、８……入出力
用信号配線。
び第３図はそれぞれ従来の密着形センサの第１及
び第２の例の斜視図である。 １……基板、２……光電変換素子群、３……個
別配線、４，４′……駆動用ＩＣチツプ、５……
ボンデイングワイヤ、６……駆動用ＩＣ接続配線
層、７……入出力用信号配線端子、８……入出力
用信号配線。
Claims (1)
- 光電変換素子を一列に複数個配置した光電変換
素子群と、該光電変換素子群を順次駆動させるた
めの複数個の駆動用ＩＣチツプを同一基板上に搭
載した密着形イメージセンサにおいて、前記駆動
用ＩＣチツプ内部の入出力用信号配線をクロスオ
ーバーさせ、入出力用信号配線端子を左右対称の
２組となるように配置したことを特徴とする密着
形イメージセンサ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13112085U JPS6240847U (ja) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13112085U JPS6240847U (ja) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240847U true JPS6240847U (ja) | 1987-03-11 |
Family
ID=31029266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13112085U Pending JPS6240847U (ja) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240847U (ja) |
-
1985
- 1985-08-27 JP JP13112085U patent/JPS6240847U/ja active Pending