JPS6237932U - - Google Patents

Info

Publication number
JPS6237932U
JPS6237932U JP12913085U JP12913085U JPS6237932U JP S6237932 U JPS6237932 U JP S6237932U JP 12913085 U JP12913085 U JP 12913085U JP 12913085 U JP12913085 U JP 12913085U JP S6237932 U JPS6237932 U JP S6237932U
Authority
JP
Japan
Prior art keywords
suction
wafer
plate
suction plate
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12913085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12913085U priority Critical patent/JPS6237932U/ja
Publication of JPS6237932U publication Critical patent/JPS6237932U/ja
Pending legal-status Critical Current

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  • Jigs For Machine Tools (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例の構成を示す断面図、
第2図は吸着状態を示す断面図、第3図は従来の
ウエハ固定装置の例を示す説明図である。 1:吸着テーブル、2:吸引孔、3:吸着板、
4:リツプ部、5:ウエハ。
FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention;
FIG. 2 is a sectional view showing a suction state, and FIG. 3 is an explanatory view showing an example of a conventional wafer fixing device. 1: Suction table, 2: Suction hole, 3: Suction plate,
4: Lip part, 5: Wafer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空吸引のための吸引孔と連通するウエハ吸着
テーブルの真空吸着面を多孔質材料にてなる吸着
板で形成し、同吸着板の周囲を、前記吸着板上面
のレベル面より高くなる状態に軟質のリツプ部で
囲繞したことを特徴とするウエハ吸着装置。
The vacuum suction surface of the wafer suction table that communicates with the suction hole for vacuum suction is formed of a suction plate made of a porous material, and the periphery of the suction plate is made soft so that it is higher than the level surface of the upper surface of the suction plate. A wafer suction device characterized by being surrounded by a lip portion.
JP12913085U 1985-08-23 1985-08-23 Pending JPS6237932U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12913085U JPS6237932U (en) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12913085U JPS6237932U (en) 1985-08-23 1985-08-23

Publications (1)

Publication Number Publication Date
JPS6237932U true JPS6237932U (en) 1987-03-06

Family

ID=31025428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12913085U Pending JPS6237932U (en) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPS6237932U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61167145A (en) * 1985-01-19 1986-07-28 Mazda Motor Corp Cylinder-head structure of dohc multicylinder engine
JPH10144775A (en) * 1996-11-05 1998-05-29 Samsung Electron Co Ltd Pedestal of semiconductor device manufacturing equipment
JP2005175207A (en) * 2003-12-11 2005-06-30 Sharp Corp Manufacturing method of semiconductor device, reinforcement member for grinding and bonding method thereof
JP2008114349A (en) * 2006-11-07 2008-05-22 Disco Abrasive Syst Ltd Wafer grinding method and device
JP2016502112A (en) * 2012-12-26 2016-01-21 ベンタナ メディカル システムズ, インコーポレイテッド Specimen processing system and method for holding glass slide

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61167145A (en) * 1985-01-19 1986-07-28 Mazda Motor Corp Cylinder-head structure of dohc multicylinder engine
JPH0238785B2 (en) * 1985-01-19 1990-08-31 Mazda Motor
JPH10144775A (en) * 1996-11-05 1998-05-29 Samsung Electron Co Ltd Pedestal of semiconductor device manufacturing equipment
JP2005175207A (en) * 2003-12-11 2005-06-30 Sharp Corp Manufacturing method of semiconductor device, reinforcement member for grinding and bonding method thereof
JP4574980B2 (en) * 2003-12-11 2010-11-04 シャープ株式会社 Semiconductor device manufacturing method, grinding reinforcing member, and method of attaching the same
JP2008114349A (en) * 2006-11-07 2008-05-22 Disco Abrasive Syst Ltd Wafer grinding method and device
JP2016502112A (en) * 2012-12-26 2016-01-21 ベンタナ メディカル システムズ, インコーポレイテッド Specimen processing system and method for holding glass slide

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