JPS6236314Y2 - - Google Patents
Info
- Publication number
- JPS6236314Y2 JPS6236314Y2 JP19169781U JP19169781U JPS6236314Y2 JP S6236314 Y2 JPS6236314 Y2 JP S6236314Y2 JP 19169781 U JP19169781 U JP 19169781U JP 19169781 U JP19169781 U JP 19169781U JP S6236314 Y2 JPS6236314 Y2 JP S6236314Y2
- Authority
- JP
- Japan
- Prior art keywords
- dummy
- printed wiring
- circuit section
- circuit
- snap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（技術分野）
本考案は無線機の高周波部品において、数枚の
印刷配線板を１枚に納めた集合化印刷配線板に関
するものである。[Detailed Description of the Invention] (Technical Field) The present invention relates to an aggregated printed wiring board in which several printed wiring boards are housed in one piece of high-frequency components for radio equipment.
（背景技術）
従来の構造を第１図に示す。１，２，３は各々
印刷配線板、４はジヤンパー線を示す。従来は
各々独立な印刷配線板１，２，３の組立てを行な
い、各々をケースに固定し、それぞれをジヤンパ
ー線で接続して高周波回路を構成していた。こう
した従来構造は、(1)非量産的である。(2)位置精度
が悪い等の欠点があつた。そこで考えだされたも
のが、第２図に示すようなチヨコレートチツプ方
式の集合化印刷配線板である。この構造は、シー
ルド効果をもたせる為の切欠き６，７，８をもう
けているが、セラミツクなどの基板材料は電気部
品の搭載工程及び搬送時に、第２図の９の個所な
どで割れ易く、一体化した効果が得られない。(Background Art) A conventional structure is shown in FIG. 1, 2, and 3 are printed wiring boards, and 4 is a jumper wire. Conventionally, printed wiring boards 1, 2, and 3 were assembled independently, each was fixed to a case, and each was connected with a jumper wire to form a high-frequency circuit. These conventional structures are (1) not suitable for mass production; (2) There were drawbacks such as poor positioning accuracy. What we came up with was a stacked printed wiring board using a stacked chip system as shown in Figure 2. This structure has notches 6, 7, and 8 to provide a shielding effect, but the board material such as ceramic is easily broken at points 9 in Fig. 2 during the mounting process and transportation of electrical components. An integrated effect cannot be obtained.
（考案の課題）
本考案は従来の技術の上記欠点を改善すること
を目的とし、その特徴は、切欠き６，７，８によ
り複数の領域に分割され各領域が前記切欠きの先
の狭部により結合するほぼ矩形板状の単一の回路
部１０と、該回路部と一体で該回路部の少なくと
も３辺の外周にそつてもうけられる細長のダミー
部１１と、ダミー部と回路部の境界の間の溝によ
る直線スナツプ１２と、ダミー部の角にもうけら
れるほぼ三角形の補強ダミー及び当該補強部材の
境界を規定する、前記直線スナツプに斜めのスナ
ツプとを有するごとき集合化印刷配線板にある。(Problem of the invention) The present invention aims to improve the above-mentioned drawbacks of the conventional technology, and its characteristics are that the notches 6, 7, and 8 are divided into a plurality of regions, and each region is narrow at the tip of the notch. a single circuit section 10 in the shape of a substantially rectangular plate, which is connected to the circuit section 10; An assembled printed wiring board having straight snaps 12 formed by grooves between the boundaries, a substantially triangular reinforcing dummy provided at the corner of the dummy part, and a diagonal snap on the straight snaps defining the boundary of the reinforcing member. be.
好ましくは、ダミー部又は補強ダミーには電子
部品を回路部に搭載する際に用いる位置決め穴１
４，１５がもうけられる。 Preferably, the dummy part or the reinforcing dummy has positioning holes 1 for use when mounting electronic components on the circuit part.
4.15 can be earned.
更に好ましくは、回路部にはアース用異形穴１
６がもうけられる。 More preferably, the circuit part has an irregularly shaped hole 1 for grounding.
6 can be earned.
（考案の構成及び作用）
第３図は本考案の実施例であつて、１０は集合
化印刷配線板の回路部、１１は割れ防止のために
上記回路部外周を連結保護するダミー部、１２は
上記集合化印刷配線板をケースへ挿入、固定する
前に、回路部とダミー部を容易に分離できるよう
にしたＸ，Ｙ方向のスナツプ（溝）、１３はＸ，
Ｙの２方向への応力を高める為にもうけたＸ，Ｙ
と斜めに交わる補強ダミー、１４，１５は電子部
品の回路部１０への搭載の組立精度を向上させる
ためにダミー部にもうけた位置決め穴、１６はア
ース用にもうけた異形穴をそれぞれ示す。第４図
ａは第３図に示したもののダミー部をカツし、第
４図ｂのケースに組込む状態を示す。(Structure and operation of the invention) FIG. 3 shows an embodiment of the invention, in which 10 is a circuit section of an aggregated printed wiring board, 11 is a dummy section for connecting and protecting the outer periphery of the circuit section to prevent cracking, and 12 13 is a snap (groove) in the X and Y directions that allows the circuit section and dummy section to be easily separated before inserting and fixing the assembled printed wiring board into the case;
X, Y added to increase stress in two directions of Y
14 and 15 are positioning holes provided in the dummy portion in order to improve the assembly accuracy of mounting electronic components on the circuit portion 10, and 16 represents an irregularly shaped hole provided for grounding. FIG. 4a shows the state in which the dummy portion of the device shown in FIG. 3 is cut out and assembled into the case of FIG. 4b.
（考案の効果）
かかる集合化印刷配線板構造とすることによ
り、実装スペースを減少させることなく位置決め
穴をもうけることができ、又集合化による割れ発
生の確率を下げることができ、回路パターンの形
成、基板組立ての量産加工性を改善し、歩留りを
改善するこができる。(Effects of the invention) By adopting such an aggregated printed wiring board structure, positioning holes can be made without reducing the mounting space, and the probability of cracking due to aggregation can be lowered, making it possible to form circuit patterns. , it is possible to improve mass production processability of substrate assembly and improve yield.
第１図は従来の集合化印刷配線板で複数の独立
した基板及びそれらがケースに組込まれジヤンパ
ー線を半田付された状態を示し、第２図は従来の
独立した基板をそのまま一体化した集合化印刷配
線板を示し、第３図は本考案による集合化印刷配
線板を示し、第４図ａ及びｂは第３図の集合化印
刷配線板のダミー部をカツトした状態及びケース
を示す。
１０……回路部、１１……ダミー部、１２……
スナツプ、１３……補強スナツプ、６，７，８…
…切欠き。
Figure 1 shows a conventional assembled printed wiring board with multiple independent boards assembled in a case and jumper wires soldered to them, and Figure 2 shows a conventional assembled printed wiring board that is integrated as is. FIG. 3 shows an assembled printed wiring board according to the present invention, and FIGS. 4a and 4b show the assembled printed wiring board of FIG. 3 with the dummy portion cut out and the case. 10...Circuit section, 11...Dummy section, 12...
Snap, 13... Reinforced snap, 6, 7, 8...
...Notch.
Claims (1)
各領域が前記切欠きの先の狭部により結合するほ
ぼ矩形板状の単一の回路部１０と、該回路部と一
体で該回路部の少なくとも３辺の外周にそつても
うけられる細長のダミー部１１と、ダミー部と回
路部の境界の間の溝による直線スナツプ１２と、
ダミー部の角にもうけられるほぼ三角形の補強ダ
ミー及び当該補強部材の境界を規定する、前記直
線スナツプに斜めのスナツプとを有し、前記補強
ダミーには電子部品を回路部１０に搭載する為の
位置決め穴１４，１５がもうけられることを特徴
とする集合化印刷配線板。 A single circuit section 10 having a substantially rectangular plate shape, which is divided into a plurality of regions by notches 6, 7, and 8 and each region is joined by a narrow portion at the tip of the notch, and a circuit section that is integrated with the circuit section. an elongated dummy portion 11 provided along the outer periphery of at least three sides of the dummy portion, and a linear snap 12 formed by a groove between the dummy portion and the boundary of the circuit portion;
The reinforcing dummy has a substantially triangular shape provided at the corner of the dummy part, and the linear snap and the diagonal snap define the boundary of the reinforcing member, and the reinforcing dummy has a shape for mounting an electronic component on the circuit part 10. An assembled printed wiring board characterized in that positioning holes 14 and 15 are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169781U JPS5897861U (en) | 1981-12-24 | 1981-12-24 | Assembled printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19169781U JPS5897861U (en) | 1981-12-24 | 1981-12-24 | Assembled printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5897861U JPS5897861U (en) | 1983-07-02 |
| JPS6236314Y2 true JPS6236314Y2 (en) | 1987-09-16 |
Family
ID=30105146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19169781U Granted JPS5897861U (en) | 1981-12-24 | 1981-12-24 | Assembled printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897861U (en) |
-
1981
- 1981-12-24 JP JP19169781U patent/JPS5897861U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5897861U (en) | 1983-07-02 |
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