JPS6234530B2 - - Google Patents
Info
- Publication number
- JPS6234530B2 JPS6234530B2 JP54122818A JP12281879A JPS6234530B2 JP S6234530 B2 JPS6234530 B2 JP S6234530B2 JP 54122818 A JP54122818 A JP 54122818A JP 12281879 A JP12281879 A JP 12281879A JP S6234530 B2 JPS6234530 B2 JP S6234530B2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin
- mold
- thermosetting synthetic
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 239000000057 synthetic resin Substances 0.000 claims description 28
- 229920003002 synthetic resin Polymers 0.000 claims description 28
- 229920001187 thermosetting polymer Polymers 0.000 claims description 28
- 238000002347 injection Methods 0.000 claims description 22
- 239000007924 injection Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 13
- 238000005266 casting Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 230000013011 mating Effects 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は型内に入れた電気機器等の被モールド
品をエポキシ樹脂等の熱硬化性合成樹脂で樹脂モ
ールドする熱硬化性合成樹脂モールド用金型に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermosetting synthetic resin molding die for molding an article to be molded, such as an electrical device, placed in the mold with a thermosetting synthetic resin such as an epoxy resin.
従来のこの種の金型は、真空注形方式の金型と
加圧注形方式の金型の二種類に大別される。 Conventional molds of this type are roughly divided into two types: vacuum casting molds and pressure casting molds.
真空注形方式の金型は、キヤビテイー内を真空
にし、被モールド品とキヤビテイー内壁との間の
空隙に液状の熱硬化性合成樹脂を真空吸引により
注入口より注入して樹脂モールドするものであ
る。この真空注形方式の金型はコイル等の電気機
器等を液状のエポキシ樹脂により絶縁モールドす
る場合の金型として最も一般的に使用されている
ものである。 In a vacuum casting mold, the inside of the cavity is evacuated, and liquid thermosetting synthetic resin is injected into the gap between the molded product and the inner wall of the cavity through the injection port using vacuum suction to form a resin mold. . This vacuum casting mold is most commonly used for insulating molding electrical equipment such as coils using liquid epoxy resin.
ところが、この真空注形方式の金型は、真空タ
ンクや金型を高温に保持するためのエネルギを多
く必要とし、樹脂の注入に長時間を要し、多数の
モールド品を作る場合には多数の金型を必要と
し、また離型時にモールド品に衝撃を与えたり、
モールド経費が高価となり、またモールド工程の
自動化および省力化が困難であるという不都合が
あつた。 However, this vacuum casting mold requires a lot of energy to maintain the vacuum tank and mold at high temperatures, it takes a long time to inject the resin, and when making a large number of molded products, it requires a lot of energy. It requires a mold of
There are disadvantages in that molding costs are high and it is difficult to automate and save labor in the molding process.
この真空注形方式の金型の不都合な点を除くも
のとして前記加圧注形方式の金型が用いられるよ
うになつて来た。 In order to eliminate the disadvantages of the vacuum casting mold, the pressure casting mold has come to be used.
この加圧注形方式の金型を第１〜２図に基づい
て説明する。 The mold for this pressure casting method will be explained based on FIGS. 1 and 2.
図中、符号１は合せ面１ａで左右に２つに割れ
る加圧注形方式の金型で、キヤビテイー２と該キ
ヤビテイー２に開口する樹脂注入孔３を有する。
この金型には図示しないヒータが埋設されてお
り、金型を熱硬化性合成樹脂の硬化温度に加温し
ているこの加圧注形方式の金型１による樹脂モー
ルドは次のように行なわれる。予めキヤビテイー
２の中へコイル等の被モールド品４を入り子５に
よつて中空に支持しておく。次に原料タンク６に
液状の熱硬化性合成樹脂７を入れ、モータ２７で
回転される撹拌機８により該熱硬化性合成樹脂７
を脱気し、その後原料タンク６内へ空気送給管９
より圧縮空気を送り熱硬化性合成樹脂７を圧迫す
る。次に原料タンクバルブ１０を開き、熱硬化性
合成樹脂７を配管１１内へ送り、その後注入ヘツ
ドバルブ１２を開き、熱硬化性合成樹脂７を注入
ヘツド１３および樹脂注入孔３を通してキヤビテ
イー２内へ圧入する。キヤビテイー２内へ圧入さ
れた熱硬化性合成樹脂は、金型の合せ面１ａの注
入口３と反対側の位置に設けた空隙１５（第２
図）からキヤビテイー２内の空気を押し出しつつ
キヤビテイー２の内壁と被モールド品４との間の
空間に充填され、該空間を熱硬化性合成樹脂が満
した時に注入ヘツドバルブ１２が閉じられ樹脂注
入が終わる。この後キヤビテイー２内に充満した
熱硬化性合成樹脂がゲル化するまで放置し、ゲル
化した後に金型１を開き、図示してない押しピン
により樹脂モールド品を取り出して製品とする。 In the figure, reference numeral 1 denotes a pressure casting mold that splits into two left and right at a mating surface 1a, and has a cavity 2 and a resin injection hole 3 opening into the cavity 2.
A heater (not shown) is embedded in this mold, and the mold is heated to the curing temperature of the thermosetting synthetic resin.Resin molding using the pressure casting mold 1 is performed as follows. . A molded product 4 such as a coil is supported in the cavity 2 in advance by an insert 5. Next, a liquid thermosetting synthetic resin 7 is put into the raw material tank 6, and the thermosetting synthetic resin 7 is stirred by a stirrer 8 rotated by a motor 27.
After that, the air supply pipe 9 is passed into the raw material tank 6.
Compressed air is sent to compress the thermosetting synthetic resin 7. Next, the raw material tank valve 10 is opened, and the thermosetting synthetic resin 7 is sent into the pipe 11. Then, the injection head valve 12 is opened, and the thermosetting synthetic resin 7 is forced into the cavity 2 through the injection head 13 and the resin injection hole 3. do. The thermosetting synthetic resin press-fitted into the cavity 2 fills a gap 15 (second
The thermosetting synthetic resin fills the space between the inner wall of the cavity 2 and the molded product 4 while pushing out the air in the cavity 2 from the thermosetting synthetic resin shown in Fig. It ends. Thereafter, the thermosetting synthetic resin filling the cavity 2 is left to gel, and after gelling, the mold 1 is opened and the resin molded product is taken out using push pins (not shown) to form a product.
この金型１における上記空隙１５は、キヤビテ
イー２内の空気は逃がすが、液状の熱硬化性合成
樹脂はその樹脂がキヤビテイー２内に充満された
時でも洩らさないように作用するものでなければ
ならず、従来はその空隙幅を0.01〜0.05mmとして
いた。 The air gap 15 in the mold 1 allows the air inside the cavity 2 to escape, but the liquid thermosetting synthetic resin must act to prevent leakage even when the resin fills the cavity 2. Conventionally, the gap width has been set to 0.01 to 0.05 mm.
ところがこの空隙１５は狭隘であるため、シリ
コン等の離型材を塗布すると空隙が塞がれてしま
い空気を完全に逃がすことができなくなり、キヤ
ビテイー２内の残留空気はモールド品中に気泡と
して鋳込まれるものであつた。このモールド品中
の気泡はモールド品の絶縁破壊の原因となり、ま
たモールド品が耐高圧機器である場合にはこの気
泡が原因で部分放電特性が低下することがあつ
た。また気泡がモールド品の表面に生じた場合に
はモールド品の美観が損なわれる不都合があつ
た。 However, since this gap 15 is narrow, when a mold release material such as silicone is applied, the gap is blocked and air cannot escape completely, and the residual air in the cavity 2 is cast into the molded product as bubbles. It was something I could do. These air bubbles in the molded product cause dielectric breakdown of the molded product, and when the molded product is a high-voltage resistant device, the air bubbles sometimes cause a reduction in partial discharge characteristics. Furthermore, when air bubbles are generated on the surface of the molded product, there is a problem in that the aesthetic appearance of the molded product is impaired.
この不都合を除くため、上記空隙１５を１〜２
mmと大きくする方法もあるが、加圧注形方式の金
型においては、加圧注入した液状の熱硬化性合成
樹脂が該空隙１５から型外へ洩れ出し、特にエポ
キシ樹脂、ポリエステル樹脂においては高温にす
ると粘度が低下し洩れを生じ易いものであつた。
そこで、洩れ出す樹脂をとどめるための樹脂溜タ
ンク（図示せず）を前記空隙１５に接続したもの
が提案されているが、これでは、モールド作業に
際して金型のみならず、別個に樹脂溜タンクをも
分解、清掃しなければならず作業性が悪化する。 In order to eliminate this inconvenience, the above-mentioned void 15 is
There is a method of increasing the size to mm, but in pressure casting molds, the liquid thermosetting synthetic resin injected under pressure leaks out of the mold from the void 15, and especially in epoxy resins and polyester resins, the temperature is high. However, the viscosity decreased and leakage was likely to occur.
Therefore, it has been proposed that a resin reservoir tank (not shown) is connected to the gap 15 to contain the leaking resin, but this method requires not only the mold but also a separate resin reservoir tank to be connected to the cavity 15 during the molding operation. It also has to be disassembled and cleaned, making workability worse.
本発明はこれらの不都合を取除き、モールドし
た樹脂中に気泡の無いモールド品を得ることがで
き、しかも、モールド作業性のよい熱硬化性合成
樹脂モールド用金型を提供することを目的とす
る。 An object of the present invention is to eliminate these disadvantages, to provide a mold for a thermosetting synthetic resin mold that can obtain a molded product without air bubbles in the molded resin, and has good mold workability. .
以下、本発明を第３〜５図に示す実施例につい
て説明する。 The present invention will be described below with reference to embodiments shown in FIGS. 3 to 5.
第３〜４図は本発明の第一実施例を示す。図中
符号１６は本発明の熱硬化性合成樹脂モールド用
金型で、第３図の中央縦方向の合せ面１９から左
右に２つに割れる割れ型で、被モールド品４を入
れるキヤビテイー１７と、該キヤビテイー１７に
開口する樹脂注入孔１８と、該樹脂注入孔１８の
反対側の位置に設けた樹脂溜キヤビテイー２０
と、該樹脂溜キヤビテイー２０とキヤビテイー１
７とを連通する空隙２１と、該樹脂溜キヤビテイ
ー２０に開口する真空吸引孔２２とを有する。上
記樹脂溜キヤビテイー２０はキヤビテイー１７の
容積の1/4〜1/3程度の容積とする。上記空隙２１
は合せ面１９に沿つて設けてあり、空隙幅は0.1
〜0.5mm程度に形成され、ここを通る樹脂が後述
のヒータにより加熱される際、ゲル化し易いよう
になつている。真空吸引孔２２には管２６を介し
て真空ポンプ２３を接続してあり、樹脂注入孔１
８には注入ヘツド２４を接続してある。金型１６
内には型を加温する図示しないヒータが埋設され
ている。金型１６への熱硬化性合成樹脂の送給は
従来と同様に撹拌機８および空気送給管９を有す
る原料タンク６と、原料タンクバルブ１０および
注入ヘツドバルブ１２を両端に有する配管１１と
を介して行なう。金型の合せ面には、パツキン２
５が設けられ、樹脂注入孔１８および真空吸引孔
２２以外の型合せ面は気密にシールされている。 3-4 show a first embodiment of the invention. Reference numeral 16 in the figure indicates a mold for thermosetting synthetic resin molding of the present invention, which is a split mold that splits into two left and right from the center vertical mating surface 19 in FIG. , a resin injection hole 18 opening into the cavity 17, and a resin reservoir cavity 20 provided at a position opposite to the resin injection hole 18.
and the resin reservoir cavity 20 and cavity 1.
7, and a vacuum suction hole 22 that opens into the resin reservoir cavity 20. The volume of the resin reservoir cavity 20 is approximately 1/4 to 1/3 of the volume of the cavity 17. The above void 21
are provided along the mating surface 19, and the gap width is 0.1
It is formed to a thickness of about 0.5 mm, and is designed to easily gel when the resin passing through it is heated by the heater described below. A vacuum pump 23 is connected to the vacuum suction hole 22 via a pipe 26, and the resin injection hole 1
An injection head 24 is connected to 8. Mold 16
A heater (not shown) is embedded inside to heat the mold. The thermosetting synthetic resin is supplied to the mold 16 by using a raw material tank 6 having an agitator 8 and an air feed pipe 9, and a pipe 11 having a raw material tank valve 10 and an injection head valve 12 at both ends, as in the past. Do it through There is a packing 2 on the mating surface of the mold.
5 is provided, and the mold mating surfaces other than the resin injection hole 18 and the vacuum suction hole 22 are hermetically sealed.
次に本発明の作用を説明する。 Next, the operation of the present invention will be explained.
樹脂注入に先立つて、予めキヤビテイー１７内
に被モールド品４を入り子５により中空に支持
し、注入ヘツドバルブ１２を全閉にし真空ポンプ
２３により金型１６内の空気を吸引して注入ヘツ
ド２４、樹脂注入孔１８、キヤビテイー１７、空
隙２１、樹脂溜キヤビテイー２０および真空吸引
孔２２を真空状態にしておく。次に空気送給管９
より原料タンク６内に圧縮空気を送給し、原料タ
ンクバルブ１０および注入ヘツドバルブ１２を開
き、撹拌脱気された液状の熱硬化性合成樹脂７を
配管１１、注入ヘツド２４および注入孔１８を通
してキヤビテイー１７内に圧入する。該キヤビテ
イー１７に圧入された熱硬化性合成樹脂７は、キ
ヤビテイー１７内が真空であるため気泡を生じる
ことなく且つ短時間に充満する。キヤビテイー１
７内に充満した熱硬化性合成樹脂７は次いで空隙
２１を通り樹脂溜キヤビテイー２０に流入して行
く。その際に熱硬化性合成樹脂７は図示しないヒ
ータで加温されゲル化して樹脂溜キヤビテイー２
０内にとどまり、その先に流出することはない。
熱硬化性合成樹脂７がゲル化した後注入ヘツドバ
ルブ１２を成閉にし、真空ポンプ２３を切離し、
金型１６を開き、モールド品を取出す。次のモー
ルド作業にあつては、分解した金型１６のキヤビ
テイー１７、樹脂溜キヤビテイー２０および空隙
２１内を清掃し再び組立てて準備する。 Prior to resin injection, the molded product 4 is previously supported in the cavity 17 in a hollow manner by the insert 5, the injection head valve 12 is fully closed, and the air inside the mold 16 is suctioned by the vacuum pump 23, and the injection head 24, The resin injection hole 18, cavity 17, void 21, resin reservoir cavity 20, and vacuum suction hole 22 are kept in a vacuum state. Next, air supply pipe 9
compressed air is supplied into the raw material tank 6, the raw material tank valve 10 and the injection head valve 12 are opened, and the stirred and degassed liquid thermosetting synthetic resin 7 is passed through the piping 11, the injection head 24, and the injection hole 18 into the cavity. Press fit into 17. Since the inside of the cavity 17 is a vacuum, the thermosetting synthetic resin 7 press-fitted into the cavity 17 is filled in a short time without generating bubbles. Cavity 1
The thermosetting synthetic resin 7 filled in the resin chamber 7 then passes through the gap 21 and flows into the resin reservoir cavity 20. At that time, the thermosetting synthetic resin 7 is heated by a heater (not shown) and becomes a gel, forming the resin reservoir cavity 2.
It stays within 0 and does not flow beyond that.
After the thermosetting synthetic resin 7 has gelled, the injection head valve 12 is closed and the vacuum pump 23 is disconnected.
Open the mold 16 and take out the molded product. For the next molding operation, the cavity 17, resin reservoir cavity 20, and cavity 21 of the disassembled mold 16 are cleaned and reassembled to prepare.
注入する熱硬化性合成樹脂７は、その成分を樹
脂７が空隙２１を通る際にヒータで加温されてゲ
ル化する内容とする。また、樹脂溜キヤビテイー
２０は粘度の低い樹脂が空隙２１を越えて該樹脂
溜キヤビテイー２０内に流入する場合において、
樹脂が該樹脂溜キヤビテイー２０に満杯になる前
にゲル化できる容積の大きさとする。 The thermosetting synthetic resin 7 to be injected has a component that is heated by a heater and gelled when the resin 7 passes through the gap 21. Further, in the resin reservoir cavity 20, when a resin with low viscosity flows into the resin reservoir cavity 20 across the gap 21,
The volume should be large enough to allow the resin to gel before the resin reservoir cavity 20 is full.
また樹脂溜キヤビテイー２０は、第５図に示す
ように断面を半円形にしたものおよび断面を四角
形にしたもの等のようにその形状、個数は樹脂の
成分やモールド条件に応じて定めるものとする。 Further, the shape and number of resin reservoir cavities 20 shall be determined according to the resin composition and molding conditions, such as one with a semicircular cross section and one with a square cross section, as shown in Fig. 5. .
本発明は以上のように作用するものであるか
ら、熱硬化性合成樹脂内に気泡を生じることなく
樹脂モールドすることができ、得られるモールド
品も絶縁低下や電気的欠陥のない信頼性のある製
品となり、モールド品の表面に気泡が存在しない
ため美観が向上し、また樹脂注入を短期間で行な
うことができるのでモールド能率が良く、さら
に、樹脂が金型内にとどまるので、金型のみ分解
して清掃、組立ての準備を行えば良くモールド作
業能率が良い等の効果を奏する。 Since the present invention operates as described above, resin molding can be carried out without creating air bubbles in thermosetting synthetic resin, and the resulting molded product is reliable without deterioration in insulation or electrical defects. The appearance of the molded product is improved because there are no air bubbles on the surface of the product, and molding efficiency is improved because resin can be injected in a short period of time.Furthermore, since the resin remains within the mold, only the mold can be disassembled. Cleaning and preparation for assembly can be done in advance, resulting in improved mold work efficiency.
第１図は従来の加圧注形方式の金型とその金型
へ液状の樹脂を送給する装置を示す縦断側面図、
第２図は第１図に示す従来金型の空隙部を示す縦
断側面図、第３図は本発明の熱硬化性合成樹脂モ
ールド用金型とその金型へ液状樹脂を送給する装
置とを示す縦断側面図、第４図は第３図のＡ−Ａ
断面図、第５図は樹脂溜キヤビテイーの別例を示
す縦断側面図である。
４……被モールド品、１６……熱硬化性合成樹
脂モールド用金型、１７……キヤビテイー、１８
……樹脂注入孔、２０……樹脂溜キヤビテイー、
２１……空隙、２２……真空吸引孔。
FIG. 1 is a vertical side view showing a conventional pressure casting mold and a device for feeding liquid resin to the mold.
FIG. 2 is a longitudinal cross-sectional side view showing the cavity of the conventional mold shown in FIG. 1, and FIG. 3 shows the thermosetting synthetic resin molding mold of the present invention and a device for feeding liquid resin to the mold. A longitudinal side view showing the
The cross-sectional view and FIG. 5 are longitudinal side views showing another example of the resin reservoir cavity. 4... Product to be molded, 16... Mold for thermosetting synthetic resin mold, 17... Cavity, 18
... Resin injection hole, 20 ... Resin reservoir cavity,
21...Void, 22...Vacuum suction hole.
Claims (1)
ヤビテイーと、このキヤビテイーの下方に位置し
上記キヤビテイーと型外とを連通する樹脂注入孔
と、上記キヤビテイーの上方に位置し上記キヤビ
テイーに隣接して配設された樹脂溜キヤビテイー
と、上記キヤビテイーと上記樹脂溜キヤビテイー
とを連通し0.1〜0.5mmの幅を有する空〓と、上記
樹脂溜キヤビテイーと型外とを連通する真空吸引
孔と、少なくとも上記キヤビテイー、樹脂溜キヤ
ビテイーおよび空〓を加熱するヒータとを有する
熱硬化性合成樹脂モールド用金型。1. In the same mold, a cavity in which the product to be molded is placed, a resin injection hole located below this cavity and communicating between the cavity and the outside of the mold, and a resin injection hole located above the cavity and adjacent to the cavity. a vacuum suction hole communicating between the resin reservoir cavity and the outside of the mold; A mold for a thermosetting synthetic resin mold, comprising the cavity, a resin reservoir cavity, and a heater for heating the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12281879A JPS5646716A (en) | 1979-09-25 | 1979-09-25 | Mold for thermosetting synthetic resin-molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12281879A JPS5646716A (en) | 1979-09-25 | 1979-09-25 | Mold for thermosetting synthetic resin-molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5646716A JPS5646716A (en) | 1981-04-28 |
| JPS6234530B2 true JPS6234530B2 (en) | 1987-07-28 |
Family
ID=14845388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12281879A Granted JPS5646716A (en) | 1979-09-25 | 1979-09-25 | Mold for thermosetting synthetic resin-molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5646716A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5775435A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Liquid transfer molding |
| JPS6248518A (en) * | 1985-08-27 | 1987-03-03 | Matsushita Electric Works Ltd | Manufacture of sheet material for print wiring |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015030A (en) * | 1973-05-03 | 1975-02-17 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52128670U (en) * | 1976-03-26 | 1977-09-30 |
-
1979
- 1979-09-25 JP JP12281879A patent/JPS5646716A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015030A (en) * | 1973-05-03 | 1975-02-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5646716A (en) | 1981-04-28 |
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