JPS6231184A - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- JPS6231184A JPS6231184A JP60171562A JP17156285A JPS6231184A JP S6231184 A JPS6231184 A JP S6231184A JP 60171562 A JP60171562 A JP 60171562A JP 17156285 A JP17156285 A JP 17156285A JP S6231184 A JPS6231184 A JP S6231184A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- output
- processing
- laser output
- converging lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
Landscapes
- Engineering & Computer Science (AREA)
- Lasers (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はレーザ光により被加工物を加工するレーザ加工
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a laser processing apparatus for processing a workpiece with laser light.
従来の技術 従来例を第２図を用いて説明する。Conventional technology A conventional example will be explained using FIG. 2.
レーザ加工を行なう場合、レーザ発振器１より取り出し
たレーザ光６を全反射ミラー２等に上り加工テーブル４
まで導き、集光レンズ３により集光し、加工テーブル４
上の被加工物６に照射し、加工を行なう。When performing laser processing, the laser beam 6 taken out from the laser oscillator 1 passes through the total reflection mirror 2, etc., and passes through the processing table 4.
The light is focused by the condensing lens 3 and placed on the processing table 4.
The upper workpiece 6 is irradiated and processed.
その場合、被加工物６の種類により、加工条件が異なる
。つまり、連続出力のレーザ光を用いる場合や、パルス
出力のレーザ光を用いる場合がある。また形状により連
続出力とパルス出力を組合せる事もある。さらに連続出
力においてもパルス出力においても出力レベルを調整す
る必要がある。In that case, processing conditions differ depending on the type of workpiece 6. That is, there are cases in which a continuous output laser beam is used, and there are cases in which a pulsed output laser beam is used. Also, depending on the shape, continuous output and pulse output may be combined. Furthermore, it is necessary to adjust the output level for both continuous output and pulse output.
つまり出力が少なければ加工が不十分となりまた大きす
ぎても加工状態が悪くなるのである。In other words, if the output is too low, machining will be insufficient, and if the output is too large, the machining condition will deteriorate.
そこでレーザ発振器には出力調整要素がたいてい設けら
れている。ガスレーザ発振器の場合は、放電電流値を可
変にすることによりレーザ出力レベルをコントロールす
ることが多い。Therefore, laser oscillators are usually provided with output adjustment elements. In the case of gas laser oscillators, the laser output level is often controlled by making the discharge current value variable.
発明が解決しようとする問題点
一般にレーザ加工装置を作成した場合、第３図に示す様
なレーザ出力特性をチェックする。第３図の場合は、放
電電流とレーザ出力の関係を示している。この様な特性
から、被加工物の種類、加工形状により、レーザ出力を
あるレベルに設定するため放電電流をいくらにするかを
決めるのである。しかし、この場合、レーザ発振器の経
年的出力低下、及び全反射鏡、集光レンズ等の光学系の
汚染等による出力損失等から、第３図において、当初イ
の出力特性が、口の出力特性へと変化した場合、従来設
定の放電電流値では、加工に必要なレーザ出力が得られ
ていないことになる。Problems to be Solved by the Invention Generally, when a laser processing device is manufactured, the laser output characteristics as shown in FIG. 3 are checked. In the case of FIG. 3, the relationship between discharge current and laser output is shown. Based on these characteristics, the discharge current is determined in order to set the laser output to a certain level, depending on the type of workpiece and the shape of the workpiece. However, in this case, due to the decline in the output of the laser oscillator over time and the output loss due to contamination of the optical system such as the total reflection mirror and the condenser lens, the output characteristic of If the discharge current value changes to , it means that the laser output necessary for machining cannot be obtained with the conventionally set discharge current value.
問題を解決するだめの手段
そこで本発明では、問題を解決するだめの手段として、
レーザ発振器より取り出したレーザ光を、全反射ミラー
等の光学系により加工テーブルまで導き、集光レンズに
より集光し、加工テーブル上の被加工物に照射し加工す
るレーザ加工装置において、集光レンズ通過後のレーザ
光の出力を測定するレーザ出力測定装置及び、ジーザ出
力調整要素（放電電流等）とレーザ出力の相互関係を分
析するコントロール部を有するものである。Means to Solve the Problem Therefore, in the present invention, as a means to solve the problem,
In laser processing equipment, a laser beam extracted from a laser oscillator is guided to a processing table using an optical system such as a total reflection mirror, focused by a condensing lens, and irradiated onto a workpiece on the processing table for processing. It has a laser output measuring device that measures the output of the laser beam after passing through it, and a control unit that analyzes the correlation between the laser output adjustment element (discharge current, etc.) and the laser output.
作 用
上記構成により常に同一加工条件が満たされ、加工品質
の向上、加工ミスの解消がはかれる。Function: With the above configuration, the same machining conditions are always met, improving machining quality and eliminating machining errors.
実施例 本発明の一実施例を第１図により説明する。Example An embodiment of the present invention will be described with reference to FIG.
レーザ発振器１より取り出されたレーザ光５は全反射鏡
２等により加工テーブル４まで導かれ、集光レンズ３で
集光され加工テーブル４上に設置された被加工物６に照
射され、加工を行なう。レーザ出力測定器７は、可動形
であり、加工する前に、集光レンズ３下へ移動させる。A laser beam 5 extracted from a laser oscillator 1 is guided to a processing table 4 by a total reflection mirror 2, etc., is focused by a condensing lens 3, and is irradiated onto a workpiece 6 placed on a processing table 4, where it is processed. Let's do it. The laser output measuring device 7 is movable and is moved below the condenser lens 3 before processing.
コントロール部８により第３図の様な出力特性がチェッ
クされ、当初の出力特性に一致させるた−めの補正を行
なう。The control unit 8 checks the output characteristics as shown in FIG. 3, and performs correction to match the original output characteristics.
チェック終了後、作業者が従来の加工条件をセットすれ
ば、コントロール部８から校正された信号が、レーザ発
振器１に送られ、従来と同一レーザ出力で加工が行なえ
ることになる。After the check is completed, if the operator sets the conventional machining conditions, a calibrated signal is sent from the control section 8 to the laser oscillator 1, and machining can be performed with the same laser output as the conventional one.
発明の効果
以上のように本発明によれば、長期にわたり、安定した
加工が可能となり、レーザ加工の信頼性向上に寄与し、
レーザ加工普及及び産業界に及ぼす効果は絶大である。Effects of the Invention As described above, the present invention enables stable processing over a long period of time, contributes to improving the reliability of laser processing,
The effect on the spread of laser processing and the industry will be tremendous.
第１図は本発明の一実施例を示すレーザ加工装置の正面
図、第２図は従来例のレーザ加工装置の正面図、第３図
は放電電流とレーザ出力の特性を示した特性図である。
１・・・・・・レーザ発振器、２・・・・・・全反射鏡
、３・・・・・・集光レンズ、４・・・・・・加工テー
ブル、５・・・・・・レーザ光、６・・・・・・被加工
物、７・・・・・・レーザ出力測定器、８・・・・・・
コントロール部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図Fig. 1 is a front view of a laser processing device showing an embodiment of the present invention, Fig. 2 is a front view of a conventional laser processing device, and Fig. 3 is a characteristic diagram showing characteristics of discharge current and laser output. be. 1... Laser oscillator, 2... Total reflection mirror, 3... Condensing lens, 4... Processing table, 5... Laser Light, 6... Workpiece, 7... Laser output measuring device, 8...
control section. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure
Claims (1)
等の光学系により加工テーブルまで導き、集光レンズに
より集光し、前記加工テーブル上の被加工物に照射し加
工するレーザ加工装置において、前記集光レンズを通過
後のレーザ光の出力を測定するレーザ出力測定器を具備
し、放電電流等のレーザ出力調整要素とレーザ出力の相
互関係を分析するコントロール部を具備したことを特徴
とするレーザ加工装置。In a laser processing apparatus, a laser beam extracted from a laser oscillator is guided to a processing table by an optical system such as a total reflection mirror, focused by a condensing lens, and irradiated onto a workpiece on the processing table for processing. Laser processing characterized by being equipped with a laser output measuring device that measures the output of the laser beam after passing through an optical lens, and a control section that analyzes the correlation between laser output adjustment elements such as discharge current and the laser output. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171562A JPH077859B2 (en) | 1985-08-02 | 1985-08-02 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60171562A JPH077859B2 (en) | 1985-08-02 | 1985-08-02 | Laser processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6231184A true JPS6231184A (en) | 1987-02-10 |
| JPH077859B2 JPH077859B2 (en) | 1995-01-30 |
Family
ID=15925436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60171562A Expired - Lifetime JPH077859B2 (en) | 1985-08-02 | 1985-08-02 | Laser processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077859B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58223391A (en) * | 1982-06-22 | 1983-12-24 | Nec Corp | Gas laser device |
| JPS6028290A (en) * | 1983-07-27 | 1985-02-13 | Nec Corp | Argon gas laser |
-
1985
- 1985-08-02 JP JP60171562A patent/JPH077859B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58223391A (en) * | 1982-06-22 | 1983-12-24 | Nec Corp | Gas laser device |
| JPS6028290A (en) * | 1983-07-27 | 1985-02-13 | Nec Corp | Argon gas laser |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH077859B2 (en) | 1995-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |