JPS62295371A - Connector - Google Patents
ConnectorInfo
- Publication number
- JPS62295371A JPS62295371A JP13620886A JP13620886A JPS62295371A JP S62295371 A JPS62295371 A JP S62295371A JP 13620886 A JP13620886 A JP 13620886A JP 13620886 A JP13620886 A JP 13620886A JP S62295371 A JPS62295371 A JP S62295371A
- Authority
- JP
- Japan
- Prior art keywords
- insulating plate
- melting point
- low melting
- point solder
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 46
- 238000002844 melting Methods 0.000 claims description 44
- 230000008018 melting Effects 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明はコネクタに係り、とくに接続される二基板間の
位置ずれに対して信頼性の高い接続に好適なコネクタに
関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a connector, and in particular, a connector suitable for highly reliable connection against misalignment between two boards to be connected. Regarding.
従来、基板間を接読する場合には、はんだ接続およびコ
ネクタが使用されているが、保守調整のために取外す必
要がある場合には、一段にコネクタを使用する方が好ま
しい。Traditionally, solder connections and connectors have been used for direct reading between boards, but it is even more preferable to use connectors when removal is required for maintenance adjustments.
前記コネクタは一般的にはコネク々と呼ばれるものと、
ピンなどの機械的に接続するものとが使用されているが
端子数が多くなると接触力が大きくなって挿抜に大きな
力を必要とする。The connector is generally called a connector,
Mechanical connections such as pins are used, but as the number of terminals increases, the contact force increases and a large amount of force is required for insertion and removal.
そこで、零挿抜力（Ｚ Ｉ Ｆ）コネクタが開発されて
きた。これにも機械的なものと、はんだ接続を利用した
ものとがある。Therefore, zero insertion/extraction force (Z IF) connectors have been developed. There are also mechanical types and types using solder connections.
前記はんだ接続を利用したものとしては、従来たとえば
特開昭５８−８０８５７号および特開昭５８−１６９９
９６号が提案されている。Conventionally, for example, JP-A-58-80857 and JP-A-58-1699 utilize the solder connection.
No. 96 is proposed.
前者は、フレキシブル基板上の配線に連らなる電極をは
んだ接続するもので、フレキシブル基板の可撓性による
位置ずれを吸収するものである。The former method involves connecting electrodes connected to wiring on a flexible substrate by soldering, and absorbs positional deviations due to the flexibility of the flexible substrate.
また後者は、ヒータを内蔵する絶縁板の穴に低融点金属
をプールし、この穴の一方から一方の基板に設置された
ピンを挿入し、他方を他方の基板上の電極と前記低融点
金属との接触で接続されるコネクタについて記載されて
いる。In the latter case, a low melting point metal is pooled in a hole in an insulating board containing a heater, a pin installed on one board is inserted from one of the holes, and the other is connected to an electrode on the other board with the low melting point metal. It describes connectors that are connected by contact with.
〔発明が解決しようとする問題点〕
前記前者の従来技術においては、フレキシブル基板が一
般に耐熱性の理由でヒータを内蔵することができないの
で、大きな形状のボードをペイバーリフローなどにより
接続する必要がある。そのため組立時のプロセスが容易
でない問題がある。[Problems to be Solved by the Invention] In the former conventional technology, it is generally not possible to incorporate a heater into the flexible substrate due to its heat resistance, so it is necessary to connect large-sized boards by paver reflow, etc. . Therefore, there is a problem that the assembly process is not easy.
また前記後者の従来技術においては、周囲の環境温度の
変化などに対して材料の熱膨張量の差から位置ずれを発
生するが、これを微細なピンおよび低融点はんだの弾性
変形により吸収している。In addition, in the latter conventional technology, misalignment occurs due to differences in thermal expansion of materials due to changes in ambient temperature, etc., but this is absorbed by the elastic deformation of fine pins and low melting point solder. There is.
しかるに、前記ピンおよび低融点はんだの吸収Ｖは小さ
いので、基板間の位置ずれに伴なって信頼性が低下する
問題があった。However, since the absorption V of the pin and the low melting point solder is small, there is a problem in that reliability decreases as the substrates are misaligned.
本発明の目的は、前記従来技術の問題を解決し、組立時
のプロセスを容易にし、かつ組立時および接続後の熱膨
張差などによる位置ずれを防止し、信頼性の向上を可能
とするコネクタを提供することにある。It is an object of the present invention to provide a connector that solves the problems of the prior art, facilitates the assembly process, prevents positional displacement due to differences in thermal expansion during assembly and after connection, and improves reliability. Our goal is to provide the following.
前記の目的は互いに積層する如く固定された絶縁板と第
２絶縁板とを設け、前記第１絶縁板に低融点はんだを介
してピンを挿入すにための穴を設け、前記第２絶縁板の
前記第１絶縁板よりはみ出した部分上に前記低融点はん
だと電気的に接続する外部への取出し電極と、前記いず
れか一方の絶縁板に前記低融点はんだを溶かすためのヒ
ータを設けることにより達成される。The purpose of the above is to provide an insulating plate and a second insulating plate fixed so as to be stacked on each other, to provide a hole in the first insulating plate through which a pin is inserted through a low melting point solder, and to provide a hole for inserting a pin into the first insulating plate through a low melting point solder. By providing an external lead electrode electrically connected to the low melting point solder on a portion protruding from the first insulating plate, and a heater for melting the low melting point solder on one of the insulating plates. achieved.
本発明は、ヒータ加熱によりピンなどが熱膨張により変
位するのをフレキシブル基板の可撓性により吸収するこ
とができるので信頼性を向上することができる。According to the present invention, the flexibility of the flexible substrate can absorb the displacement of the pins and the like due to thermal expansion caused by heating by the heater, so that reliability can be improved.
また各低融点はんだは別個の外部取出し電極に接続する
電極に接続しているので、各低融点はんだの影古が他の
低融点はんだに与られるのを防止することができる。Moreover, since each low melting point solder is connected to an electrode connected to a separate external electrode, it is possible to prevent the influence of each low melting point solder from being applied to other low melting point solders.
さらに第２絶縁板の第１絶縁板よりはみ出した部分にフ
レキシブル基板を接続し、第２絶縁仮に設けたヒータお
よび低融点はんだ用電源とフレキシブル基板に設置した
外部取出電極とを接続したので、第１基板のピンと第２
基板のピンとを容易に接続することができる。Furthermore, a flexible board was connected to the part of the second insulating board that protruded from the first insulating board, and the heater and low melting point solder power supply temporarily installed in the second insulating board were connected to the external electrode installed on the flexible board. 1 board pin and 2nd board
It can be easily connected to the pins of the board.
これに加えて第１基板が大きなサイズの場合、複数個の
コネクタを設け、これら複数個のコネクタのヒータを直
線的に接続したので、すべてのヒータを一括して接続す
ることができ、これによって１個のコネクタの場合に発
生するピンおよび低融点はんだに与えられる過度の応力
および歪を防止して信頼性を向上することができる。In addition, when the first board is large in size, multiple connectors are provided and the heaters of these multiple connectors are connected linearly, so all heaters can be connected at once. Reliability can be improved by preventing excessive stress and strain on the pins and low melting point solder that would otherwise occur in a single connector.
以下、本発明の１実施例を示す第１図乃至第３図につい
て説明する。第１図は本発明によるコネクタ１例を用い
た接続装置の１例を示す１部断面側面図、第２図は第１
図に示す第１絶縁板の平面図、第３図は第１図に示す第
２絶縁板に設けた配線の展開図である。Hereinafter, a description will be given of FIGS. 1 to 3 showing one embodiment of the present invention. FIG. 1 is a partially sectional side view showing an example of a connecting device using an example of a connector according to the present invention, and FIG.
3 is a plan view of the first insulating plate shown in the figure, and FIG. 3 is a developed view of the wiring provided on the second insulating plate shown in FIG.
同図に示す如く、コネクタ１は第１絶縁板２と、第２絶
縁板３と、この第１絶縁板２に形成された６個の穴４内
に充填された低融点はんだ５と、この低融点はんだ５を
溶かすため第２ｉ色縁板３に設置されたヒータ６とから
構成されている。前記６個の穴４内には第１基板１４に
設置された６ ？！！、Ｉのピン１５の先端部を挿入し
ている。前記第２′！ｒ色縁坂３は前記第１絶縁板２と
ともにシリコンにて形成され拡散整合などにより１体に
固定される。また前記第２絶縁板３は前記第１絶縁板２
よりはみ出した部分３ａの先端部を上方に折り曲げてそ
の側面３ｂを第２基板７と対向している。さらに、前記
第２絶縁板３は前記６個の穴４の底部と夫々対向する位
置に設置された６個の低融点はんだ用電極８と、これら
６個の低融点はんだ用電極８に接続し互いに平行に配置
された配線９と、この配線９に接続し前記側面３ｂに設
置された６個の外部取出し電極１０と、前記６個の低融
点はんだ用電極８の三方を囲む如く［形状し前記低融点
はんだ５を加熱して溶かすためのヒータ６と、このヒー
タ６の両端部に接続し、前記配線９の外側に平行に配置
されたヒータ用配線１２と、このヒータ用配線１２に接
続し前記側面３ｂに設置された２個のヒータ用外部取出
し電極１３とを有している。これら２個のヒータ用外部
取出し電極１３および前記６個の外部取出し電極１０は
はんだ（図示せず）にて前記第２基板７に直接接続する
かあるいは図示の如く第２基板７に設置されたと７１６
に接続している。なお前記６個の穴４は低融点はんだ５
を保持するため、あらかじめメタライズ（図示せず）を
施した方が好ましい。As shown in the figure, the connector 1 includes a first insulating plate 2, a second insulating plate 3, a low melting point solder 5 filled in six holes 4 formed in the first insulating plate 2, and a low melting point solder 5 filled in six holes 4 formed in the first insulating plate 2. The heater 6 is installed on the second i-th color edge plate 3 to melt the low melting point solder 5. Inside the six holes 4 are holes 6 installed on the first substrate 14 . ! ! , I insert the tip of the pin 15. Said 2'! The r-color edge slope 3 is made of silicon together with the first insulating plate 2, and is fixed together by diffusion matching or the like. Further, the second insulating plate 3 is the first insulating plate 2.
The tip of the protruding portion 3a is bent upward so that its side surface 3b faces the second substrate 7. Furthermore, the second insulating plate 3 is connected to six low melting point solder electrodes 8 installed at positions facing the bottoms of the six holes 4, and these six low melting point solder electrodes 8. Wires 9 arranged parallel to each other, six external lead-out electrodes 10 connected to the wires 9 and installed on the side surface 3b, and six low-melting point solder electrodes 8 surrounded on three sides. A heater 6 for heating and melting the low melting point solder 5; a heater wiring 12 connected to both ends of the heater 6 and arranged parallel to the outside of the wiring 9; and a heater wiring 12 connected to the heater wiring 12. It also has two external heater electrodes 13 installed on the side surface 3b. These two heater external electrodes 13 and the six external electrodes 10 are either directly connected to the second substrate 7 with solder (not shown) or are installed on the second substrate 7 as shown. 716
is connected to. Note that the six holes 4 are filled with low melting point solder 5.
In order to maintain this, it is preferable to apply metallization (not shown) in advance.
本発明によるコネクタの１例を用いた接続装置は前記の
如く構成されているから、つぎに２個の基板７，１４を
接続する方法について述べる。Since the connecting device using one example of the connector according to the present invention is constructed as described above, the method for connecting the two boards 7 and 14 will be described next.
先づ、６個の穴４の底部と６個の低融点はんだ用電極８
とを位置合せしたのち、拡散整合などにより２個の絶縁
板２．３を１体的に固定する。First, connect the bottoms of the six holes 4 and the six low melting point solder electrodes 8.
After aligning the two insulating plates 2.3, the two insulating plates 2.3 are integrally fixed by diffusion matching or the like.
ついで、前記第２絶縁板３のはみ出し部分３ａの先端側
面３ｂに設置された６個の外部取出し電極１゜および２
個のヒータ用外部取出し電極１３を第２基板７にはんだ
にて接続する。Next, six external electrodes 1° and 2 are installed on the tip side surface 3b of the protruding portion 3a of the second insulating plate 3.
The external heater electrodes 13 are connected to the second substrate 7 with solder.
しかるのち、あらかじめメタライズを施した６個の穴４
内に第１基板１４に設置されたピン１５の先端部および
低融点はんだ５を挿入し、第２基板７から２個のヒータ
用外部取出し電極１３を介して２個のヒータ１１に通電
するとヒータ６の加熱により前記低融点はんだ５が溶け
て前記ピン１５および前記低融点はんだ用電極８に接続
する。Afterwards, the six holes 4 that have been metallized in advance are
When the tip of the pin 15 installed on the first substrate 14 and the low melting point solder 5 are inserted into the inside, and the two heaters 11 are energized from the second substrate 7 through the two external heater electrodes 13, the heaters are activated. 6 melts the low melting point solder 5 and connects it to the pin 15 and the low melting point solder electrode 8.
この場合、前記ヒータ６の加熱により第１絶縁板２およ
び第２絶縁板３などが熱膨張するが、ごれらは、第２絶
縁板３のはみ出した部分３ａの先端折り曲げ部分にて吸
収することができる。In this case, the first insulating plate 2, the second insulating plate 3, etc. thermally expand due to the heating by the heater 6, but the dirt is absorbed by the bent end portion of the protruding portion 3a of the second insulating plate 3. be able to.
したがって組立プロセスが容易となりかつ信頼性を向上
することができる。Therefore, the assembly process becomes easier and reliability can be improved.
しかるに用途によっては前記第２絶縁仮３のはみ出した
部分３ｂの先端折りまげ部分では吸収が不十分な場合が
ある。この場合には、つぎに述べる本発明の他の一実施
例が好ましい。However, depending on the application, absorption may not be sufficient at the folded end portion of the protruding portion 3b of the second temporary insulating material 3. In this case, another embodiment of the present invention described below is preferable.
すなわち、第４図は本発明によるコネクタの他の１例を
用いた接続装置の１例を示す１部断面側面図、第５図は
第４図に示す第２絶縁板の平面図、第６図は第４図に示
すフレキシブル基板に設けた配線の展開図である。なお
、本実施例においては、第１絶縁板、低融点はんだ、ヒ
ータ、第１基板、ピン、第２基板、ピンは前記実施例と
同一であるから前記実施例を示す第１図乃至第３０と同
一符号をもって示す。That is, FIG. 4 is a partially sectional side view showing an example of a connecting device using another example of the connector according to the present invention, FIG. 5 is a plan view of the second insulating plate shown in FIG. 4, and FIG. The figure is a developed view of the wiring provided on the flexible substrate shown in FIG. 4. Note that in this embodiment, the first insulating plate, low melting point solder, heater, first substrate, pin, second substrate, and pin are the same as those in the previous embodiment, so FIGS. It is indicated with the same symbol as.
同図に示す如く、第２絶縁板１７は第１絶縁仮２よりは
み出した部分１７ａを形成し、前記第１絶縁板２に形成
された６個の穴イの底部に対向位置に設置された６個の
低融点はんだ用型ｔｉ１８と、これら６個の低融点はん
だ用電極１８に夫々接続し、互いに平行に配置された配
線１９と、この配線１９に接続し、前記はみ出した部分
１７ａに設けた６個の外部取り出し電極２０と、前記６
個の低融点はんだ用電極１８の三方を囲む如く［形状に
形成されたヒータ６と、このヒータ６の両端部に接続し
、前記配線１９の外側に平行に配置されたヒータ用配線
２１と、このヒータ用電ｖＡ２１に接続し前記はみ出し
た部分１７ａに設けた２個のヒータ用外部取出し電極２
２とを有している。フレキシブル基板２３は可撓性材料
にて」形状に形成され、前記６個の外部取出し電極２０
および２個のヒータ用外部取出し電極２２と１よんだ３
２にて接続する８個の電＋Ｍ２５．２６と、これらの電
極２５．２６に接続し互いに平行に配置された配線２７
．２８と、これらの配線２７．２８に接続し、かつ第２
基板７の８個のピン１６に接続する８個の外部取出し電
極２９．３０と、該フレキシブル基板２３の可撓性を高
めるため前記配線２６．２７間に平行に形成された３個
のスリット３１とを有している。As shown in the figure, the second insulating plate 17 forms a portion 17a that protrudes from the first insulating plate 2, and is installed at the bottom of six holes formed in the first insulating plate 2 at opposing positions. six low melting point solder molds 18, wirings 19 connected to these six low melting point solder electrodes 18 and arranged parallel to each other; The six external lead-out electrodes 20 and the six external electrodes 20
A heater 6 formed in a shape so as to surround three sides of the low melting point solder electrodes 18, and heater wiring 21 connected to both ends of the heater 6 and arranged parallel to the outside of the wiring 19, Two external heater electrodes 2 connected to this heater voltage vA21 and provided on the protruding portion 17a
2. The flexible substrate 23 is made of a flexible material and is shaped like a
and two heater external electrodes 22 and 1 readout 3
8 electrodes 25.26 connected at 2, and wiring 27 connected to these electrodes 25.26 and arranged parallel to each other.
．． 28, connected to these wirings 27 and 28, and connected to the second
Eight external lead-out electrodes 29.30 connected to the eight pins 16 of the substrate 7, and three slits 31 formed in parallel between the wirings 26.27 to increase the flexibility of the flexible substrate 23. It has
本発明によるコネクタの他の１例を用いた接続装置は前
記の如く構成されているから、つぎに２個の基板７．１
４を接続する方法について述べる。Since the connecting device using another example of the connector according to the present invention is constructed as described above, next, the two boards 7.1
The method for connecting 4 will be described below.
先づ、６個の穴４の底部と６個の低融点はんだ用電極１
８とを位置合わせたのち、第１絶縁仮２および第２絶縁
板１７を拡散整合などにより１体に固定する。First, the bottoms of the six holes 4 and the six low melting point solder electrodes 1
8, the first insulating temporary 2 and the second insulating plate 17 are fixed into one body by diffusion matching or the like.
ついでフレキシブル基板２３の８個の電極２５．２６と
第２絶縁板１７の６個の外部取出し電極２０および２個
のヒータ用外部取出し電極２２とをはんだにて接続する
とともに８個の外部取出し電極２９．３０を第２基板７
の８個のピン１６とはんだにて接続する。Next, the eight electrodes 25 and 26 of the flexible substrate 23 are connected to the six external electrodes 20 and the two heater external electrodes 22 of the second insulating plate 17 with solder, and the eight external electrodes are connected. 29.30 to the second board 7
Connect to the 8 pins 16 of 1 with solder.
しかるのち、あらかじめメタライズを施した６個の穴４
内に第１基板１４に設置されたピン１５の先端部および
低融点はんだ５を挿入し、第２基板７から２個のヒータ
用外部取出し電極２０．３０を介してヒータ６に通電す
ると、該ヒータ６の加熱により前記低融点はんだ５が溶
けて前記ピン１５および前記低融点はんだ用電極８に接
続する。Afterwards, the six holes 4 that have been metallized in advance are
When the tip of the pin 15 installed on the first substrate 14 and the low melting point solder 5 are inserted into the inside, and the heater 6 is energized from the second substrate 7 through the two heater external electrodes 20.30, the heater 6 is energized. The low melting point solder 5 is melted by heating by the heater 6 and connected to the pin 15 and the low melting point solder electrode 8.
この場合前記ヒータ６の加熱により第１絶縁板２および
第２絶縁板３など熱膨張するがこれらはフレキシブル基
板２３の可撓性により吸収することができる。In this case, the first insulating plate 2 and the second insulating plate 3 are thermally expanded due to heating by the heater 6, but this can be absorbed by the flexibility of the flexible substrate 23.
したがって、組立プロセスが容易となり、かつ信頼性を
向上することができる。Therefore, the assembly process becomes easier and reliability can be improved.
つぎに大きなサイズ基板間を接続する場合がある。この
場合には、１個のコネクタにて接続すると、基板とコネ
クタとの使用する材料の相異から熱膨張差が発生しピン
および低融点はんだに過度の応力および歪が与えられる
ので信頼性の点で問題を発生することがある。Next, there are cases where large size boards are connected. In this case, if a single connector is used for connection, a difference in thermal expansion will occur due to the difference in the materials used between the board and the connector, and excessive stress and strain will be applied to the pins and low melting point solder, resulting in poor reliability. Problems may occur at points.
このような場合には本発明のさらに他の一実施例を示す
第７図の如く構成することが良い。In such a case, it is preferable to configure the device as shown in FIG. 7, which shows still another embodiment of the present invention.
すなわち、第７図においては１個の第１基板１４に対し
て複数個（図では４個）の第２絶縁板１７および４個の
フレキシブル基板２３を使用し、各第２絶縁板１７に設
置されたヒータ６が直列に接続されるように第２基板７
の配ｖＡ３３を設けている。That is, in FIG. 7, a plurality of (four in the figure) second insulating boards 17 and four flexible boards 23 are used for one first board 14, and each second insulating board 17 is provided with a plurality of second insulating boards 17 and four flexible boards 23. The second substrate 7 is connected in series so that the heaters 6 are connected in series.
A distribution port A33 is provided.
したがって、本実施例において矢印に示す方向から配線
３１に通電すると、４個のヒータ６が一括して接続する
ので組立プロセスが容易となる。また、各コネクタに加
わる熱膨張量が減少してピンおよび低融点はんだに過度
の応力および歪が与えられるのを防止するので、信頼性
を向上することができる。Therefore, in this embodiment, when the wiring 31 is energized from the direction shown by the arrow, the four heaters 6 are connected together, which facilitates the assembly process. Furthermore, reliability can be improved because the amount of thermal expansion applied to each connector is reduced and excessive stress and strain are prevented from being applied to the pins and low melting point solder.
以上述べたる如く、本発明によれば組立時のプロセスを
容易にすることができ、かつ組立時および接続後のピン
などの位置づれを吸収して、信頼性の向上をはかること
ができる。As described above, according to the present invention, it is possible to simplify the process during assembly, and to improve reliability by absorbing misalignment of pins, etc. during assembly and after connection.
第１図は本発明によるコネクタの１例を用いた接続装置
の１例を示す１部所面側面図、第２図は第１図に示す第
１絶縁板の平面図、第３図は第１図に示す第２図絶縁板
に設けた配線の展開図、第４図は本発明によるコネクタ
の他の１例を用いた接続装置の１例を示す１部所面側面
図、第５図は第４図に示す第２絶縁仮の平面図、第６図
は第４図に示すフレキシブル基板に設けた配線の展開図
、第７図は本発明のさらに他の一実施例を示す接続装置
の説明図である。
１・・・コネクタ、２・・・第１絶縁板、３．１７・・
・第２絶縁板、４・・・穴、５・・・低融点はんだ、６
．１１・・・ヒータ、７・・・第２基板、８・・・低融
点はんだ用電極、９゜１９．３１・・・配線、１０．２
０・・・外部取出し電極、１２．２１・・・ヒータ用配
線、１３．２２・・・ヒータ用外部取出し電極、１４・
・・第１基板、２３・・・フレキシブル基板、２５゜２
６・・・電極。
代理人 弁理士 秋 本 正 実
μ本
第２ＴＸＪ 第 ３２Ｌ ゴネフグ
２．ｆｌ絶１４；＃ｌ１３．第２絶縛＃
次 す穴５ 柩融克Ｉν、に ７．第２基汲
８砥融鬼ｌ耘ど１独 ２紀諜／θタトｉｐ取出Ｌｔ８
ノ２．ｅ−７ＩＭＥｔｔｒ、ｆｌｋ ｔ３
ｂ７ｍタト匍Σ＄ａ叙ｔ’ｔ＆ １４ｔ１Ｍｉ。
１５、 ／ｌ、 ご６ン
第 ４ に
第５面ｖＪ６ＩＩｌ！ＩFIG. 1 is a partial side view showing an example of a connecting device using an example of the connector according to the present invention, FIG. 2 is a plan view of the first insulating plate shown in FIG. 1, and FIG. FIG. 2 is a developed view of wiring provided on an insulating board; FIG. 4 is a partial side view showing an example of a connecting device using another example of the connector according to the present invention; and FIG. is a plan view of the temporary second insulation shown in FIG. 4, FIG. 6 is a developed view of the wiring provided on the flexible board shown in FIG. 4, and FIG. 7 is a connection device showing still another embodiment of the present invention. FIG. 1... Connector, 2... First insulating plate, 3.17...
・Second insulating plate, 4... Hole, 5... Low melting point solder, 6
．． DESCRIPTION OF SYMBOLS 11... Heater, 7... Second board, 8... Low melting point solder electrode, 9°19.31... Wiring, 10.2
0... External lead-out electrode, 12.21... Wiring for heater, 13.22... External lead-out electrode for heater, 14.
...First board, 23...Flexible board, 25°2
6...electrode. Agent Patent Attorney Tadashi Akimoto Minoru 2nd TXJ 32L Gonefugu 2. fl extinct 14; #l13. 2nd Zetsubaku #
Next hole 5, 7. 2nd basis
8th Toruki l Yodo 1 German 2nd intelligence/θ Tato IP extraction Lt8
No2. e-7IMEttr, flk t3
b7m Tato 匍Σ$a t't & 14t1Mi. 15, /l, 6th page 5th page vJ6IIl! I
Claims (1)
縁板とを設け、前記第１絶縁板に低融点はんだを介して
ピンを挿入するための穴を設け、前記第２絶縁板の前記
第１絶縁板よりはみ出した部分上に前記低融点はんだと
電気的に接続する外部への取出し電極と、前記いずれか
一方の絶縁板に前記低融点はんだを溶かすためのヒータ
を設けたことを特徴とするコネクタ。 ２、前記第２絶縁板は前記第１絶縁板に積層する如く固
定されかつ前記第１絶縁板よりはみ出した部分に前記第
１絶縁板の前記低融点はんだと電気的に接続する外部へ
の取出し電極を有する絶縁板と、前記外部への取出し電
極および前記ヒータに配線を介して接続する外部への取
出し電極を有するフレキシブル基板とから構成されてい
ることを特徴とする特許請求の範囲第１項記載のコネク
タ。 ３、前記基板１個に対して前記第１絶縁板と前記絶縁板
と、前記フレキシブル基板とを複数個設け、前記絶縁板
と前記フレキシブル基板とを直列に接続したことを特徴
とする特許請求の範囲第２項記載のコネクタ。[Claims] 1. A first insulating plate and a second insulating plate fixed to each other in a stacked manner are provided, and a hole is provided in the first insulating plate through a low melting point solder for inserting a pin, an external lead electrode electrically connected to the low melting point solder on a portion of the second insulating plate protruding from the first insulating plate; and an electrode for melting the low melting point solder to one of the insulating plates. A connector characterized by being equipped with a heater. 2. The second insulating plate is fixed to the first insulating plate so as to be laminated thereon, and a portion of the second insulating plate protruding from the first insulating plate is electrically connected to the low melting point solder of the first insulating plate to the outside. Claim 1, characterized in that the flexible substrate is comprised of an insulating plate having an electrode, and a flexible substrate having an external lead electrode connected to the outside lead electrode and the heater via wiring. Connector listed. 3. A plurality of the first insulating plates, the insulating plates, and the flexible substrates are provided for one substrate, and the insulating plates and the flexible substrates are connected in series. Connector described in scope 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13620886A JPS62295371A (en) | 1986-06-13 | 1986-06-13 | Connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13620886A JPS62295371A (en) | 1986-06-13 | 1986-06-13 | Connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62295371A true JPS62295371A (en) | 1987-12-22 |
Family
ID=15169844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13620886A Pending JPS62295371A (en) | 1986-06-13 | 1986-06-13 | Connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295371A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020148479A (en) * | 2019-03-11 | 2020-09-17 | 株式会社日本マイクロニクス | Electrical connection device |
-
1986
- 1986-06-13 JP JP13620886A patent/JPS62295371A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020148479A (en) * | 2019-03-11 | 2020-09-17 | 株式会社日本マイクロニクス | Electrical connection device |
| KR20210126717A (en) * | 2019-03-11 | 2021-10-20 | 가부시키가이샤 니혼 마이크로닉스 | electrical connector |
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