JPS6228437U

JPS6228437U -

Info

Publication number: JPS6228437U
Application number: JP11726185U
Authority: JP
Priority date: 1985-08-01
Filing date: 1985-08-01
Publication date: 1987-02-20

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案に従つて構成された支持具の
一具体例を示す側面図。第２図は、第１図の支持
具を分解して示す分解斜視図。第３図は、第１図
における−線による断面図。第４図は、第３
図における−線から見たところを一部拡大し
て示す図。第５図は、支持具の変形例を示す横断
面図。第６図は、第５図における−線から見
たところを一部拡大して示す断面図。第７図は、
保持ロツドに形成された第２図の保持溝の他の例
を示す拡大断面図。２ａ，２ｂ，１０２ａ及び１０２ｂ……端板、
４ａ，４ｂ，４ｃ，４ｄ，１０４ａ，１０４ｂ及
び１０４ｃ……保持ロツド、２８及び１２８……
第１の保持溝。３０及び１３０……第２の保持溝
、Ｐ……半導体ウエーハ。 FIG. 1 is a side view showing a specific example of a support constructed according to the present invention. FIG. 2 is an exploded perspective view of the support shown in FIG. 1; FIG. 3 is a sectional view taken along the - line in FIG. 1. Figure 4 shows the third
FIG. 3 is a partially enlarged view of the view taken from the - line in the figure. FIG. 5 is a cross-sectional view showing a modified example of the support. FIG. 6 is a partially enlarged sectional view taken from the - line in FIG. 5; Figure 7 shows
FIG. 3 is an enlarged sectional view showing another example of the retaining groove of FIG. 2 formed in the retaining rod. 2a, 2b, 102a and 102b...end plates,
4a, 4b, 4c, 4d, 104a, 104b and 104c...holding rods, 28 and 128...
First retaining groove. 30 and 130... second holding groove, P... semiconductor wafer.

Claims

【実用新案登録請求の範囲】１半導体ウエーハ又はその類似物を支持するた
めの支持具にして、間隔を置いて配設された２個
の端板と、該端板間を延びる少なくとも３本の保
持ロツドを含み、支持具への半導体ウエーハ又は
その類似物の装着方向に見て少なくとも１体の保
持ロツドは他の保持ロツドよりも後側に位置し、
該装着方向に見て前側に位置する保持ロツドの各
々には、その長手方向に間隔を置いて複数個の比
較的幅の狭い第１の保持溝が形成され、該装着方
向に見て後側に位置する保持ロツドには、該前側
に位置する保持ロツドの各々に形成された該複数
個の第１の保持溝に対応して、その長手方向に間
隔を置いて複数個の比較的幅の広い第２の保持溝
が形成され、該前側に位置する保持ロツドの各々
に形成された第１の保持溝と該後側に位置する保
持ロツドに形成された第２の保持溝が半導体ウエ
ーハはその類似物を支持する一組の保持構を構成
し、半導体ウエーハ又はその類似物を該一組の保
持溝内に所要の通り装着すると、半導体ウエーハ
又はその類似物は先端側が下方に傾斜する状態に
支持される、ことを特徴とする支持具。２該一組の保持溝の該第２の保持溝の上側端は
該第１の保持溝の上側端と実質上同一レベルであ
り、該第２の保持溝の下側端は該第１の保持溝の
下測端より下方に位置する、実用新案登録請求の
範囲第１項記載の支持具。３該第２の保持溝は、その全幅に渡つて実質上
同一の深さであり、半導体ウエーハ又はその類似
物を該一組の保持溝内に所要の通り装着すると、
半導体ウエーハ又はその類似物は自重によつてそ
の先端部が該第２の保持溝内を下方に移動して該
下側端に当接し、かくしてその先端側が下方に傾
斜する状態に支持される、実用新案登録請求の範
囲第２項記載の支持具。４該第２の保持溝は該上側端から該下側端に向
つてその深さが漸次深くなつており、半導体ウエ
ーハ又はその類似物を該一組の保持溝内に所要の
通り装着する際には該装着方向の移動に伴つてそ
の先端部が該第２の保持溝の傾斜底面に案内され
て下方に移動し、かくして所要の通り装着すると
、半導体ウエーハ又はその類似物は先端部が該第
２の保持溝の該下側端に当接し、その先端側が下
方に傾斜する状態に支持される、実用新案登録請
求の範囲第２項記載の支持具。５該端板間に相互に実質上平行に延びる４本の
保持ロツドを含み、支持具への半導体ウエーハ又
はその類似物の該装着方向に見て２本の保持ロツ
ドは他の２本の保持ロツドよりも後側に位置し、
該装着方向に見て前側に位置する２本の保持ロツ
ドの各々には該複数個の第１の保持溝が形成され
、該装着方向に見て後側に位置する２本の保持ロ
ツドの各々には該複数個の第２の保持溝が形成さ
れている、実用新案登録請求の範囲第１項乃至第
４項のいずれかに記載の支持具。６該端板及び該保持ロツドはシリコン製及び又
はシリコンカーバイド製である、実用新案登録請
求の範囲第１項乃至第５項のいずれかに記載の支
持具。７該端板及び該保持ロツドは石英ガラス製であ
る、実用新案登録請求の範囲第１項乃至第５項の
いずれかに記載の支持具。[Claims for Utility Model Registration] 1. A support for supporting a semiconductor wafer or the like, comprising two end plates spaced apart and at least three end plates extending between the end plates. including holding rods, at least one of the holding rods being located on the rear side of the other holding rods when viewed in the direction of mounting the semiconductor wafer or the like on the support;
A plurality of relatively narrow first retaining grooves are formed at intervals in the longitudinal direction of each of the retaining rods located on the front side as viewed in the mounting direction, and a plurality of relatively narrow first retaining grooves are formed on the rear side as viewed in the mounting direction. The retaining rod located at the front side has a plurality of relatively wide retaining grooves spaced apart in the longitudinal direction corresponding to the plurality of first retaining grooves formed in each of the retaining rods located at the front side. A wide second holding groove is formed, and the first holding groove formed in each of the holding rods located on the front side and the second holding groove formed on the holding rod located on the rear side are connected to A set of holding structures for supporting the semiconductor wafer or the like is configured, and when the semiconductor wafer or the like is installed in the set of holding grooves as required, the semiconductor wafer or the like is in a state where the leading end side is inclined downward. A support device characterized by being supported by. 2. The upper end of the second retaining groove of the set of retaining grooves is substantially at the same level as the upper end of the first retaining groove, and the lower end of the second retaining groove is at the same level as the upper end of the first retaining groove. The support according to claim 1, which is located below the lower measuring end of the holding groove. 3. said second retaining grooves are of substantially the same depth over their entire width, and upon the desired loading of a semiconductor wafer or the like within said set of retaining grooves;
The semiconductor wafer or the like is supported such that its leading end moves downward in the second holding groove due to its own weight and comes into contact with the lower end, so that its leading end is tilted downward. The support device according to claim 2 of the utility model registration claim. 4. The second holding groove has a depth that gradually increases from the upper end to the lower end, and when a semiconductor wafer or the like is mounted as required in the set of holding grooves. As the wafer moves in the mounting direction, its leading end is guided by the inclined bottom surface of the second holding groove and moves downward, and when the semiconductor wafer or the like is mounted as desired, the leading end of the semiconductor wafer or the like moves downward. The support according to claim 2, which is supported in a state where the support is in contact with the lower end of the second holding groove and its tip side is inclined downward. 5 including four retaining rods extending substantially parallel to each other between the end plates, two retaining rods extending in the direction of the attachment of the semiconductor wafer or the like to the support; Located behind the rod,
The plurality of first holding grooves are formed in each of the two holding rods located on the front side as seen in the mounting direction, and the plurality of first holding grooves are formed in each of the two holding rods located on the rear side as seen in the mounting direction. The support device according to any one of claims 1 to 4, wherein the plurality of second holding grooves are formed in the support device. 6. The support according to any one of claims 1 to 5, wherein the end plate and the holding rod are made of silicon and/or silicon carbide. 7. The support according to any one of claims 1 to 5, wherein the end plate and the holding rod are made of quartz glass.