JPS6228243A - Manufacture of laminated board for chemical plating - Google Patents
Manufacture of laminated board for chemical platingInfo
- Publication number
- JPS6228243A JPS6228243A JP60167731A JP16773185A JPS6228243A JP S6228243 A JPS6228243 A JP S6228243A JP 60167731 A JP60167731 A JP 60167731A JP 16773185 A JP16773185 A JP 16773185A JP S6228243 A JPS6228243 A JP S6228243A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- chemical plating
- plating
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
Landscapes
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、紫外線の透過防止に極めて優れた効果をもつ
化学めっき用積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate for chemical plating which has an extremely excellent effect in preventing the transmission of ultraviolet rays.
化学めっき用積層板を周知のアディティブプロセスによ
りプリント配線板に加工する場合、高次のよりな工程が
ある。When processing a chemical plating laminate into a printed wiring board using a well-known additive process, there are many high-order steps.
Ａ化学めっき用積層板のＮＣドリルによる穴あけＢ接着
剤表面の化学エツチング
Ｃ接着剤表面及び大内全てに対する化学めっき用触媒付
与
り接着剤表面への液状めっきレジストの塗工Ｅめっきレ
ジストの露光、現像、・？ターンニング
Ｆ化学めっき
Ｇプリント配線板
前記工程において、工程りの液状めっきレジストの塗工
時、工程Ａで形成した穴内にめっきレジストが入シ、工
程Ｅの露光によシ穴内に入っためっきレジストが感光、
硬化し、工程Ｆの化学めっき時に穴内のめっきレジスト
上にめっきが析出せず、スルホール内のめっき析出不良
の原因となることがある。A: Drilling holes in the laminate for chemical plating using an NC drill B: Chemical etching of the adhesive surface C: Applying a catalyst for chemical plating to the adhesive surface and all parts of the interior; Applying liquid plating resist to the adhesive surface; E: Exposure of the plating resist; developing,·? Turning F Chemical plating G Printed wiring board In the above process, when applying the liquid plating resist in the step, the plating resist enters the hole formed in step A, and the plating resist enters the hole in the exposure in step E. is photosensitive,
When hardened, plating may not be deposited on the plating resist inside the hole during chemical plating in step F, which may cause poor plating deposition inside the through hole.
この原因、機構については、めっきレジスト層を通過し
た光が、化学めっき用積層板の基材であルカラスクロス
のガラスフィラメントによシ屈折し、穴壁上のめっきレ
ジストを感光、硬化させることが考えられる。The cause and mechanism for this is that the light that has passed through the plating resist layer is refracted by the glass filament of glass cloth, which is the base material of the chemical plating laminate, and the plating resist on the hole wall is exposed to light and hardened. is possible.
本発明者らは、前記のような穴壁に付着しためっきレジ
ストが感光、硬化しないように鋭意研究した結果、接着
剤層に紫外線透過防止の機能を付与することによシ、前
記目的を達成できることを見い出し本発明を完成したも
のである。As a result of extensive research into preventing the plating resist attached to the hole walls from being exposed to light and hardening, the inventors of the present invention have achieved the above objective by providing the adhesive layer with a function of preventing UV transmission. The present invention was completed by discovering what could be done.
本発明は、合成ゴムを含む硬化性樹脂よりなる接着剤層
を熱硬化性樹脂積層板の両表面に形成した化学めっき用
積層板の製造方法において、前記熱硬化性樹脂積層板の
表面層を構成する樹脂含浸基材の樹脂中に１０ ｎｍ
〜４５０ ｎｍＫ吸収ピークを示す有機紫外線吸収物質
を０．１〜５．０重量％配合し、更に前記接着剤層中に
最大粒径２０μｍ以下の無機酸化物を０．１〜２０重ｉ
％配合することを特徴とする化学めっき用積層板の製造
方法である。The present invention provides a method for producing a chemical plating laminate in which an adhesive layer made of a curable resin containing synthetic rubber is formed on both surfaces of a thermosetting resin laminate, in which the surface layer of the thermosetting resin laminate is 10 nm in the resin of the constituent resin-impregnated base material
0.1 to 5.0% by weight of an organic ultraviolet absorbing substance exhibiting an absorption peak of ~450 nmK is blended, and 0.1 to 20% by weight of an inorganic oxide with a maximum particle size of 20 μm or less is added to the adhesive layer.
% of the chemical plating laminate.
本発明に用いられる有機紫外線吸収物質は、ヒドロキシ
ベンゾフェノン類、ヒドロキシフェニルベンゾトリアゾ
ール類であり、例えば、２−ヒドロキシ−４−オクトキ
シベンゾフェノン、２−（２’−ヒ）’Ｏキシー５′−
メチルフェニル）−ベンツトリアゾール、２−（２’−
ヒドロキシ−３’−ｔ−ブチル−５′−メチルフェニル
）−５−１’ロロペンゾトリアゾール、２−（２’−ヒ
ドロキシ−５′−ｔ−オクチルフェニル）−ベンゾトリ
アゾール、２−（３−ｔ−ブチル−５−メチル−２−ヒ
ドロキシフェニル）−５−クロロベンゾトリアゾールな
どをあげることができる。これらはいずれも１゜ｎｍ〜
４５０ｎｍの波長領域で光吸収ピークを示すものである
。本発明に使用するのに特に適したものは、２−（２’
−ヒドロキシ−３′−ｔ−ブチル−５′−メチルフェニ
ル）−５−クロロベンゾトリアゾール及び２−（３−ｔ
−ブチル−５−メチル−２−ヒドロキシフェニル）−５
−クロロベンツトリアゾールである。The organic ultraviolet absorbing substances used in the present invention are hydroxybenzophenones and hydroxyphenylbenzotriazoles, such as 2-hydroxy-4-octoxybenzophenone, 2-(2'-hi)'Oxy5'-
methylphenyl)-benztriazole, 2-(2'-
Hydroxy-3'-t-butyl-5'-methylphenyl)-5-1'loropenzotriazole, 2-(2'-hydroxy-5'-t-octylphenyl)-benzotriazole, 2-(3- Examples include t-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole. All of these are 1゜nm~
It shows a light absorption peak in the wavelength region of 450 nm. Particularly suitable for use in the present invention are 2-(2'
-hydroxy-3'-t-butyl-5'-methylphenyl)-5-chlorobenzotriazole and 2-(3-t
-butyl-5-methyl-2-hydroxyphenyl)-5
-Chlorobenztriazole.
また、本発明に用いられる無機酸化物は、酸化マグネシ
ウム、酸化アルミニウム、酸化鉄、酸化チタン、酸化亜
鉛、酸化鉛、酸化珪素などをあげることができる。これ
らのうち本発明に使用するのに適したものは酸化チタン
である。Inorganic oxides used in the present invention include magnesium oxide, aluminum oxide, iron oxide, titanium oxide, zinc oxide, lead oxide, silicon oxide, and the like. Among these, titanium oxide is suitable for use in the present invention.
本発明の製造方法について説明すると、通常用いる熱硬
化性樹脂フェノ中に前記した有機紫外線吸収物質を溶解
しておき、ガラス織布等の基材に含浸させて熱硬化性樹
脂含浸基材を得、これを表面層の１層又は複数層とし、
有機紫外線吸収物質を含有しない熱硬化性樹脂含浸基材
を内層として重ね合わせ、加熱加圧成形して積層板を得
る。この積層板の表面に前記の無機酸化物を含有する接
着剤を塗布・乾燥することによシ、接着剤層を有する化
学めっき用積層板を得る。To explain the manufacturing method of the present invention, the organic ultraviolet absorbing substance described above is dissolved in a commonly used thermosetting resin pheno, and a substrate such as a glass woven cloth is impregnated to obtain a thermosetting resin-impregnated substrate. , this is one layer or multiple layers of the surface layer,
A thermosetting resin-impregnated base material containing no organic ultraviolet absorbing substance is laminated as an inner layer, and the laminate is molded under heat and pressure to obtain a laminate. A laminate for chemical plating having an adhesive layer is obtained by applying an adhesive containing the inorganic oxide to the surface of this laminate and drying it.
このように、有機紫外線吸収物質と無機酸化物とを併用
し、かつ接着剤層には無機酸化物のみを配合するので、
本発明により得られた化学めっき用積層板は、化学めっ
き後における銅皮膜の密着性、はんだ付は耐熱性に全く
悪影響を与えることなく、すぐれた紫外線透過防止効果
を発揮することができる。In this way, since an organic ultraviolet absorbing substance and an inorganic oxide are used together, and only the inorganic oxide is blended into the adhesive layer,
The chemical plating laminate obtained according to the present invention can exhibit excellent ultraviolet transmission prevention effects without any adverse effect on the adhesion of the copper film after chemical plating or the heat resistance during soldering.
有機紫外線吸収剤が５．０重量％を超えると、積層板の
耐溶剤性、耐熱性が不良になり、０．１重量％未満では
、紫外線の遮蔽効果が小さくなる。If the amount of the organic ultraviolet absorber exceeds 5.0% by weight, the solvent resistance and heat resistance of the laminate will be poor, and if it is less than 0.1% by weight, the ultraviolet shielding effect will be reduced.
また、酸化物を２０重量％を超えて配合すると、接着剤
の粘度上昇、後工程でのめっき密着性不良を発生する。In addition, if the oxide exceeds 20% by weight, the viscosity of the adhesive increases and plating adhesion deteriorates in subsequent steps.
さらに、酸化物が０．１重ｆｔ％未満では、紫外線の遮
蔽効果が小さい。酸化物の配合について、好ましくは１
．０〜１０重量％である。Furthermore, if the oxide content is less than 0.1% by weight, the ultraviolet ray shielding effect is small. Regarding the combination of oxides, preferably 1
．． It is 0 to 10% by weight.
酸化物の粒径については、高精度微細パターン形成上、
２０μｍ以上の粒子が存在すると、化学エツチング工程
で酸化物粒子が接着剤表面に露出し、めっきで形成した
回路に凹凸が生じ、回路の平滑性を損なう。酸化物の粒
径は好ましくは５μｍ以下である。Regarding the particle size of the oxide, for high precision fine pattern formation,
If particles of 20 μm or more are present, the oxide particles will be exposed on the surface of the adhesive during the chemical etching process, causing unevenness in the circuit formed by plating, impairing the smoothness of the circuit. The particle size of the oxide is preferably 5 μm or less.
本発明によると、めっきレジスト層を通過した紫外線は
接着剤層及び積層板の表面層で遮蔽され、化学めっき用
積層板の層内深く透過することがないため、穴壁に付着
しためっきレジストを感光、硬化させることを防止する
ことができる。According to the present invention, ultraviolet rays that have passed through the plating resist layer are blocked by the adhesive layer and the surface layer of the laminate, and do not penetrate deeply into the layers of the chemical plating laminate, so they can remove the plating resist that has adhered to the hole wall. It can prevent exposure to light and curing.
さらに、紫外線吸収剤と無機酸化物を併用していること
により、紫外線の遮蔽効果が太きいと共に、有機紫外線
吸収物質は接着剤層付き積層板の表面（接着剤層）には
なく、かつその添加墓は少ないので、プリント配線板と
しての電気特性、化学特性、耐熱性を劣下させることが
ない。Furthermore, by using a UV absorber and an inorganic oxide in combination, the UV shielding effect is strong, and the organic UV absorber is not on the surface (adhesive layer) of the laminate with an adhesive layer. Since there are few additives, the electrical properties, chemical properties, and heat resistance of the printed wiring board will not deteriorate.
本発明の化学めっき用積層板の製造方法について、以下
に実施例及び比較例によシ説明する。The method for producing a laminate for chemical plating according to the present invention will be explained below using Examples and Comparative Examples.
「部」は「重量部」を表わす。"Part" represents "part by weight."
実施例１
エピコー）ＥＰ−１０４６（油化シェル社製臭素化ビス
フェノールＡエビキシ樹脂）１００重証部、シンアンジ
アミド４重を部、２−エチル−４−メチルイミダゾール
０．１５重量部、有機紫外線吸収物質として２−（２’
−ヒドロキシ−３′−ｔ−ブチル−５’−メチルフェニ
ル）−５−クロロペンツトリアゾール２Ｍ証部を総固形
分として５０Ｍ量チとなるようメチルエチルケトン及び
メチルセロソルブの溶剤で溶解及び均一に攪拌しワニス
溶液とした。このワニスをガラス織布に含浸させ乾燥さ
せたのち、樹脂分４５％のプリプレグ（８）を得た。Example 1 100 parts of Epicor) EP-1046 (brominated bisphenol A Ebixi resin manufactured by Yuka Shell Co., Ltd.), 4 parts of cinandiamide, 0.15 parts by weight of 2-ethyl-4-methylimidazole, organic ultraviolet light 2-(2'
-Hydroxy-3'-t-butyl-5'-methylphenyl)-5-chloropenttriazole (2M) was dissolved in a solvent of methyl ethyl ketone and methyl cellosolve to a total solid content of 50M and stirred uniformly to form a varnish. It was made into a solution. A glass woven fabric was impregnated with this varnish and dried to obtain a prepreg (8) with a resin content of 45%.
また、有機紫外線吸収物質を配合しないことを除いて前
記処方と同様にして樹脂分４５チのプリプレグ［Ｆ］）
を得た。In addition, a prepreg [F] with a resin content of 45 cm was prepared in the same manner as the above formulation except that no organic ultraviolet absorbing substance was blended.
I got it.
両表面層としてプリプレグ囚各１枚と、内層としてプリ
プレグ（Ｂ）６枚とを重ね合わせ、１６５℃、６０）ｃ
ｒ／ｃＪで９０分間加熱加圧成形してエピキシ樹脂積層
板を得た。One sheet of prepreg for both surface layers and six sheets of prepreg (B) for the inner layer were stacked at 165°C, 60)c.
An epixy resin laminate was obtained by heating and pressure molding at r/cJ for 90 minutes.
次に、下記配合で接着剤を調合し、前記のエビキシ樹力
旨積層板に塗工し、１６０℃で１２０分加熱して両面に
接着剤層を形成することにより化学めっき用積層板を得
た。接着剤層の厚みは３０μｍであった。Next, prepare an adhesive with the following composition, apply it to the above-mentioned Ebikishi tree strength laminate, and heat it at 160°C for 120 minutes to form an adhesive layer on both sides to obtain a laminate for chemical plating. Ta. The thickness of the adhesive layer was 30 μm.
ＮＢＲゴム（ＪＳＲ−Ｎ−２３０３Ｈ） １００
部レゾール型フェノール樹脂 １００部５ｔＯ２
粉末（最大粒径５μｍ） １０部ＴｉＯ２粉
末（最大粒径ＩＩｔｍ）１０部メチルエチルケトン
５００部実施例２
実施例１と同様の過程でプリプレグ（３）とプリプレグ
［Ｆ］）とを得、両表面層としてプリプレグ（Ａ）各２
枚と、内層としてプリプレグの）４枚とを重ね合わせ、
１６５℃、６０に９／贋で９０分間加熱加圧成形してエ
ピキシ樹脂積層板を得た。NBR rubber (JSR-N-2303H) 100
Part resol type phenolic resin 100 parts 5tO2
Powder (maximum particle size 5 μm) 10 parts TiO2 powder (maximum particle size IItm) 10 parts Methyl ethyl ketone
500 copies Example 2 Prepreg (3) and prepreg [F]) were obtained in the same process as in Example 1, and 2 each of prepreg (A) was added as both surface layers.
and 4 sheets of prepreg as an inner layer,
An epixy resin laminate was obtained by heating and pressure molding at 165° C. for 90 minutes at 60:9/false.
次に、下記配合で接着剤を調合し、前記のエピキシ樹脂
積層板に塗工し、実施例１と同様にして化学めっき用積
層板を得だ。Next, an adhesive was prepared with the following composition and applied to the epixy resin laminate described above to obtain a laminate for chemical plating in the same manner as in Example 1.
ＮＢＲゴム（ＪＳＲ−Ｎ −５３０） １００
部レゾール型フェノール樹脂 １００部ＴｉＯ２
粉末（最大粒径１０μｍ） ５部メチルエ
チルケトン ５００部比較例１
実施例の過程で得られたプリプレグ［Ｆ］）のみを８枚
重ね合わせ、１６５℃、６０に７／肩で９０分間加熱加
圧成形してエピキシ樹脂積層板を得た。NBR rubber (JSR-N-530) 100
Part resol type phenolic resin 100 parts TiO2
Powder (maximum particle size 10 μm) 5 parts Methyl ethyl ketone 500 parts Comparative Example 1 8 sheets of the prepreg [F] obtained in the process of the example were stacked together and heated and pressure molded at 165°C for 90 minutes at 60°C/shoulder. An epixy resin laminate was obtained.
次に、下記配合で接着剤を訓合し、前記のエポキシ樹脂
積層板に塗工し、実施例１と同様にして化学めっき用積
層板を得た。Next, an adhesive was prepared in the following formulation and applied to the epoxy resin laminate described above to obtain a laminate for chemical plating in the same manner as in Example 1.
ＮＢＲゴム（ＪＳＲ−Ｎ−２３０ＳＨ） １００
部レゾール型フェノール樹脂 １００部ＴｉＯ２
粉末（最大粒径１０鑞） ６０部メチルエチルケ
トン ５００部比較例２
下記配合で接着剤を調合し、実施例２で得られたエポキ
シ樹脂積層板に塗工し、実施例１と同様にして化学めっ
き用積層板を得た。NBR rubber (JSR-N-230SH) 100
Part resol type phenolic resin 100 parts TiO2
Powder (maximum particle size 10%) 60 parts Methyl ethyl ketone 500 parts Comparative Example 2 An adhesive was prepared with the following composition and applied to the epoxy resin laminate obtained in Example 2, and chemically plated in the same manner as in Example 1. A laminate for use was obtained.
ＮＢＲゴム（ＪＳＲ−Ｎ−２３０ＳＨ） １００
部レゾール型フェノール樹脂 １００部メチルエ
チルケトン ５００部比較例３
比較例２と同じ配合で接着剤を調合し、比較例１で得ら
れた工はデキ７樹脂積層板に塗工し、実施例１と同様に
して化学めっき用積層板を得た。NBR rubber (JSR-N-230SH) 100
Part resol type phenol resin 100 parts Methyl ethyl ketone 500 parts Comparative Example 3 An adhesive was prepared in the same formulation as in Comparative Example 2, and the adhesive obtained in Comparative Example 1 was coated on a Deki 7 resin laminate, and the adhesive was applied in the same manner as in Example 1. A laminate for chemical plating was obtained.
実施例１．２及び比較例１．２．３でイ（Ｊられた化学
めっき用積層板を前記工程Ａ〜Ｇの順に処理し、プリン
ト配線板を得た。The chemical plating laminates prepared in Example 1.2 and Comparative Example 1.2.3 were processed in the order of steps A to G to obtain printed wiring boards.
上記プリント配線板の評価結果を表−１に示す。Table 1 shows the evaluation results of the above printed wiring board.
実施例１及び２はスルホール内のめっき析出による不良
は発生せず、めっき銅皮膜のフクレの発生もなく、プリ
ント配線板のはんだ付は耐熱性も良好であった。In Examples 1 and 2, no defects due to plating precipitation in the through-holes occurred, no blisters occurred in the plated copper film, and the soldering of the printed wiring board had good heat resistance.
一方、比較例１はスルホール内のめっき析出による不良
は発生しなかったが、めっき銅皮膜の７クレモｌ−ミ込
−・ ・牲平喰が生じた。比較例
２はスルホール内にめっき析出による不良の発生がみら
れた。比較例３はスルホール内のめっき析出による不良
が顕著に発生した。On the other hand, in Comparative Example 1, no defects due to plating precipitation in the through-holes occurred, but 7cremol inclusions and sacrificial flattening of the plated copper film occurred. In Comparative Example 2, defects due to plating precipitation were observed in the through holes. In Comparative Example 3, defects due to plating precipitation within the through holes occurred significantly.
Claims (1)
樹脂積層板の両表面上に形成した化学めっき用積層板の
製造方法において、前記熱硬化性樹脂積層板の表面層を
構成する樹脂含浸基材の樹脂中に１０ｎｍ〜４５０ｎｍ
に吸収ピークを示す有機紫外線吸収物質を０．１〜５．
０重量％配合し、更に前記接着剤層中に最大粒径２０μ
ｍ以下の無機酸化物を０．１〜２０重量％配合すること
を特徴とする化学めっき用積層板の製造方法。In a method for producing a chemical plating laminate in which an adhesive layer made of a curable resin containing synthetic rubber is formed on both surfaces of a thermosetting resin laminate, the resin constituting the surface layer of the thermosetting resin laminate. 10nm to 450nm in the resin of the impregnated base material
The organic ultraviolet absorbing substance exhibiting an absorption peak at 0.1 to 5.
0% by weight, and a maximum particle size of 20μ in the adhesive layer.
A method for producing a laminate for chemical plating, characterized in that 0.1 to 20% by weight of an inorganic oxide of 0.1 to 20% by weight is blended.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60167731A JPS6228243A (en) | 1985-07-31 | 1985-07-31 | Manufacture of laminated board for chemical plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60167731A JPS6228243A (en) | 1985-07-31 | 1985-07-31 | Manufacture of laminated board for chemical plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6228243A true JPS6228243A (en) | 1987-02-06 |
| JPH058101B2 JPH058101B2 (en) | 1993-02-01 |
Family
ID=15855102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60167731A Granted JPS6228243A (en) | 1985-07-31 | 1985-07-31 | Manufacture of laminated board for chemical plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228243A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7445103B2 (en) | 2003-09-19 | 2008-11-04 | Getrag Getriebe-Und Zahnradfabrik Hermann Hagenmeyer Gmbh & Cie Kg | Synchronizer clutch for a motor vehicle multistep transmission |
-
1985
- 1985-07-31 JP JP60167731A patent/JPS6228243A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7445103B2 (en) | 2003-09-19 | 2008-11-04 | Getrag Getriebe-Und Zahnradfabrik Hermann Hagenmeyer Gmbh & Cie Kg | Synchronizer clutch for a motor vehicle multistep transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058101B2 (en) | 1993-02-01 |
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