JPS62280888A - Connection of lead block - Google Patents
Connection of lead blockInfo
- Publication number
- JPS62280888A JPS62280888A JP12606386A JP12606386A JPS62280888A JP S62280888 A JPS62280888 A JP S62280888A JP 12606386 A JP12606386 A JP 12606386A JP 12606386 A JP12606386 A JP 12606386A JP S62280888 A JPS62280888 A JP S62280888A
- Authority
- JP
- Japan
- Prior art keywords
- jig
- light
- pressurizing
- connection
- irradiated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、ＥＬディスプレイパネルや液晶ディスプレイ
パネルと、これを、駆動する半導体素子（ＬＳＩ、ＩＣ
）の電極から延在した配線リードとの接続方法に関する
ものである。Detailed Description of the Invention 3. Detailed Description of the Invention Industrial Application Field The present invention relates to an EL display panel, a liquid crystal display panel, and a semiconductor element (LSI, IC) that drives the panel.
) relates to a connection method with a wiring lead extending from an electrode.
従来の技術
近年、液晶ディスプレイパネルやＥＬディスプレイパネ
ルを用いて、画像表示や文字表示する機器が増加してい
る。これらディスプレイパネルは肉厚を博くできる特徴
はあるものの、鮮明な画像や高精細度のキャラクタ−を
表示する場合、前記ディスプレイパネルに形成されてい
る走査線の数を増やさなければならない。この事は、液
晶ディスプレイやＥＬディスプレイがよりＣＲＴの表示
性能に接近し、附加価値を高めるうえでも不可欠の事で
ある。ところが、前記走査線の数を増やしてしまうと、
ディスプレイパネルの電極数も比例して増大する。電極
数の増大は、これを駆動するための駆動用のＬＳＩの数
も増大する結果となるものである。2. Description of the Related Art In recent years, there has been an increase in the number of devices that display images and characters using liquid crystal display panels and EL display panels. Although these display panels have the advantage of being thicker, in order to display clear images or high-definition characters, it is necessary to increase the number of scanning lines formed on the display panel. This is essential for liquid crystal displays and EL displays to approach the display performance of CRTs and increase added value. However, if the number of scanning lines is increased,
The number of electrodes in the display panel also increases proportionally. An increase in the number of electrodes results in an increase in the number of LSIs for driving the electrodes.
したがって、液晶ディスプレイパネルやＥＬディスプレ
イパネルの性能向上を計ろうとすれば、必然的に、前記
駆動用ＬＳＩとディスプレイパネルの電極との接続点数
が増え、信頼性を低下さす原因となるばかりか、実装コ
ストが著じるしく増太し、実用化全はばむ原因となって
いる・第３図で従来の構成を説明する。例えば、液晶デ
ィスプレイ２０上に形成した電極２１と駆動用ＬＳＩが
搭載されたフィルムリード２２とを接合する場合、前記
液晶ディスプレイ２０上の電極上に光硬化性樹脂２３を
塗布（第３図ａ）Ｌ、加圧治具２４を降下２５せしめ、
加圧しながら紫外線をディスプレイ２０の裏面から照射
２６し、フィルムリード２２と電極２１上の光硬化性樹
脂２３を加圧によって一部除去すると共に、樹脂を硬化
させる（第３図ｂ）。Therefore, when trying to improve the performance of a liquid crystal display panel or an EL display panel, the number of connection points between the driving LSI and the electrodes of the display panel inevitably increases, which not only causes a decrease in reliability but also The cost has increased significantly, which is causing a delay in practical application.The conventional configuration is explained in Fig. 3. For example, when bonding the electrode 21 formed on the liquid crystal display 20 and the film lead 22 on which the driving LSI is mounted, a photocurable resin 23 is applied on the electrode on the liquid crystal display 20 (FIG. 3a). L, lower the pressure jig 24 25,
While applying pressure, ultraviolet rays are irradiated 26 from the back surface of the display 20 to partially remove the photocurable resin 23 on the film leads 22 and electrodes 21 and harden the resin (FIG. 3b).
次に樹脂が硬化すれば、加圧治具２４を上昇させ、引上
げれば第３図Ｃの如く、接続が行えるものである。Next, when the resin hardens, the pressurizing jig 24 is raised and pulled up, allowing connection to be made as shown in FIG. 3C.
発明が解決しようとする問題点
ところが、従来のこの様な接続方法においては、加圧治
具が邪魔をして、光照射はディスプレイの反対面すなわ
ち、加圧治具の対面よりしか光照射をできなかった。Problems to be Solved by the Invention However, in such a conventional connection method, the pressure jig gets in the way, and light can only be irradiated from the opposite side of the display, that is, the face of the pressure jig. could not.
このために、加圧治具側のフィルムリード２２の表面に
存在する樹脂や加圧治具の壁面に沿って盛り上った樹脂
あるいはディスプレイ２０の反対面から照射しても、光
が照射されない影の領域が存在した。このために、加圧
治具２４を取去ってから、再度、加圧治具を設置した側
から光照射を行うものであった。このために著しるしく
工程が複雑となシ実装コストを高くならしめていた。For this reason, even if the resin existing on the surface of the film lead 22 on the pressure jig side, the resin raised along the wall of the pressure jig, or the opposite side of the display 20 is irradiated, the light will not be irradiated. There was a realm of shadows. For this purpose, after removing the pressure jig 24, light irradiation was performed again from the side on which the pressure jig was installed. For this reason, the process becomes extremely complicated and the mounting cost becomes high.
本発明はこのような従来の問題に鑑み、ディス性
プレイパネルと回路基板のリード群を光硬化１樹脂で接
合する際に、より信頼性の高い接続を得ることを目的と
する。In view of these conventional problems, an object of the present invention is to obtain a more reliable connection when bonding lead groups of a display panel and a circuit board with a photocurable resin.
問題点を解決するための手段
本発明は、ディスプレイパネル等の電極とＩＪ−ド群と
の間に絶縁樹脂を介在させ、加圧しなから一紫外線照射
させる接続方法において、前記加圧治具が光を透過する
材料で構成され、かつ、加圧時に加圧治具を通して光照
射を行なわしめ、接続の信頼性を高め、実装コストを低
減するものである。Means for Solving the Problems The present invention provides a connection method in which an insulating resin is interposed between an electrode of a display panel or the like and an IJ-board group, and the pressure jig is irradiated with ultraviolet rays without applying pressure. It is made of a material that transmits light, and when pressurizing, light is irradiated through the pressurizing jig to improve connection reliability and reduce mounting costs.
作 用
本発明によれば、絶縁性樹脂の未硬化領域の発生がなく
、光照射を加圧と同時に実施でき、工程の所要時間を短
縮することも可能となる。Effects According to the present invention, there is no uncured area of the insulating resin, light irradiation can be performed simultaneously with pressurization, and the time required for the process can be shortened.
実施例 第１図で本発明の接続方法の実施例を説明する。Example An embodiment of the connection method of the present invention will be explained with reference to FIG.
液晶ディスプレイ２０上にＩＴ○膜で形成した電極２１
が設けられており、前記電極２１上に光硬化型の絶縁性
樹脂２３を塗布する。次に駆動用ＩＳＩが接続されたフ
ィルムリード群２２と前記電極２１とを位置合せ、加圧
治具１４を降下させる（第１図ａ）。このとき、本発明
の特徴である加圧治具１４は、光を透過する材料例えば
石英ガラス、パイレックスガラス等でない、少なくとも
加圧面２９の反対面には光を導入するための光路３０が
設けられた構成である。一方、電極上に塗布される絶縁
性樹脂はエポキシ系、アクリル系。Electrode 21 formed of IT○ film on liquid crystal display 20
is provided, and a photocurable insulating resin 23 is applied onto the electrode 21. Next, the film lead group 22 connected to the driving ISI and the electrode 21 are aligned, and the pressing jig 14 is lowered (FIG. 1a). At this time, the pressurizing jig 14, which is a feature of the present invention, is made of a material that does not transmit light, such as quartz glass or pyrex glass, and is provided with an optical path 30 for introducing light at least on the opposite side of the pressurizing surface 29. The configuration is as follows. On the other hand, the insulating resin coated on the electrodes is epoxy-based or acrylic-based.
シリコン系、ブタジエ／系、ポリイミド系等の光硬化性
樹脂で、硬化の主体が紫外線によるものであるが、熱硬
化性を一部併用した樹脂を用いる事もできる。また、絶
縁性樹脂の塗布は、ディスプレイの電極上あるいはフィ
ルムリード群２２側に塗布しても良い。更にフィルムリ
ード群２２は例えば、Ｃｕ箔にＡｕめっき処理した構成
を用いれば、著しるしく高い信頼性を得ることができる
。Photo-curing resins such as silicone-based, Butadier-based, polyimide-based, etc. are mainly cured by ultraviolet rays, but resins that partially contain thermosetting resins can also be used. Further, the insulating resin may be applied on the electrodes of the display or on the film lead group 22 side. Furthermore, if the film lead group 22 is made of, for example, a Cu foil plated with Au, significantly high reliability can be obtained.
次に第１図すの如く、加圧した状態で、ディスプレイパ
ネル２０の裏面８および前記加圧治具１４の光路３０よ
シ光照射７、少なくとも同時に硬化を促進させる。終れ
ば加圧治具１４を上昇２６させ、光照射を停止させ（第
１図Ｃ）れば、リード群２２とディスプレイ２ｏの電極
２１とは電気的に接続される。また、前記フィルムリー
ド群２２のディスプレイパネル２ｏの電極２１と接する
面は少なく共、凹凸を有し、電極２１面とフィルムリー
ド群２２の凹凸で形成される凹部には前記絶縁性樹脂が
存在し、これがフィルムリード群と電極とを固着する作
用をし、凸部が電極表面と接し、これによって、電気的
接続を可能ならしめる。Next, as shown in FIG. 1, under pressure, the back surface 8 of the display panel 20 and the optical path 30 of the pressing jig 14 are irradiated with light 7 to at least simultaneously promote curing. When the pressing jig 14 is raised 26 and the light irradiation is stopped (FIG. 1C), the lead group 22 and the electrodes 21 of the display 2o are electrically connected. Further, the surface of the film lead group 22 in contact with the electrode 21 of the display panel 2o has at least some unevenness, and the insulating resin is present in the recessed portion formed by the unevenness of the electrode 21 surface and the film lead group 22. This acts to fix the film lead group and the electrode, and the convex portion comes into contact with the electrode surface, thereby making electrical connection possible.
前記加圧治具の他の実施例を第２図で説明する。Another embodiment of the pressure jig will be described with reference to FIG. 2.
石英ガラス、パイレックスガラス等で構成された加圧部
１４′の表面にはテフロン等の前記絶縁性樹脂が付着し
にくい材料３２が形成されている。このような加圧治具
を用いれば、フィルムリード群２２とディスプレイパネ
ル２０の電極２１間に前記絶縁性樹脂２３を介在させ、
加圧した時に、光硬した樹脂が前記加圧治具１４の側面
および底面に耐着することがない。このために、加圧治
具とフィルムリードが接合され、フィルムリードと電極
が離れてしまう現象やこれに伴なう電気的接合不良の発
生がなく、接合工程が容易となるばかりが高い接合の信
頼性を得る事ができる。A material 32 such as Teflon to which the insulating resin does not easily adhere is formed on the surface of the pressurizing portion 14' made of quartz glass, pyrex glass, or the like. If such a pressure jig is used, the insulating resin 23 is interposed between the film lead group 22 and the electrode 21 of the display panel 20,
When pressurized, the light-hardened resin does not stick to the side and bottom surfaces of the pressing jig 14. For this reason, the pressure jig and the film lead are bonded, and there is no phenomenon where the film lead and the electrode separate or the occurrence of electrical bond failures associated with this, and the bonding process is simplified and the bonding rate is high. You can gain reliability.
発明の効果
光照射を加圧治具を通して実施できるので、絶縁性樹脂
の未硬化領域の発生を防ぐ事ができ、高い信頼性を実現
できる。また、従来であると、加圧治具を取去ってから
、再度、別の光源で光照射をする必要があったが、本発
明では、加圧時に実施できるので工程の所要時間が著し
るしく短かくなるばかりか、実装コストを低減できる効
果がある。Since the effect light irradiation of the invention can be carried out through a pressurizing jig, it is possible to prevent the occurrence of uncured areas of the insulating resin, and high reliability can be achieved. In addition, in the past, it was necessary to remove the pressurizing jig and then irradiate the light with another light source again, but with the present invention, this can be done while pressurizing, which significantly reduces the time required for the process. Not only is it much shorter, but it also has the effect of reducing implementation costs.
第１図は本発明の一実施例の接続工程図、第２図は′
−本発明に用いる
加圧治具の他の実施例の正面図、第３図は従来の接続工
程図である。
１４・・・・・・加圧治具、２０・・・・・ディスプレ
イパネル、２１・・・・電極、２２・・・・・・フィル
ムリード、２３・・・・・・絶縁性樹脂、７，８・・・
・・・光照射。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名箒３
図
ｔ１↑↑↑↑↑↑１１）↑Figure 1 is a connection process diagram of one embodiment of the present invention, and Figure 2 is '
- A front view of another embodiment of the pressing jig used in the present invention, and FIG. 3 is a diagram of a conventional connection process. 14... Pressure jig, 20... Display panel, 21... Electrode, 22... Film lead, 23... Insulating resin, 7 ,8...
...Light irradiation. Name of agent: Patent attorney Toshio Nakao and 1 other person Houki 3
Figure t1↑↑↑↑↑↑11)↑
Claims (2)
させ加圧、光照射して接続する方法において、前記配線
リードと基板電極とを加圧する治具が、前記絶縁性樹脂
を硬化する光を透過すると共に、前記加圧治具を通して
、加圧時に光照射を行なうことを特徴とするリード群の
接続方法。(1) In a method of interposing an insulating resin between a wiring lead and a substrate electrode, applying pressure, and irradiating the connection with light, a jig for pressurizing the wiring lead and the substrate electrode hardens the insulating resin. A method for connecting a group of leads, characterized in that light is transmitted through the pressure jig and light is irradiated during pressure application.
光照射すると同時に、加圧治具の対面からも光照射を行
うことを特徴とする特許請求の範囲第１項記載のリード
群の接続方法。(2) When pressurizing with a pressurizing jig, light is irradiated through the pressurizing jig and at the same time, light is irradiated from the opposite side of the pressurizing jig. How to connect lead groups.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606386A JPS62280888A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12606386A JPS62280888A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62280888A true JPS62280888A (en) | 1987-12-05 |
| JPH059032B2 JPH059032B2 (en) | 1993-02-03 |
Family
ID=14925707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12606386A Granted JPS62280888A (en) | 1986-05-30 | 1986-05-30 | Connection of lead block |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62280888A (en) |
-
1986
- 1986-05-30 JP JP12606386A patent/JPS62280888A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH059032B2 (en) | 1993-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |