JPS62270089A - Extremely small head disk assembly - Google Patents
Extremely small head disk assemblyInfo
- Publication number
- JPS62270089A JPS62270089A JP11260686A JP11260686A JPS62270089A JP S62270089 A JPS62270089 A JP S62270089A JP 11260686 A JP11260686 A JP 11260686A JP 11260686 A JP11260686 A JP 11260686A JP S62270089 A JPS62270089 A JP S62270089A
- Authority
- JP
- Japan
- Prior art keywords
- hda
- circuit substrate
- lead wires
- disk assembly
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 101100338524 Arabidopsis thaliana HDT1 gene Proteins 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 101000606504 Drosophila melanogaster Tyrosine-protein kinase-like otk Proteins 0.000 description 1
- 101150088911 HDA3 gene Proteins 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Moving Of Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
【発明の詳細な説明】 ３、発明の詳細な説明 〔産業上の利用分野〕 本発明は、ヘッドディスクアセンブリ（以下。[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] The present invention relates to a head disk assembly (hereinafter referred to as a head disk assembly).
ＨＤＡという）に関し、特に超小形ディスク装置におい
て、回路基板上に実装するのに好適な超小形ヘッドディ
スクアセンブリに関するものである。The present invention relates to an ultra-small head disk assembly suitable for mounting on a circuit board, particularly in an ultra-small disk device (HDA).
ディスク装置は当初１４インチ径の円板（ディスク）を
用いるものが主流であったが、現在では、８インチ、５
インチ、３．５インチと小形のものが使用されてきてお
り、電子カメラなどでは、約２インチ径のフレキシブル
円板を使用したものが開発されている。At first, the mainstream disk device used a 14-inch diameter disk, but now 8-inch and 5-inch disks are used.
Sizes as small as 3.5 inch and 3.5 inch have been used, and for electronic cameras, a flexible disc with a diameter of approximately 2 inches has been developed.
このような小型の磁気ディスク装置（ＨＤＡ）の例とし
ては、特開昭６０−２９９８９号公報の記載のように、
密閉型ＨＤＡに圧接型コネクタ等の瞬間的簡易コネクタ
を設け、そのＨＤＡ自体を交換単位とするものが知られ
ている。この方法では、上記簡易コネクタによりＨＤＡ
（装置）本体と外部制御機構とを接続するので、通信線
を必要とせず、従って、装置本体を従来のディスクバッ
クと同様の感覚で交換することができる。As an example of such a small magnetic disk device (HDA), as described in Japanese Patent Application Laid-open No. 60-29989,
It is known that a sealed HDA is provided with a momentary simple connector such as a press-contact type connector, and the HDA itself is used as a replacement unit. In this method, the HDA is
(Device) Since the main body and the external control mechanism are connected, no communication line is required, and therefore, the main body of the device can be replaced in the same way as a conventional disc back.
上記従来例では、ディスク装置のＨＤＡをＩｃメモリの
ように回路基板上に実装することについては配慮されて
いなかった。In the conventional example described above, no consideration was given to mounting the HDA of the disk device on a circuit board like an IC memory.
本発明の目的は、このような従来の配慮されていなかっ
た点を改善し、ＨＤＡを回路基板上に実装しやすい形と
し、小形、大容量の不揮発性メモリをＩＣメモリと同様
な手軽さで使用できる超小形ヘッドディスクアセンブリ
を提供することにある。The purpose of the present invention is to improve these points that have not been taken into consideration in the past, to make HDA easy to mount on a circuit board, and to make small-sized, large-capacity nonvolatile memory as easy as IC memory. An object of the present invention is to provide a micro head disk assembly that can be used.
上記問題点を解決するため、本発明では、磁気ディスク
、該磁気ディスクを駆動するモータ、磁気ヘッド、該磁
気ヘッドを上記磁気ディスク上の任意のトラック上に位
置付けするアクチュエータを含むヘッドディスクアセン
ブリ（ＨＤＡ）において、上記ＨＤＡが該ＨＤＡを駆動
、制御したり、信号を受授する電気的接続部材により回
路基板上に直接接続され、上記電気的接続部材が、上記
ＨＤＡの機械的支持または固定を兼ねることに特徴があ
る。In order to solve the above problems, the present invention provides a head disk assembly (HDA) that includes a magnetic disk, a motor that drives the magnetic disk, a magnetic head, and an actuator that positions the magnetic head on any track on the magnetic disk. ), the HDA is directly connected to the circuit board by an electrical connection member that drives and controls the HDA and receives and receives signals, and the electrical connection member also serves as mechanical support or fixation of the HDA. There are certain characteristics.
（作用〕
本発明においては、ＨＤＡは、密閉されたケースと、ケ
ースから突出した複数のリード線とから成り、リード線
を回路基板上に半田付は等の方法により、接続すること
によって固定されるので、ＩＣメモリと同様の容易さで
ディスク装置を実装することができる。(Function) In the present invention, the HDA consists of a sealed case and a plurality of lead wires protruding from the case, and is fixed by connecting the lead wires to the circuit board by soldering or other methods. Therefore, a disk device can be implemented with the same ease as an IC memory.
以下、本発明の一実施例を、図面により詳細に説明する
。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
まず、本発明の詳細な説明をする。First, the present invention will be explained in detail.
円板（ディスク）が小形化されて行くにつれ、アクチュ
エータも小形化でき、装置全体が小形化できることに加
えて、回転に必要なエネルギーが著しく節減できる。円
板の接線速度が小さいため、ヘッドと接触する際の損傷
も少なく、信頼性が大きい、寸法が小さいために、熱膨
張などによるオフトラックが小さい、などの種々の利点
が生じる。As the disk becomes smaller, the actuator can also be made smaller, and in addition to making the entire device smaller, the energy required for rotation can be significantly reduced. The low tangential velocity of the disc provides various advantages, such as less damage when it comes into contact with the head, greater reliability, and the smaller size reduces off-track due to thermal expansion.
また、小形化の別の利点として、ＨＤＡの取扱いが容易
となり、上位回路との接続が電気的、：機械的に単純化
される。一方、ＩＣメモリにおいては。Another advantage of miniaturization is that the HDA is easier to handle, and the connection with higher-level circuits is electrically and mechanically simplified. On the other hand, in IC memory.
メモリ素子を回路基板上に実装し、情報の記録・再生を
行うことができる６そこで、本発明では、ＨＤＡを超小
形化し、密閉部からリード線を出して、ＩＣメモリのよ
うに、ＨＤＡを回路基板上に実装し、安価に不揮発性メ
モリを製造できるようにした。A memory element can be mounted on a circuit board and information can be recorded and reproduced6.Therefore, in the present invention, the HDA is made ultra-small and the lead wires are brought out from the sealed part, so that the HDA can be used like an IC memory. It is mounted on a circuit board, making it possible to manufacture nonvolatile memory at low cost.
第２図は１本発明の一実施例を示すＨＤＡの斜視図であ
る。FIG. 2 is a perspective view of an HDA showing an embodiment of the present invention.
ＨＤＡは密閉部１と複数のリード線２から成る。The HDA consists of a sealed part 1 and a plurality of lead wires 2.
密閉部１は、円板（例えば、磁気ディスク）２円板−外
部より塵埃が侵入しないよう密閉された構造を駆動モー
タ、磁気ヘッド、アクチュエータを含み、持っている。The sealed part 1 includes a drive motor, a magnetic head, and an actuator, and has a sealed structure to prevent dust from entering from the outside.
リード線２はリン青銅のような機械的強度の大きい導電
体から成り、密閉部１と外部の電気的及び機械的接続を
行うものである。ここで、リード線２は密閉部１の外壁
を貫いているが、周囲はシールされ密閉を妨げることが
ない。The lead wire 2 is made of a conductor with high mechanical strength, such as phosphor bronze, and is used to electrically and mechanically connect the sealed portion 1 to the outside. Here, the lead wire 2 penetrates the outer wall of the sealed portion 1, but the surrounding area is sealed and does not interfere with the sealing.
第１図は、第２図のＨＤＡを回路基板上に実装）た状態
を示す図である・
第１図において、３は密閉部ｌとリード線２を含むＨＤ
Ａ、４はＨＤＡ３が実装される回路基板、５は回路基＠
４上の回路パターン、６はＩＣメモリである。Fig. 1 is a diagram showing the HDA shown in Fig. 2 mounted on a circuit board. In Fig. 1, 3 is the HDA including the sealed part l and the lead wire 2.
A, 4 is the circuit board on which HDA3 is mounted, 5 is the circuit board @
The circuit pattern above 4, 6 is an IC memory.
リード線２の先端を回路基板４上の回路パターン５に半
田付けすることによって、電気的、機械的に接続するこ
とができる６二の方法はいわゆるＩＣと同様である。こ
の場合、回路基板４全体をショックマウントで支えるな
どの方法によって、防震装置を施すことが望ましい。The method 62 in which electrical and mechanical connections can be made by soldering the tips of the lead wires 2 to the circuit pattern 5 on the circuit board 4 is similar to that of a so-called IC. In this case, it is desirable to provide a vibration isolation device by supporting the entire circuit board 4 with a shock mount.
第３図は本発明の他の実施例を示すＨＤＡの斜視図であ
り、第４図、第５図は第３図のリード線２の長手方向の
断面図である。ここでは、リード線２の長さを長くし、
周囲を振動減衰能力の高いゴム（緩衝ゴム）７でモール
ドしたものである。また、リード線２の長手方向の断面
は、第４図に示すような構造となっているが、第５図に
示すようにループを措かしてもよい。FIG. 3 is a perspective view of an HDA showing another embodiment of the present invention, and FIGS. 4 and 5 are longitudinal sectional views of the lead wire 2 in FIG. 3. Here, the length of lead wire 2 is increased,
The surrounding area is molded with rubber (buffer rubber) 7 with high vibration damping ability. Further, although the longitudinal section of the lead wire 2 has a structure as shown in FIG. 4, a loop may be removed as shown in FIG.
このような構造を採用することによって、回路基板４に
特別な防震装置を設ける二となく、実装することも可能
である。By employing such a structure, it is possible to mount a special anti-seismic device on the circuit board 4 without having to provide it.
このように、本実施例においては、ＨＤＡを回路基板上
に容易に実装することができる。In this way, in this embodiment, the HDA can be easily mounted on the circuit board.
以上説明したように、本発明によれば、回路基板上に超
小形のディスク装置を直接、容易に実装することができ
、大容量の安価な不揮発性メモリを製造できる。As described above, according to the present invention, an ultra-small disk device can be easily mounted directly on a circuit board, and a large-capacity, inexpensive nonvolatile memory can be manufactured.
第１．図は本発明の一実施例を示すＨＤＡを回路基板上
に実装した状態を示す図、第２図は本実施例によるＨＤ
Ａの斜視図、第３図は本発明の他の実施例を示す）ＩＤ
Ａの斜視図、第４図、第５図は第３図におけるリード線
の長手方向に沿った断面図である。
１：密閉部、２：リード線、３・ＨＤＡ、４：回路基板
、５；回路パターン、７：緩衝ゴム。
代 理 人 弁理士 小 川 勝 男 −′第
１ 図
第 ２ 図1st. The figure shows an HDA according to an embodiment of the present invention mounted on a circuit board, and Figure 2 shows an HDA according to this embodiment.
A perspective view, FIG. 3 shows another embodiment of the present invention) ID
The perspective view of A, FIGS. 4 and 5 are sectional views along the longitudinal direction of the lead wire in FIG. 3. 1: Sealed part, 2: Lead wire, 3 HDA, 4: Circuit board, 5: Circuit pattern, 7: Buffer rubber. Agent: Patent Attorney Katsuo Ogawa −′th
1 Figure 2
Claims (1)
磁気ヘッド、該磁気ヘッドを上記磁気ディスク上の任意
のトラック上に位置付けするアクチュエータを含むヘッ
ドディスクアセンブリ（ＨＤＡ）において、上記ＨＤＡ
が該ＨＤＡを駆動、制御したり、信号を受授する電気的
接続部材により回路基板上に直接接続され、上記電気的
接続部材が、上記ＨＤＡの機械的支持または固定を兼ね
ることを特徴とする超小形ヘッドディスクアセンブリ。1. A magnetic disk, a motor that drives the magnetic disk,
A head disk assembly (HDA) including a magnetic head and an actuator for positioning the magnetic head on an arbitrary track on the magnetic disk, wherein the HDA
is directly connected to the circuit board by an electrical connection member that drives and controls the HDA and receives and receives signals, and the electrical connection member also serves as mechanical support or fixation of the HDA. Ultra-compact head disk assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61112606A JP2656472B2 (en) | 1986-05-19 | 1986-05-19 | Ultra-small head disk assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61112606A JP2656472B2 (en) | 1986-05-19 | 1986-05-19 | Ultra-small head disk assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62270089A true JPS62270089A (en) | 1987-11-24 |
| JP2656472B2 JP2656472B2 (en) | 1997-09-24 |
Family
ID=14590936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61112606A Expired - Lifetime JP2656472B2 (en) | 1986-05-19 | 1986-05-19 | Ultra-small head disk assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2656472B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996020476A1 (en) * | 1994-12-23 | 1996-07-04 | International Business Machines Corporation | Electronic circuit with local storage |
| US6219909B1 (en) | 1990-11-28 | 2001-04-24 | Hitachi, Ltd. | Method of mounting disk drive apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55137560U (en) * | 1979-03-20 | 1980-09-30 | ||
| JPS5764159U (en) * | 1980-10-01 | 1982-04-16 | ||
| JPS5816558A (en) * | 1981-07-22 | 1983-01-31 | Toshiba Corp | Hybrid integrated circuit |
| JPS5894189U (en) * | 1981-12-17 | 1983-06-25 | 富士通株式会社 | Portable magnetic disk device |
| JPS58115774U (en) * | 1982-01-29 | 1983-08-08 | 株式会社日立製作所 | liquid crystal display device |
| JPS5954952U (en) * | 1982-09-30 | 1984-04-10 | 富士通株式会社 | semiconductor equipment |
| JPS6029989A (en) * | 1983-07-29 | 1985-02-15 | Mitsubishi Electric Corp | Magnetic disk device |
-
1986
- 1986-05-19 JP JP61112606A patent/JP2656472B2/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55137560U (en) * | 1979-03-20 | 1980-09-30 | ||
| JPS5764159U (en) * | 1980-10-01 | 1982-04-16 | ||
| JPS5816558A (en) * | 1981-07-22 | 1983-01-31 | Toshiba Corp | Hybrid integrated circuit |
| JPS5894189U (en) * | 1981-12-17 | 1983-06-25 | 富士通株式会社 | Portable magnetic disk device |
| JPS58115774U (en) * | 1982-01-29 | 1983-08-08 | 株式会社日立製作所 | liquid crystal display device |
| JPS5954952U (en) * | 1982-09-30 | 1984-04-10 | 富士通株式会社 | semiconductor equipment |
| JPS6029989A (en) * | 1983-07-29 | 1985-02-15 | Mitsubishi Electric Corp | Magnetic disk device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6219909B1 (en) | 1990-11-28 | 2001-04-24 | Hitachi, Ltd. | Method of mounting disk drive apparatus |
| US6856482B2 (en) | 1990-11-28 | 2005-02-15 | Hitachi, Ltd. | Disk drive apparatus and method of mounting same |
| US7227712B2 (en) | 1990-11-28 | 2007-06-05 | Hitachi Global Storage Technologies Japan, Ltd. | Disk drive apparatus and method of mounting same |
| WO1996020476A1 (en) * | 1994-12-23 | 1996-07-04 | International Business Machines Corporation | Electronic circuit with local storage |
| US6035429A (en) * | 1994-12-23 | 2000-03-07 | International Business Machines Corporation | Electronic circuit implementing component level disk drive |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2656472B2 (en) | 1997-09-24 |
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