JPS62263942A - Copper alloy for lead frame - Google Patents
Copper alloy for lead frameInfo
- Publication number
- JPS62263942A JPS62263942A JP61106190A JP10619086A JPS62263942A JP S62263942 A JPS62263942 A JP S62263942A JP 61106190 A JP61106190 A JP 61106190A JP 10619086 A JP10619086 A JP 10619086A JP S62263942 A JPS62263942 A JP S62263942A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- lead frame
- solder
- copper alloy
- electrical conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 abstract description 27
- 239000000956 alloy Substances 0.000 abstract description 27
- 229910052748 manganese Inorganic materials 0.000 abstract description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 7
- 229910052749 magnesium Inorganic materials 0.000 abstract description 6
- 229910052719 titanium Inorganic materials 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 229910001000 nickel titanium Inorganic materials 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 23
- 239000000463 material Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- -1 %Co Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はおもに半導体装置のリードフレーム用として使
用される銅基合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a copper-based alloy mainly used for lead frames of semiconductor devices.
一般に半導体を要素とする集積回路のリードフレーム材
には次のような特性が要求される。Generally, lead frame materials for integrated circuits using semiconductors as elements are required to have the following characteristics.
（１）電気および熱の伝導性が良いこと回路部に電気信
号を伝達し、また回路部の発熱をすみやかに外部へ放出
させるため、優れた電気伝導性と熱伝導性が要求される
。(1) Good electrical and thermal conductivity Excellent electrical and thermal conductivity is required in order to transmit electrical signals to the circuit section and to quickly release heat generated from the circuit section to the outside.
（２）機械的強度が大きいこと
半導体機器は最終的にはそのリード先端部を各種回路基
板のソケットに差し込むか、あるいは半田付けして使用
されるためリード自体の強度が大きいことが必要であり
、またリード部の繰返し折り曲げに対する疲労強度の強
いことが必要である。(2) High mechanical strength Semiconductor devices are ultimately used by inserting the lead tips into the sockets of various circuit boards or by soldering them, so the leads themselves need to have high strength. In addition, the lead portion must have high fatigue strength against repeated bending.
（３）耐熱性が良いこと（軟化温度が高いこと）半導体
機器の組立工程中、ダイボンディング、ワイヤボンディ
ング、レジンモールド等の各工程においてリードフレー
ム材は３００〜４５０℃の高温にさらされるため、この
程度の加熱で機械的強度が低下しないことが必要である
。(3) Good heat resistance (high softening temperature) During the assembly process of semiconductor devices, lead frame materials are exposed to high temperatures of 300 to 450°C in various processes such as die bonding, wire bonding, and resin molding. It is necessary that mechanical strength not be reduced by heating to this extent.
（４）熱膨張係数が半導体チップあるいはモールドレジ
ンに近いこと
加熱を伴う組立工程中の熱膨張差による歪みに起因する
半導体チップの特性変動あるいはモールドレジンとの密
着性劣化を防ぐため、リードフレーム材には半導体チッ
プあるいはモールドレジンと近似した熱膨張係数が必要
とされる。(4) The coefficient of thermal expansion is close to that of the semiconductor chip or mold resin.In order to prevent changes in the characteristics of the semiconductor chip or deterioration of adhesion with the mold resin due to distortion due to differences in thermal expansion during the assembly process that involves heating, the lead frame material requires a thermal expansion coefficient similar to that of a semiconductor chip or mold resin.
（５）めっき性が良いこと
ダイボンディングされる部分のリードフレーム表面には
目的に応じて金や銀のめっきが施されるため、めっきの
被着性が良く、めっき欠陥の少ない材料であることが必
要である。(5) Good plating properties The surface of the lead frame where die bonding is performed is plated with gold or silver depending on the purpose, so the material should have good plating adhesion and few plating defects. is necessary.
（６）半田付は性が良いこと
最終ユーザーでの半田実装を容易にするため、ＩＣの外
部リードにはあらかじめＳｎや半田の被覆が施される。(6) Good soldering properties To facilitate solder mounting by the final user, the external leads of the IC are coated with Sn or solder in advance.
従ってリードフレーム材には半田濡れ性の良いことまた
、半田耐候性の良いこと（長時間使用中の半田密着性の
劣化が少ないこと）などが必要とされる。Therefore, lead frame materials are required to have good solder wettability and good solder weather resistance (less deterioration of solder adhesion during long-term use).
（７）モールドレジンとの密着性が良いこと一般に集積
回路は、最終的にはレジンモールドされるタイプが多く
、この場合レジンとの密着性の良いことが必要とされる
。(7) Good adhesion with mold resin Generally, many integrated circuits are ultimately molded with resin, and in this case, good adhesion with resin is required.
しかしながら従来よりリードフレーム材料として用いら
れているＦ ｅ−４２％Ｎｉ、Ｆｅ−２９％Ｎｉ−１７
％ＣｏなどのＦｅ−Ｎｉ系合金、あるいは鉄人鋼、リン
青銅などのＣｕ基合金はいずれも一長一短があり、いず
れかの必要特性を犠牲にして用途に応じた使い分けがな
されていた。However, Fe-42%Ni and Fe-29%Ni-17, which have been conventionally used as lead frame materials,
Fe--Ni alloys such as %Co, and Cu-based alloys such as Tetsujin Steel and Phosphor Bronze all have advantages and disadvantages, and have been used depending on the purpose at the expense of one of the required properties.
これらリードフレーム材の中でもＣｕ基合金は１？ｅ−
Ｎｉ系合金に比べて熱伝導性、電気伝導性が極めてすぐ
れ、また安価であるため近年その使用量は急激に増加し
はじめ業界ではＣｕ基合金の欠点である機械的強度や耐
熱性を改良した各種の合金が提案されてきた。Among these lead frame materials, is Cu-based alloy 1? e-
Compared to Ni-based alloys, it has extremely superior thermal conductivity and electrical conductivity, and is also cheaper, so its usage has begun to increase rapidly in recent years, and the industry has improved its mechanical strength and heat resistance, which are the shortcomings of Cu-based alloys. Various alloys have been proposed.
しかしながら、これらの合金はいずれも機械的強度重視
あるいは電気伝導度重視のどちらかに片寄ったものが多
く、半田付は性に対する配慮が十分でなかった。たとえ
ば、機械的強度向上の目的で添加した合金元素が何等か
の形で半田濡れ性や半田耐候性を害するという例が多く
あった。However, most of these alloys are biased toward either mechanical strength or electrical conductivity, and insufficient consideration has been given to soldering properties. For example, there have been many cases in which alloying elements added for the purpose of improving mechanical strength somehow impair solder wettability or solder weather resistance.
本発明はかがる点に鑑み高強度と高電気伝導性とを兼ね
備え、さらに半田耐候性を改善しリードフレーム用材料
として好適な諸特性を有する新規な銅合金を提供するも
のである。In view of these problems, the present invention provides a new copper alloy that has both high strength and high electrical conductivity, and also has improved solder weather resistance and has various properties suitable as a material for lead frames.
本発明者らは前述のような問題点を解決するべくＣｕ−
Ｎｉ−Ｔｉ系合金を対象に実験を行なった結果、本合金
にＦｅ、ＣｏとＭ ｎ 、 ｈｌ ｇおよびＺｎとを特
定量含有せしめることにより高強度、高電気伝導性およ
び良好なる半田耐候性とを兼ね備えた合金が得られるこ
とを見出し本発明に到ったものである。In order to solve the above-mentioned problems, the present inventors developed Cu-
As a result of experiments conducted on Ni-Ti alloys, it was found that by containing specific amounts of Fe, Co, Mn, hlg, and Zn in this alloy, high strength, high electrical conductivity, and good solder weather resistance were achieved. The inventors have discovered that it is possible to obtain an alloy that has both of the following, and have thus arrived at the present invention.
具体的には、重量ＸにてＮｉ Ｏ，８〜４．０％および
Ｔｉ００２〜４．０を（Ｎｉ／Ｔｉ比率
Ｃｕ基合金にさらにＦｅおよびＣｏのうちの１種または
２種を合計テ０．０１−１．０％、Ｍｎ ０．１−１．
０％、 Ｍ ｇ０．０５〜０．６％のうちの１種または
２種を合計で０．０５〜１．０％を含有せしめたことを
特徴とする合金、そして更にこれにＺｎ Ｏ，１〜１．
０％を含有せしめたことを特徴とする合金である
ＮｉおよびＴｉはＣｕマトリックス中にＮｉ３Ｔｉある
いはＮｉＴｉとして微細に析出し、合金の電気伝導性を
あまり低下させずに機械的強度および耐熱性を向上させ
るものでありその組成比率を適正範囲内にコントロール
することが重要なポイントとなる。つまり重量ガでのＮ
ｉ／ Ｔ ｉ比率が１未満の場合には過剰のＴｉが、
また逆にＮｉ／Ｔｉ比率が４を越える場合にはＮｉが、
それぞれＣｕマトリックス中に固溶し合金の電気伝導性
を低下させる。したがって、Ｎｉ／Ｔｉ比率は１〜４と
した。Specifically, NiO, 8 to 4.0% and Ti002 to 4.0 are added to the Ni/Ti ratio Cu-based alloy, and one or two of Fe and Co are added to the total amount of .01-1.0%, Mn 0.1-1.
0%, Mg0.05-0.6%, and further contains ZnO,1. ~1.
The alloy is characterized by containing 0% Ni and Ti, which are finely precipitated as Ni3Ti or NiTi in the Cu matrix, improving the mechanical strength and heat resistance without significantly reducing the electrical conductivity of the alloy. It is important to control the composition ratio within an appropriate range. In other words, N in terms of weight
When the i/Ti ratio is less than 1, the excess Ti is
Conversely, when the Ni/Ti ratio exceeds 4, Ni
Each is dissolved in the Cu matrix and reduces the electrical conductivity of the alloy. Therefore, the Ni/Ti ratio was set to 1-4.
次にＮｉおよびＴｉの絶対量に関しては、Ｎｉ Ｏ。Next, regarding the absolute amounts of Ni and Ti, NiO.
部未満あるいはＴｉ Ｏ，２％未満では十分に機械的強
度が得られず、またＮｉあるいはＴｉがそれぞれ４゜０
％を越えると合金の加工性が劣化するとともにめっき性
、半田濡れ性等にも悪影響を及ぼすようになるため重量
％にてＮｉ Ｏ，８〜４．０％およびＴｉＯ，２〜４．
０％に限定した。If Ni or Ti is less than 4% or less than 2%, sufficient mechanical strength cannot be obtained, and if Ni or Ti is less than 4%
If it exceeds 8% to 4.0% by weight of NiO and 2 to 4% by weight of TiO, the workability of the alloy will deteriorate and it will also have an adverse effect on plating properties, solder wettability, etc.
It was limited to 0%.
ＦｅおよびＣｏは合金中に微細に析出し、はんだ濡れ性
をあまり劣化させることなく、機械的強度を向上させる
元素であるが、０．０１％未満ではその効果が充分でな
く、また１、０％を超えると電気伝導度の低下が大きく
なるため、いずれか１種または２種合計で０．０１〜１
．０％とした。Fe and Co are elements that finely precipitate in the alloy and improve mechanical strength without significantly deteriorating solder wettability, but if it is less than 0.01%, the effect is not sufficient; If it exceeds 0.01% to 1%, the electrical conductivity will decrease significantly, so either one or both of them in total should be 0.01 to 1%.
．． It was set to 0%.
Ｍ ｎ 、 Ｍ ｇ 、およびＺｎは半田耐候性を改善
する合金元素であるが今のところその機構については不
明な点が多い。おそらく合金中に微量固溶している元素
の半田付は界面への拡散移動を抑制し半田／母材界面に
ＴｉやＮｉとＳｎとのもろい金属間化合物が形成される
のを防いでいるものと推定されるが、その含有量がＭｎ
あるいはＺｎの場合は０．１％未満、Ｍｇの場合は０．
０５％未満では十分な効果が得られず、逆にＭｎあるい
はＺｎを１．０％を越えて含有せしめても、またＭｇの
場合０．６％を越えて含有せしめてもそれ以上の効果は
得られないうえ、合金の電気伝導度が低下し過ぎるため
それぞれＭｎ０．１〜１．０％、Ｍｇ ０．０５−０．
６％、 Ｚｎ ０．１−１．０％に限定した。M n , M g , and Zn are alloying elements that improve solder weather resistance, but so far there are many points that are unclear about the mechanism. Probably, the soldering of small amounts of elements dissolved in solid solution in the alloy suppresses the diffusion and movement to the interface and prevents the formation of brittle intermetallic compounds of Ti, Ni, and Sn at the solder/base metal interface. It is estimated that the content is Mn
Or less than 0.1% for Zn and 0.1% for Mg.
If it is less than 0.05%, no sufficient effect will be obtained, and conversely, even if Mn or Zn is contained in excess of 1.0%, or in the case of Mg, in excess of 0.6%, no further effect will be obtained. In addition, the electrical conductivity of the alloy is too low.
6%, Zn 0.1-1.0%.
またＭｎ、ＺｎおよびＭｇを複合的に含有せしめる場合
、その総和が１．０％を越えると合金の電気伝導度の低
下が無視できなくなるため、その総和量を０．０５−１
．０％に限定した。Furthermore, when containing Mn, Zn and Mg in combination, if the total exceeds 1.0%, the decrease in the electrical conductivity of the alloy cannot be ignored, so the total amount should be reduced to 0.05-1%.
．． It was limited to 0%.
以下本発明を実施例により説明する。 The present invention will be explained below with reference to Examples.
第１表に示す合金を高周波誘導溶解炉にて溶解、鋳造し
、鍛造および熱間圧延により厚さ５ＩＩＩｌｌまで圧延
し、ついで研削により表面の酸化スケールを除去したの
ち冷間圧延、軟化焼鈍を繰り返し最終冷間圧延率５０％
にて板厚０．２５ｍｍにしあげ、４５０℃で時効処理を
行なった。これらの試料について電気伝導度、引張強さ
、半田濡れ性および半田耐候性の試験を行なった結果を
第２表に示す。半田濡れ性については、厚さ０．２５ｏ
ｎ、幅２０画、長さ３０圃の試料を用いＭＩＩ、−５Ｔ
Ｄ−２０２Ｆ ＭＥＴＨＯｏ ２０８０に基いて半田付
けを行い、半田の濡れ状態を目視で観察した。The alloy shown in Table 1 was melted and cast in a high-frequency induction melting furnace, rolled to a thickness of 5IIIll by forging and hot rolling, and then subjected to repeated cold rolling and softening annealing after removing the oxide scale on the surface by grinding. Final cold rolling rate 50%
The plate was made to have a thickness of 0.25 mm at 450° C. and aged at 450° C. These samples were tested for electrical conductivity, tensile strength, solder wettability, and solder weather resistance, and the results are shown in Table 2. For solder wettability, the thickness is 0.25o.
MII, -5T using a sample of n, width 20 strokes and length 30 fields
D-202F Soldering was performed based on METHOo 2080, and the wetting state of the solder was visually observed.
また半田耐候性については、前記の方法で半田付けした
試料を大気中１５０℃で５００時間保持したのち半径ｚ
閣の曲率に曲げ、再度間げを戻した場合の母材からの半
田剥離状況により判定した。第１表。Regarding the solder weather resistance, after holding the sample soldered by the above method in the atmosphere at 150°C for 500 hours, the radius z
Judgment was made based on the peeling of solder from the base material when the material was bent to the curvature of the cabinet and the gap was returned again. Table 1.
第２表において、従来合金のうち試料番号１４はＮｉ入
り銅合金、番号１５はリン青銅系の高強度鋼合金、番号
１６は４２Ｎｉ合金である。In Table 2, among the conventional alloys, sample number 14 is a Ni-containing copper alloy, sample number 15 is a phosphor bronze-based high-strength steel alloy, and sample number 16 is a 42Ni alloy.
第１表
第２表
第１表および第２表の結果から明らかなように本発明合
金は高強度と高電気伝導度とを兼ね備え、さらに、良好
なる半田耐候性を有していることがわかる。Ｎｉ／Ｔｉ
比が１〜４の範囲をはずれると試料番号１，２の比較例
に示すごとく電気伝導度は著しく低下しＣｕ合金の長所
が失われ、Ｍ ｎ 、 Ｍ ｇあるいはＺｎを含有しな
いものは試料番号３に示すごとく半田耐候性が劣る。本
発明合金は、従来合金の４２Ｎｉ合金に比べ電気伝導度
は１０倍以上あり、またＮｉ入り銅合金やＳｎ、Ｐ入り
の高強度銅合金に比べ強度はほぼ同等であるが、電気伝
導度が高く、かつ半田耐候性においても優れている。As is clear from the results in Tables 1 and 2, the alloy of the present invention has both high strength and high electrical conductivity, and also has good solder weather resistance. . Ni/Ti
When the ratio is outside the range of 1 to 4, the electrical conductivity decreases significantly as shown in the comparative example of sample numbers 1 and 2, and the advantages of the Cu alloy are lost. As shown in No. 3, the solder weather resistance is poor. The electrical conductivity of the alloy of the present invention is more than 10 times that of the conventional 42Ni alloy, and the strength is almost the same as that of Ni-containing copper alloys and high-strength copper alloys containing Sn and P, but the electrical conductivity is It also has excellent solder weather resistance.
以上説明したように本発明に係る合金は半導体装置用の
リードフレーム材として十分な強度と電気伝導性を具備
し、さらに半田耐候性も良好であるため、極めて信頼性
の高いリードフレーム材となりえるものである。As explained above, the alloy according to the present invention has sufficient strength and electrical conductivity as a lead frame material for semiconductor devices, and also has good solder weather resistance, so it can be used as an extremely reliable lead frame material. It is something.
Claims (1)
〜４．０％を（Ｎｉ％／Ｔｉ％）＝１〜４の範囲内で含
有し、さらにＦｅおよびＣｏのうちの１種または２種を
合計で０．０１〜１．０％、そしてさらにＭｎ０．１〜
１、０％、Ｍｇ０．０５〜０．６％のうちの１種または
２種を合計で０．０５〜１．０％を含有し残部実質的に
Ｃｕよりなることを特徴とするリードフレーム用銅合金
。 ２ 重量％にてＮｉ０．８〜４．０％およびＴｉ０．２
〜４、０を（Ｎｉ％／Ｔｉ％）＝１〜４の範囲内で含有
し、さらにＦｅおよびＣｏのうちの１種または２種を合
計で０．０１〜１．０％、そしてさらにＭｎ０．１〜１
．０％、Ｍｇ０．０５〜０．６％のうちの１種または２
種とＺｎ０．１〜１．０％をＺｎ＋Ｍｎ＋Ｍｇの合計で
０．０５〜１．０％含有し残部実質的にＣｕよりなるこ
とを特徴とするリードフレーム用銅合金。[Claims] 1% by weight of Ni0.8-4.0% and Ti0.2%
~4.0% within the range of (Ni%/Ti%) = 1 to 4, further containing one or two of Fe and Co in a total of 0.01 to 1.0%, and further Mn0.1~
1.0%, Mg0.05-0.6%, and one or two of Mg0.05-0.6% in a total of 0.05-1.0%, and the remainder substantially consists of Cu. Copper alloy. 2% by weight Ni0.8-4.0% and Ti0.2
~4,0 within the range of (Ni%/Ti%) = 1 to 4, further containing one or two of Fe and Co in a total of 0.01 to 1.0%, and further containing Mn0 .1~1
．． 0%, one or two of Mg0.05-0.6%
A copper alloy for a lead frame, characterized in that it contains seeds and 0.1 to 1.0% of Zn in a total of 0.05 to 1.0% of Zn+Mn+Mg, and the remainder substantially consists of Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106190A JPS62263942A (en) | 1986-05-09 | 1986-05-09 | Copper alloy for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106190A JPS62263942A (en) | 1986-05-09 | 1986-05-09 | Copper alloy for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62263942A true JPS62263942A (en) | 1987-11-16 |
Family
ID=14427274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61106190A Pending JPS62263942A (en) | 1986-05-09 | 1986-05-09 | Copper alloy for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62263942A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004024964A2 (en) | 2002-09-13 | 2004-03-25 | Olin Corporation | Age-hardening copper-base alloy and processing |
| JP2006144047A (en) * | 2004-11-17 | 2006-06-08 | Dowa Mining Co Ltd | Cu-Ni-Ti BASED COPPER ALLOY AND COOLING PLATE |
-
1986
- 1986-05-09 JP JP61106190A patent/JPS62263942A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004024964A2 (en) | 2002-09-13 | 2004-03-25 | Olin Corporation | Age-hardening copper-base alloy and processing |
| WO2004024964A3 (en) * | 2002-09-13 | 2004-07-01 | Olin Corp | Age-hardening copper-base alloy and processing |
| JP2006144047A (en) * | 2004-11-17 | 2006-06-08 | Dowa Mining Co Ltd | Cu-Ni-Ti BASED COPPER ALLOY AND COOLING PLATE |
| JP4568092B2 (en) * | 2004-11-17 | 2010-10-27 | Ｄｏｗａホールディングス株式会社 | Cu-Ni-Ti copper alloy and heat sink |
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