JPS62263644A - Heat treatment equipment for wafer - Google Patents
Heat treatment equipment for waferInfo
- Publication number
- JPS62263644A JPS62263644A JP10630886A JP10630886A JPS62263644A JP S62263644 A JPS62263644 A JP S62263644A JP 10630886 A JP10630886 A JP 10630886A JP 10630886 A JP10630886 A JP 10630886A JP S62263644 A JPS62263644 A JP S62263644A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- treatment plate
- wafer
- suction
- confirmation sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 34
- 238000012790 confirmation Methods 0.000 claims abstract description 20
- 230000035945 sensitivity Effects 0.000 claims abstract description 6
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 20
- 230000033001 locomotion Effects 0.000 abstract description 8
- 238000012423 maintenance Methods 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体ウエノ・(以下単にウエノ・という)
の熱処理装置に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to semiconductor Ueno (hereinafter simply referred to as Ueno).
The present invention relates to a heat treatment apparatus.
第7図は、例えば特開昭60−169148号公報に示
されているような従来のこの種ウェハ熱処理装置の全体
構成全示す側面図である。図において、(1)、(2)
は熱処理プレート、(3)は熱処理プレート(1)ヘウ
エハを搬送する入口搬送ベルトで、この部分にウェハの
位置決めビン(図示せず)が備えである。(4)は熱処
理プレート(2)から次工程ヘウエハを送出する出口搬
送ベルト、(5)ハ上記熱処理プレート(1)と(2)
および入口搬送ベルト(3)、出口搬送ベルト(4)の
全長に亘って配設された2条の上下移動ビームで、この
上下移動ビーム(5)は熱処理プレート(1) 、 (
2)の溝(1a)、 (2a)内に収納されているが、
その両端側下方に位置するシリンダ(6)、(6)の操
作により熱処理プレー) (1) 、 (2)上に水平
上動するようになっている。(7ンはウェハの搬送アー
ムで、入口側からアーム(7a)、 (7b)、 (7
c)Th有し1.駆動手段としてカイト軸(8)、送り
ねじ(9)、モータα0)、カップリングC1iを有し
、これらはベース世)に取付けられている。上記アーム
は第8図に示すように真空吸着孔(13a) fもつ受
け03+とブラケットリ4)および受けμs)から成9
、前記上下移動ビーム(5)により持ち上げられたウェ
ハα6)全上記受けo3)、■)間に嵌入跨架せしめて
該ウェハQ6) ′l?c吸着保持し、その状態で移送
し得るようになっている。また同図に示すように、熱処
理プレート(1) 、 (2)にも真空吸着孔(H))
、 (2t))が設けられており、上記搬送アーム(ア
)によって送られてきたウェハα6)ヲ熱処理工程の間
吸着保持し得るようになっている。FIG. 7 is a side view showing the entire configuration of a conventional wafer heat treatment apparatus of this type, as disclosed in, for example, Japanese Unexamined Patent Publication No. 60-169148. In the figure, (1), (2)
1 is a heat treatment plate; (3) is an entrance conveyance belt for conveying wafers to the heat treatment plate (1); this portion is equipped with a wafer positioning bin (not shown); (4) is an exit conveyor belt that transports the wafer from the heat treatment plate (2) to the next process; (5) is the above heat treatment plate (1) and (2);
and two vertically movable beams arranged over the entire length of the inlet conveyor belt (3) and the outlet conveyor belt (4), and this vertically movable beam (5) is connected to the heat treatment plate (1), (
Although it is stored in the grooves (1a) and (2a) of 2),
By operating the cylinders (6) and (6) located below both ends thereof, the heat treatment plate (1) and (2) can be moved horizontally upward. (Number 7 is the wafer transfer arm, and from the entrance side arms (7a), (7b), (7
c) Th has 1. The driving means includes a kite shaft (8), a feed screw (9), a motor α0), and a coupling C1i, which are attached to the base. As shown in Fig. 8, the arm consists of a vacuum suction hole (13a), a bracket 03+, a bracket 4), and a receiver μs).
, the wafer α6) lifted up by the vertically moving beam (5) is inserted between all the above-mentioned receivers o3), and ■), and the wafer Q6)'l? c) It is designed to be able to be held by suction and transported in that state. In addition, as shown in the same figure, there are also vacuum suction holes (H) in the heat treatment plates (1) and (2).
, (2t)) are provided so that the wafer α6) sent by the transfer arm (A) can be held by suction during the heat treatment process.
しかして、(17)は、第9図に基本回路図を示すよう
に、両ンリンダ(6−) 、 (6)の動きのバランス
を調整するためのスピードコントローラブロックで、調
整スピンドル(17a)を有する複数のスピードコント
ローラ(17b)から成り、熱処理装置の下側に配置さ
れている。(18)は、第10図に基本回路図を示すよ
うに、各熱処理プレー) (1) 、 (2)上へのウ
ェハ(16)の吸着状態を検出する吸着確認センサブロ
ックで、感度調整ねじ(18a)を有する複数の吸着確
認セ/す(1ab)から成)、上記スピードコントロー
ラブロックα7)同様に熱処理装置の下側に配置されて
いる。As shown in the basic circuit diagram in Fig. 9, (17) is a speed controller block for adjusting the balance of movement of both cylinders (6-) and (6), and controls the adjustment spindle (17a). It consists of a plurality of speed controllers (17b) and is arranged below the heat treatment apparatus. (18) is an adsorption confirmation sensor block that detects the adsorption state of the wafer (16) onto each heat treatment plate (1), (2), as shown in the basic circuit diagram in Fig. 10. (18a) and a plurality of adsorption confirmation cells (1ab)), and the speed controller block α7) is similarly arranged at the lower side of the heat treatment apparatus.
従来のウェハ熱処理装置に、以上のように、スピードコ
ントローラ(lII7)および吸着確認センサブロック
(18)が熱処理装置の下側に配置されているため、熱
処理装置の組立完了時および組立完了後の保守点検の際
に、スピンドル(17a)やねじ(18a)の調整作業
がやりにくく、その都度必要により装置を分解しなけれ
ばならないという問題があった。As described above, in the conventional wafer heat processing equipment, the speed controller (lII7) and the suction confirmation sensor block (18) are arranged below the heat processing equipment, so maintenance is required when and after the assembly of the heat processing equipment is completed. At the time of inspection, it was difficult to adjust the spindle (17a) and screws (18a), and there was a problem in that the device had to be disassembled each time if necessary.
本発明は以上の点に鑑み、調整作業が容易で、調整保守
コストを低減させることのできるウェハ熱処理装置を得
ることを目的とする。In view of the above points, it is an object of the present invention to provide a wafer heat processing apparatus that is easy to adjust and can reduce adjustment and maintenance costs.
本発明に係るウェハ熱処理装置は、スピードコントロー
ラブロックおよび吸着確認センサブロックを熱処理プレ
ート近傍の装置上面側に配置したものである。The wafer heat processing apparatus according to the present invention has a speed controller block and a suction confirmation sensor block arranged on the upper surface of the apparatus near the heat processing plate.
本発明においては、装置の上面側でシリンダの動きのス
ピード調整や吸着確認センサの感度調整等の作業を行な
えるため、他の部品等に邪魔されることかなく前記調整
作業が容易となり、更にシリンダの動きや熱処理プレー
ト上へのウニノーの吸着時における吸着確認センサの応
答状態を視認し得、作業時間を短縮させることができる
。In the present invention, since operations such as adjusting the speed of the cylinder movement and adjusting the sensitivity of the suction confirmation sensor can be performed on the top side of the device, the adjustment operations are facilitated without being obstructed by other parts, and furthermore, It is possible to visually check the movement of the cylinder and the response state of the suction confirmation sensor when Unino is adsorbed onto the heat treatment plate, thereby reducing the work time.
〔実施例〕 −
以下、従来に相当する部分には同一符号を付して示す第
1図乃至第6図の実施例について本発明を説明する。図
において、(19)は両シリンダ(6L(6)の動きの
バランスを調整するための従来同様のスピードコントロ
ーラブロックで、第1図および第5図に示す如く、熱処
理プレート(1)近傍の装置上面側に配置きれており、
その調整スピンドル(17a)による両ノリンダ(6)
、 (6)のスピード調整時には上下移動ビーム(5
)の動きを視認することによって両シリンダ(6)、(
6)の作動状態を確認することができる。視)は谷熱処
理プレー) (1) 、 (2)上へのウニ/)α6)
の吸着状態を検出するための従来同様の吸着確認センサ
ブロックで、第1図および第5図に示す如く、熱処理プ
レート(2)近傍の装置上面側に配置されており、調整
ねじ(18a)による感度調整時には各熱処理プレート
(1) 、 (2)上へのウェハQ6)の吸着状態およ
び吸着確認センナ(18b)の応答状態を直接視認する
ことによって確認することができる。上記以外の構成は
従来と同様であり、その説明は省略する。[Embodiment] - Hereinafter, the present invention will be described with reference to an embodiment shown in FIGS. 1 to 6, in which parts corresponding to conventional ones are denoted by the same reference numerals. In the figure, (19) is a speed controller block similar to the conventional one for adjusting the balance of movement of both cylinders (6L (6)), and as shown in Figures 1 and 5, the device near the heat treatment plate (1) It can be placed on the top side,
Both norindas (6) with their adjusting spindles (17a)
, When adjusting the speed in (6), the vertical moving beam (5
) by visually checking the movement of both cylinders (6), (
6) The operating status of item 6) can be confirmed. View) is valley heat treatment play) (1), (2) upward sea urchin/) α6)
This is a suction confirmation sensor block similar to the conventional one for detecting the adsorption state of When adjusting the sensitivity, the adsorption state of the wafer Q6) onto each of the heat treatment plates (1) and (2) and the response state of the adsorption confirmation sensor (18b) can be confirmed by directly visual confirmation. The configuration other than the above is the same as the conventional one, and the explanation thereof will be omitted.
このように本発明のウェハ熱処理装置は、装置の上面側
で両シリンダ(6) 、 (6)の動きのスピード調整
や吸着確認センナ(iab)の感度調整等の作業を行な
えるため、装置の組立完了時や組立完了後の保守点検時
に装置を分解する必要がなく、作業が容易となり、調整
保守コス)f低減させることができる。As described above, the wafer heat processing apparatus of the present invention allows operations such as adjusting the speed of movement of both cylinders (6) and (6) and adjusting the sensitivity of the suction confirmation sensor (IAB) from the top side of the apparatus. There is no need to disassemble the device upon completion of assembly or during maintenance and inspection after completion of assembly, making work easier and reducing adjustment and maintenance costs.
以上述べたように、本発明によれば、熱処理プレート上
へのウェハの吸着状態を検出する吸着確認センサおよび
熱処理プレート上からウェハを離間せしめるためのシリ
ンダへの流体の流量調整手段を熱処理プレート近傍の装
置上面側に配置してこれらの調整作業を装置上面側で行
なえるようにしたので、作業性を著しく向上させ得、調
整保守コストの低減化が図れるという効果がある。As described above, according to the present invention, the suction confirmation sensor for detecting the adsorption state of the wafer on the heat treatment plate and the fluid flow rate adjustment means for the cylinder for separating the wafer from the heat treatment plate are installed near the heat treatment plate. Since the adjustment work can be performed on the top side of the device by disposing it on the top side of the device, the workability can be significantly improved and adjustment and maintenance costs can be reduced.
M1図は本発明に係るウェハ熱処理装置の実施例を示す
平面図、第2図は第1図のものの側面図、第5図は第1
図のものの■−■線に沿う断面図、第4図はスピードコ
ントローラブロック取付部を拡大して示す平面図、第5
図は第1図のもののV−V線に沿う断面図、第6図は吸
着確認センサブロック取付部を拡大して示す平面図、第
7図は従来装置を示す第2図相当図、第8図は第7図の
ものの搬送アーム部を拡大して示す第3図相当図、第9
図はエアー駆動系の基本回路図、第10図は吸着確認系
の基本回路図である。
(1) 、 (2)・・熱処理プレート(11))、
(21))・・真空吸着孔(固定手段)α6)・・半導
体ウエノ・
(19)・・スピードコントローラブロック(流量調整
手段)
(イ))・畳吸着確認センサブロック
なお、各図中、同一符号に同−又は相当部分を示す。Figure M1 is a plan view showing an embodiment of the wafer heat treatment apparatus according to the present invention, Figure 2 is a side view of the one in Figure 1, and Figure 5 is a side view of the one in Figure 1.
Figure 4 is a cross-sectional view taken along the line ■-■ of the figure; Figure 4 is a plan view showing an enlarged view of the speed controller block mounting section;
The figure is a sectional view taken along the line V-V of the one in Figure 1, Figure 6 is an enlarged plan view showing the suction confirmation sensor block attachment part, Figure 7 is a view equivalent to Figure 2 showing the conventional device, and Figure 8 The figure is a view corresponding to Figure 3 showing an enlarged view of the transport arm of Figure 7, and Figure 9.
The figure is a basic circuit diagram of the air drive system, and FIG. 10 is a basic circuit diagram of the suction confirmation system. (1), (2)...Heat treatment plate (11)),
(21)) Vacuum suction hole (fixing means) α6) Semiconductor wafer (19) Speed controller block (flow rate adjustment means) (a)) Tatami suction confirmation sensor block Note that the same The same or equivalent part is indicated by the symbol.
Claims (1)
段と、上記熱処理プレート上への半導体ウェハの吸着状
態を検出する感度調整可能な吸着確認センサと、上記半
導体ウェハを上記熱処理プレートの保持力に抗して該熱
処理プレートから離間せしめるための駆動力を付与する
シリンダと、このシリンダへの流体流量を制御する流量
調整手段とを備えたウェハ熱処理装置において、上記吸
着確認センサおよび流量調整手段を上記熱処理プレート
近傍の装置上面側に配置したことを特徴とするウェハ熱
処理装置。A fixing means for suctioning and holding the semiconductor wafer on the heat treatment plate, a suction confirmation sensor with adjustable sensitivity for detecting the adsorption state of the semiconductor wafer on the heat treatment plate, and a suction confirmation sensor for holding the semiconductor wafer on the heat treatment plate against the holding force of the heat treatment plate. In a wafer heat treatment apparatus, the adsorption confirmation sensor and the flow rate adjustment means are connected to the heat treatment plate. A wafer heat processing apparatus characterized in that the apparatus is disposed on the upper surface side of the apparatus nearby.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10630886A JPS62263644A (en) | 1986-05-09 | 1986-05-09 | Heat treatment equipment for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10630886A JPS62263644A (en) | 1986-05-09 | 1986-05-09 | Heat treatment equipment for wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62263644A true JPS62263644A (en) | 1987-11-16 |
Family
ID=14430365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10630886A Pending JPS62263644A (en) | 1986-05-09 | 1986-05-09 | Heat treatment equipment for wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62263644A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0272622A (en) * | 1988-09-07 | 1990-03-12 | Teru Kyushu Kk | Ashing device |
-
1986
- 1986-05-09 JP JP10630886A patent/JPS62263644A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0272622A (en) * | 1988-09-07 | 1990-03-12 | Teru Kyushu Kk | Ashing device |
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