JPS62250050A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS62250050A JPS62250050A JP9137186A JP9137186A JPS62250050A JP S62250050 A JPS62250050 A JP S62250050A JP 9137186 A JP9137186 A JP 9137186A JP 9137186 A JP9137186 A JP 9137186A JP S62250050 A JPS62250050 A JP S62250050A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- group
- polyamide
- resin
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 13
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 13
- 125000003277 amino group Chemical group 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 9
- 125000004018 acid anhydride group Chemical group 0.000 claims abstract description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 claims description 3
- 125000005462 imide group Chemical group 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 abstract description 23
- 229920002647 polyamide Polymers 0.000 abstract description 23
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract description 18
- -1 poly(2,6-dimethyl-1,4-phenylene) Polymers 0.000 abstract description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- 229920001007 Nylon 4 Polymers 0.000 abstract description 2
- 241001082241 Lythrum hyssopifolia Species 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 7
- 239000003921 oil Substances 0.000 description 6
- 235000019198 oils Nutrition 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 6
- 102000016941 Rho Guanine Nucleotide Exchange Factors Human genes 0.000 description 4
- 108010053823 Rho Guanine Nucleotide Exchange Factors Proteins 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- WSWCOQWTEOXDQX-UHFFFAOYSA-N 2,4-Hexadienoic acid Chemical compound CC=CC=CC(O)=O WSWCOQWTEOXDQX-UHFFFAOYSA-N 0.000 description 2
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- YIYBQIKDCADOSF-UHFFFAOYSA-N alpha-Butylen-alpha-carbonsaeure Natural products CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 235000014593 oils and fats Nutrition 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HMFPLNNQWZGXAH-OCOZRVBESA-N trans-2-hexacosenoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC\C=C\C(O)=O HMFPLNNQWZGXAH-OCOZRVBESA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LKOVPWSSZFDYPG-WUKNDPDISA-N trans-octadec-2-enoic acid Chemical compound CCCCCCCCCCCCCCC\C=C\C(O)=O LKOVPWSSZFDYPG-WUKNDPDISA-N 0.000 description 2
- YIYBQIKDCADOSF-ONEGZZNKSA-N trans-pent-2-enoic acid Chemical compound CC\C=C\C(O)=O YIYBQIKDCADOSF-ONEGZZNKSA-N 0.000 description 2
- BITHHVVYSMSWAG-KTKRTIGZSA-N (11Z)-icos-11-enoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCC(O)=O BITHHVVYSMSWAG-KTKRTIGZSA-N 0.000 description 1
- XSXIVVZCUAHUJO-HZJYTTRNSA-N (11Z,14Z)-icosadienoic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCCCC(O)=O XSXIVVZCUAHUJO-HZJYTTRNSA-N 0.000 description 1
- WBBQTNCISCKUMU-PDBXOOCHSA-N (13Z,16Z,19Z)-docosatrienoic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCCCCCC(O)=O WBBQTNCISCKUMU-PDBXOOCHSA-N 0.000 description 1
- NIONDZDPPYHYKY-SNAWJCMRSA-N (2E)-hexenoic acid Chemical compound CCC\C=C\C(O)=O NIONDZDPPYHYKY-SNAWJCMRSA-N 0.000 description 1
- CWMPPVPFLSZGCY-VOTSOKGWSA-N (2E)-oct-2-enoic acid Chemical compound CCCCC\C=C\C(O)=O CWMPPVPFLSZGCY-VOTSOKGWSA-N 0.000 description 1
- YKHVVNDSWHSBPA-BLHCBFLLSA-N (2E,4E)-deca-2,4-dienoic acid Chemical compound CCCCC\C=C\C=C\C(O)=O YKHVVNDSWHSBPA-BLHCBFLLSA-N 0.000 description 1
- ADHNUPOJJCKWRT-JLXBFWJWSA-N (2e,4e)-octadeca-2,4-dienoic acid Chemical compound CCCCCCCCCCCCC\C=C\C=C\C(O)=O ADHNUPOJJCKWRT-JLXBFWJWSA-N 0.000 description 1
- SZQQHKQCCBDXCG-BAHYSTIISA-N (2e,4e,6e)-hexadeca-2,4,6-trienoic acid Chemical compound CCCCCCCCC\C=C\C=C\C=C\C(O)=O SZQQHKQCCBDXCG-BAHYSTIISA-N 0.000 description 1
- FPRKGXIOSIUDSE-SYACGTDESA-N (2z,4z,6z,8z)-docosa-2,4,6,8-tetraenoic acid Chemical compound CCCCCCCCCCCCC\C=C/C=C\C=C/C=C\C(O)=O FPRKGXIOSIUDSE-SYACGTDESA-N 0.000 description 1
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 1
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- SDVVLIIVFBKBMG-ONEGZZNKSA-N (E)-penta-2,4-dienoic acid Chemical compound OC(=O)\C=C\C=C SDVVLIIVFBKBMG-ONEGZZNKSA-N 0.000 description 1
- HVGRZDASOHMCSK-UHFFFAOYSA-N (Z,Z)-13,16-docosadienoic acid Natural products CCCCCC=CCC=CCCCCCCCCCCCC(O)=O HVGRZDASOHMCSK-UHFFFAOYSA-N 0.000 description 1
- XKZKQTCECFWKBN-VOTSOKGWSA-N (e)-dec-4-enoic acid Chemical compound CCCCC\C=C\CCC(O)=O XKZKQTCECFWKBN-VOTSOKGWSA-N 0.000 description 1
- GCORITRBZMICMI-CMDGGOBGSA-N (e)-dodec-4-enoic acid Chemical compound CCCCCCC\C=C\CCC(O)=O GCORITRBZMICMI-CMDGGOBGSA-N 0.000 description 1
- IJBFSOLHRKELLR-BQYQJAHWSA-N (e)-dodec-5-enoic acid Chemical compound CCCCCC\C=C\CCCC(O)=O IJBFSOLHRKELLR-BQYQJAHWSA-N 0.000 description 1
- JLIDBLDQVAYHNE-IBPUIESWSA-N (s)-(+)-Abscisic acid Natural products OC(=O)\C=C(/C)\C=C\[C@@]1(O)C(C)=CC(=O)CC1(C)C JLIDBLDQVAYHNE-IBPUIESWSA-N 0.000 description 1
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- SCFWAOWWAANBPY-UHFFFAOYSA-N 2,2-dimethyl-3-butenoic acid Chemical compound C=CC(C)(C)C(O)=O SCFWAOWWAANBPY-UHFFFAOYSA-N 0.000 description 1
- YKHVVNDSWHSBPA-UHFFFAOYSA-N 2,4-Decadienoic acid Natural products CCCCCC=CC=CC(O)=O YKHVVNDSWHSBPA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CWMPPVPFLSZGCY-UHFFFAOYSA-N 2-Octenoic Acid Natural products CCCCCC=CC(O)=O CWMPPVPFLSZGCY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- IFXSWTIWFGIXQO-AOOOYVTPSA-N 2-chloro-5-[(3s,5r)-3,5-dimethylpiperidin-1-yl]sulfonylbenzoic acid Chemical compound C1[C@@H](C)C[C@@H](C)CN1S(=O)(=O)C1=CC=C(Cl)C(C(O)=O)=C1 IFXSWTIWFGIXQO-AOOOYVTPSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- OKJQSUPURXTNME-UHFFFAOYSA-N 2-prop-2-enylpent-4-enoic acid Chemical compound C=CCC(C(=O)O)CC=C OKJQSUPURXTNME-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HQSBWLQFLLMPKC-BNFZFUHLSA-N 2E,4E-Dodecadienoic acid Chemical compound CCCCCCC\C=C\C=C\C(O)=O HQSBWLQFLLMPKC-BNFZFUHLSA-N 0.000 description 1
- RSFQOQOSOMBPEJ-PLNGDYQASA-N 3-methyl-2Z-pentenoic acid Chemical compound CC\C(C)=C/C(O)=O RSFQOQOSOMBPEJ-PLNGDYQASA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- FPAQLJHSZVFKES-UHFFFAOYSA-N 5-Eicosenoic acid Natural products CCCCCCCCCCCCCCC=CCCCC(O)=O FPAQLJHSZVFKES-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 1
- 235000021294 Docosapentaenoic acid Nutrition 0.000 description 1
- 235000021292 Docosatetraenoic acid Nutrition 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- GCORITRBZMICMI-UHFFFAOYSA-N Linderic acid Natural products CCCCCCCC=CCCC(O)=O GCORITRBZMICMI-UHFFFAOYSA-N 0.000 description 1
- BGRDGMRNKXEXQD-UHFFFAOYSA-N Maleic hydrazide Chemical compound OC1=CC=C(O)N=N1 BGRDGMRNKXEXQD-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 101100208721 Mus musculus Usp5 gene Proteins 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000019483 Peanut oil Nutrition 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 241001125046 Sardina pilchardus Species 0.000 description 1
- CUVLOCDGQCUQSI-KHPPLWFESA-N Tsuzuic acid Chemical compound CCCCCCCCC\C=C/CCC(O)=O CUVLOCDGQCUQSI-KHPPLWFESA-N 0.000 description 1
- CUVLOCDGQCUQSI-UHFFFAOYSA-N Tsuzusaeure Natural products CCCCCCCCCC=CCCC(O)=O CUVLOCDGQCUQSI-UHFFFAOYSA-N 0.000 description 1
- NIONDZDPPYHYKY-UHFFFAOYSA-N Z-hexenoic acid Natural products CCCC=CC(O)=O NIONDZDPPYHYKY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 1
- AHANXAKGNAKFSK-PDBXOOCHSA-N all-cis-icosa-11,14,17-trienoic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCCCC(O)=O AHANXAKGNAKFSK-PDBXOOCHSA-N 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- PVEOYINWKBTPIZ-UHFFFAOYSA-N but-3-enoic acid Chemical compound OC(=O)CC=C PVEOYINWKBTPIZ-UHFFFAOYSA-N 0.000 description 1
- 239000010495 camellia oil Substances 0.000 description 1
- KHAVLLBUVKBTBG-UHFFFAOYSA-N caproleic acid Natural products OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- QDRSJFZQMOOSAF-IHWYPQMZSA-N cis-9-undecenoic acid Chemical compound C\C=C/CCCCCCCC(O)=O QDRSJFZQMOOSAF-IHWYPQMZSA-N 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- CVCXSNONTRFSEH-UHFFFAOYSA-N docosa-2,4-dienoic acid Chemical compound CCCCCCCCCCCCCCCCCC=CC=CC(O)=O CVCXSNONTRFSEH-UHFFFAOYSA-N 0.000 description 1
- HQSBWLQFLLMPKC-UHFFFAOYSA-N dodecadienoic acid Natural products CCCCCCCC=CC=CC(O)=O HQSBWLQFLLMPKC-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 1
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ZHYZQXUYZJNEHD-VQHVLOKHSA-N geranic acid Chemical compound CC(C)=CCC\C(C)=C\C(O)=O ZHYZQXUYZJNEHD-VQHVLOKHSA-N 0.000 description 1
- 229930008392 geranic acid Natural products 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000004438 haloalkoxy group Chemical group 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000010460 hemp oil Substances 0.000 description 1
- IQLUYYHUNSSHIY-UHFFFAOYSA-N icosa-2,4,6,8-tetraenoic acid Chemical compound CCCCCCCCCCCC=CC=CC=CC=CC(O)=O IQLUYYHUNSSHIY-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- FSQQTNAZHBEJLS-UPHRSURJSA-N maleamic acid Chemical compound NC(=O)\C=C/C(O)=O FSQQTNAZHBEJLS-UPHRSURJSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- CPHCIYGRSFZNRD-UHFFFAOYSA-N n-methyl-1-(4,5,6,7-tetrahydro-1h-indazol-3-yl)methanamine Chemical compound C1CCCC2=C1NN=C2CNC CPHCIYGRSFZNRD-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 239000000312 peanut oil Substances 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-N pent-4-enoic acid Chemical compound OC(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 235000019512 sardine Nutrition 0.000 description 1
- 239000008159 sesame oil Substances 0.000 description 1
- 235000011803 sesame oil Nutrition 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229950005201 tibric acid Drugs 0.000 description 1
- XKZKQTCECFWKBN-UHFFFAOYSA-N trans-4-decenoic acid Natural products CCCCCC=CCCC(O)=O XKZKQTCECFWKBN-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZHYZQXUYZJNEHD-UHFFFAOYSA-N trans-geranic acid Natural products CC(C)=CCCC(C)=CC(O)=O ZHYZQXUYZJNEHD-UHFFFAOYSA-N 0.000 description 1
- UIUWNILCHFBLEQ-NSCUHMNNSA-N trans-pent-3-enoic acid Chemical compound C\C=C\CC(O)=O UIUWNILCHFBLEQ-NSCUHMNNSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ポリフェニレンオキサイド系樹脂とポリアミ
ド樹脂を含む樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin composition containing a polyphenylene oxide resin and a polyamide resin.
［従来の技術］
ポリフェニレンオキサイドは、その優れた機械的性質及
び電気的性質の故に成形材料用樹脂として有用であるが
、耐油性が不十分である。この点を改善するために、ポ
リフェニレンオキサイドと耐油性の良いポリアミドとを
混合することが知られている（たとえば特開昭５６−１
６５２５）。しかし、ポリフェニレンオキサイドとポリ
アミドは互の相溶性が悪いので、これらを混合した樹脂
組成物から成形した成形品において、両樹脂が本来右し
ている特性たとえば良好な機械的特性が発揮されないと
いう問題がある。この点を改善するために、分子内に（
ａ）炭素−炭素二重又は三重結合および（ｂ）カルボン
酸基、酸無水物基、酸アミド基、イミド基、カルボン酸
エステル基、又はエポキシ基を有する化合物を添加して
、耐油性改善を得ながら耐衝撃性を向上させる試みがな
された（特開昭５６−２６９１３号）。[Prior Art] Polyphenylene oxide is useful as a resin for molding materials because of its excellent mechanical and electrical properties, but it has insufficient oil resistance. In order to improve this point, it is known to mix polyphenylene oxide and polyamide with good oil resistance (for example, JP-A-56-1
6525). However, since polyphenylene oxide and polyamide have poor compatibility with each other, molded products made from resin compositions that are a mixture of these resins have the problem of not exhibiting the properties that both resins originally possess, such as good mechanical properties. be. In order to improve this point, we added (
Oil resistance can be improved by adding a compound having a) a carbon-carbon double or triple bond and (b) a carboxylic acid group, an acid anhydride group, an acid amide group, an imide group, a carboxylic acid ester group, or an epoxy group. Attempts were made to improve the impact resistance while maintaining the same properties (Japanese Patent Application Laid-open No. 56-26913).
しかしながら、この組成物より作られた成形品の表面外
観が悪くなるという傾向があり、この点に解決すべき問
題が残されている。However, there is a tendency for the surface appearance of molded articles made from this composition to deteriorate, and this remains a problem to be solved.
［発明の構成］
本発明者は、ポリフェニレンオキサイド系樹脂、ポリア
ミド樹脂、及び上述した化合物を含む樹脂組成物におい
て、ポリアミドとして末端アミノ基量が末端カルボキシ
ルｌｆｆ１に比較して多いポリアミド樹脂を用いること
によって、この樹脂組成物から作られた成形品の耐油性
が良好なままで成形品の表面外観が著しく改善され、か
つ加えて驚ろくべきことに耐衝撃性などの機械的強度が
一層改善されることを見い出して本発明を完成した。[Structure of the Invention] In a resin composition containing a polyphenylene oxide resin, a polyamide resin, and the above-mentioned compound, the present inventors have solved the problem by using a polyamide resin having a larger amount of terminal amino groups than the terminal carboxyl lff1 as the polyamide. , the surface appearance of molded products made from this resin composition is significantly improved while maintaining good oil resistance, and in addition, surprisingly, mechanical strength such as impact resistance is further improved. They discovered this and completed the present invention.
すなわち、本発明は、
（Ａ） ポリフェニレンオキサイド系樹脂５〜８０重
量部
（Ｂ） 末端アミノ基量が末端カルボキシル基量より
多いポリアミド樹脂９５〜２０重量部（Ｃ） 上記成
分（八）及び（Ｂ）の合計１ｏｏ重量部に対して０．０
１〜１０重Ｒ部の、分子内に（１）炭素−炭素二重結合
又は炭素−炭素三重結合を有しかつ（２）カルボキシル
基、酸無水物基、酸アミド基、イミド基、カルボン酸エ
ステル基、又はエポキシ基を有する化合物
を含む樹脂組成物である。That is, the present invention comprises (A) 5 to 80 parts by weight of a polyphenylene oxide resin (B) 95 to 20 parts by weight of a polyamide resin in which the amount of terminal amino groups is greater than the amount of terminal carboxyl groups (C) The above components (8) and (B) )0.0 per 10 parts by weight
1 to 10 R parts, having (1) a carbon-carbon double bond or a carbon-carbon triple bond in the molecule, and (2) a carboxyl group, acid anhydride group, acid amide group, imide group, carboxylic acid A resin composition containing a compound having an ester group or an epoxy group.
ここでポリフェニレンオキサイド系樹脂は、それ自体公
知であり、たとえば一般式
〔式中Ｒ１，Ｒ２，Ｒ３並びにＲ４は水素、ハロゲン、
アルキル基、アルコキシ基、ハロゲン原子とフェニル環
との間に少くとも２個の炭素原子を有するハロアルキル
基およびハロアルコキシ基で第３級α−炭素を含まない
ものから選んだ一価置換基を示し、ｎは重合度を表わす
整数である〕
で表わされる重合体の総称であって、上記一般式で表わ
される重合体の一種単独であっても、二種以上が組合わ
された共重合体であってもよい。好ましい具体例ではＲ
およびＲ２は炭素原子数１〜４のアルキル基であり、Ｒ
３，Ｒ４は水素もしくは炭素原子数１〜４のアルギル基
である。例えばポリ（２，６−シメチルー１．４−フェ
ニレン）エーテル、ポリ（２，６−ジエチル−１，４−
フエニレン）エーテル、ポリ（２−メチル−６−エチル
−１，４−フエニレン）エーテル、ポリ（２−メチル−
６−ブロビルー１．４−フェニレン）エーテル、ポリ（
２，６−ジプロビルー１，４−フェニレン）エーテル、
ポリ（２−エチル−６−ブロビルー１．４−フェニレン
）エーテル、などが挙げられる。特に好ましいポリフェ
ニレンエーテル樹脂はポリ（２，６−シメチルー１．１
−）］−ニレン）エーテルである。またポリフェニレン
エーテル共重合体どしては上記ポリフェニレンエーテル
繰返し単位中にアルキル三置換フェノールたとえは２．
３．６−トリメチルフエノールを一部含有する共重合体
を挙げることができる。またこれらのポリフェニレンエ
ーテルに、スチレン系化合物がグラフトした共重合体で
あってもよい。Here, the polyphenylene oxide resin is known per se, and includes, for example, the general formula [wherein R1, R2, R3 and R4 are hydrogen, halogen,
Indicates a monovalent substituent selected from alkyl groups, alkoxy groups, haloalkyl groups having at least two carbon atoms between the halogen atom and the phenyl ring, and haloalkoxy groups that do not contain a tertiary α-carbon. , n is an integer representing the degree of polymerization] It is a general term for polymers represented by You can. In a preferred embodiment, R
and R2 is an alkyl group having 1 to 4 carbon atoms, and R2 is an alkyl group having 1 to 4 carbon atoms;
3, R4 is hydrogen or an argyl group having 1 to 4 carbon atoms. For example, poly(2,6-dimethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-
phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-
6-broby-1,4-phenylene)ether, poly(
2,6-diprobyl-1,4-phenylene) ether,
Examples include poly(2-ethyl-6-broby-1,4-phenylene) ether. A particularly preferred polyphenylene ether resin is poly(2,6-cymethyl-1.1
-)]-nylene) ether. Also, for polyphenylene ether copolymers, alkyl trisubstituted phenols, such as 2.
A copolymer partially containing 3,6-trimethylphenol can be mentioned. Alternatively, a copolymer in which a styrene compound is grafted onto these polyphenylene ethers may be used.
スチレン系化合物グラフト化ポリフェニレンエーテルと
しては上記ポリフェニレンエーテルに、スチレン系化合
物として、例えばスチレン、α−メヂルスチレン、ビニ
ルトルエン、りＯルスチレンなどをグラフト重合して得
られる共重合体である。The styrene-based compound-grafted polyphenylene ether is a copolymer obtained by graft polymerizing a styrene-based compound, such as styrene, α-methylstyrene, vinyltoluene, orylstyrene, to the above-mentioned polyphenylene ether.
ポリアミド樹脂自体は公知であり、たとえばナイロン−
４、ナイロン−６、ナイロン−６，６、ナイロン−１２
、ナイロン６．１０などが挙げられるが、これらに限定
されない。本発明において必須なことは、ポリアミドの
末端アミン基量が末端カルボキシル基量に比較して多い
ことである。このようなポリアミドは、ポリアミドの重
合の際にたとえばカルボキシル基と反応する基を持つ化
合物例えばジアミンを余分に添加することによって得る
ことができる。あるいは、ポリアミドの重合の後に、た
とえばカルボキシル基と反応する基を有する化合物と反
応させることによっても得ることができる。Polyamide resins themselves are well known, such as nylon-
4, Nylon-6, Nylon-6,6, Nylon-12
, nylon 6.10, etc., but are not limited to these. What is essential in the present invention is that the amount of terminal amine groups in the polyamide is greater than the amount of terminal carboxyl groups. Such a polyamide can be obtained by adding an extra compound having a group that reacts with a carboxyl group, such as a diamine, during the polymerization of the polyamide. Alternatively, it can also be obtained by polymerizing polyamide and then reacting it with a compound having a group that reacts with a carboxyl group.
本発明において、（八）ポリフェニレンオキサイド系樹
脂と（Ｂ）末端アミノ基量が末端カルボキシル基量に比
較して多いポリアミド樹脂は、各々５〜８０重量部及び
９５〜２０重量部の範囲で配合される。In the present invention, (8) a polyphenylene oxide resin and (B) a polyamide resin having a larger amount of terminal amino groups than the amount of terminal carboxyl groups are blended in the range of 5 to 80 parts by weight and 95 to 20 parts by weight, respectively. Ru.
成分（Ｂ）がこれより多くなると成分（Ａ）自体の望ま
しい性質が実現されず、他方、これより少くなると成分
（Ｂ）を加える目的つまり耐油性の改善が達成されない
。成分（Ａ）と成分（Ｂ）の好ましい配合比率は、成分
（Ａ） ３０〜７０重量部、成分（Ｂ） ７０〜３０重
量部である。If the amount of component (B) is more than this, the desired properties of component (A) itself will not be achieved, while if it is less than this, the purpose of adding component (B), which is to improve oil resistance, will not be achieved. A preferred blending ratio of component (A) and component (B) is 30 to 70 parts by weight of component (A) and 70 to 30 parts by weight of component (B).
成分（Ｃ）は成分（Ａ）及び成分（Ｂ）の合計１００重
固部に対して０．０１〜１０重量部、好ましくは０．０
１〜５重量部、さらに好ましくは０．１〜２重量部配合
される。０．０１１重部未満では意図する効果が発揮さ
れず、１０重量部を超えると成形品の外観を悪化させる
場合がある。Component (C) is 0.01 to 10 parts by weight, preferably 0.0 parts by weight, based on the total of 100 parts by weight of components (A) and (B).
It is blended in an amount of 1 to 5 parts by weight, more preferably 0.1 to 2 parts by weight. If it is less than 0.011 parts by weight, the intended effect will not be exhibited, and if it exceeds 10 parts by weight, the appearance of the molded product may deteriorate.
本発明において成分（Ｃ）の例としては、無水マレイン
酸、マレイン酸、フマール酸、マレイミド、マレイン酸
ヒドラジド、無水マレイン酸とジアミンとの反応物たと
えば
〔但し、Ｒは脂肪族、芳香族基を示す。〕などで示され
る構造を有するもの、無水メチルプジツク酸、無水ジク
［１１コマレイン酸、マレイン酸アミド、大豆油、キリ
油、ヒマシ油、アマニ油、麻実油、綿実油、ゴマ油、菜
種油、落花生油、椿油、オリーブ油、ヤシ油、イワシ油
などの天然油脂類、エポキシ化大豆油などのエポキシ化
天然油脂類、アクリル酸、ブテン酸、クロトン酸、ビニ
ル酢酸、メタクリル酸、ペンテン酸、アンゲリカ酸、チ
ブリン酸、２−ベンゾン酸、３−ペンテン酸、α−エチ
ルアクリル酸、β−メチルクロトン酸、４−ペンテン酸
、２−ヘキセン酸、２−メチル−２＝ペンテン酸、３−
メチル−２−ペンテン酸、α−エヂルクロトン酸、２，
２−ジメチル−３−ブテン酸、２−ヘプテン酸、２−オ
クテン酸、４−デセン酸、９−ウンデセン酸、１０−ウ
ンデセン酸、４−ドデセン酸、５−ドデセン酸、４−テ
トラデセン酸、９−テトラデセン酸、９−へキサデセン
酸、２−オクタデセン酸、９−オクタデセン酸、アイコ
セン酸、トコセン酸、エルカ酸、テトラエン酸、マイコ
リベン酸、２，４−ペンタジェン酸、２，４−ヘキサジ
エン酸、ジアリル酢酸、ゲラニウム酸、２，４−デカジ
エン酸、２，４−ドデカジエン酸、９．１２−ヘキサデ
カジエン酸、９．１２−オクタデカジエン酸、ヘキサデ
カトリエン酸、リノール酸、リルン酸、オクタデカトリ
エン酸、アイコサジエン酸、アイコサトリエン酸、アイ
コサテトラエン酸、リシノール酸、エレオステアリン酸
、オレイン酸、アイコサペンタエン酸、エルシン酸、ド
コサジエン酸、ドコサトリエン酸、ドコサテトラエン酸
、ドコサペンタエン酸、テトラエン酸、ヘキザコセン酸
、ヘキサコシエン酸、オクタデセン酸、トラアコンテン
酸などの不飽和カルボン酸、あるいはこれら不飽和カル
ボン酸のエステル、酸アミド、無水物、あるいはブタジ
ェン、イソプレンなどの低重合体（たとえば平均分子量
が５００から１ｏｏｏｏぐらいのもの）あるいは高分子
量体くたとえば平均分子量がｉ ｏｏｏｏ以上のもの）
に無水マレイン酸をイ４加したもの、あるいはカルボン
酸基、エポキシ基などを導入したものなどが挙げられる
。Examples of component (C) in the present invention include maleic anhydride, maleic acid, fumaric acid, maleimide, maleic acid hydrazide, and a reaction product of maleic anhydride and diamine [However, R represents an aliphatic or aromatic group. show. ] etc., methyl psidic anhydride, didicanhydride [11comaleic acid, maleic acid amide, soybean oil, tung oil, castor oil, linseed oil, hempseed oil, cottonseed oil, sesame oil, rapeseed oil, peanut oil, camellia oil , natural oils and fats such as olive oil, coconut oil, and sardine oil, epoxidized natural oils and fats such as epoxidized soybean oil, acrylic acid, butenoic acid, crotonic acid, vinyl acetic acid, methacrylic acid, pentenoic acid, angelic acid, tibric acid, 2-Benzonic acid, 3-pentenoic acid, α-ethyl acrylic acid, β-methylcrotonic acid, 4-pentenoic acid, 2-hexenoic acid, 2-methyl-2=pentenoic acid, 3-
Methyl-2-pentenoic acid, α-edylcrotonic acid, 2,
2-dimethyl-3-butenoic acid, 2-heptenoic acid, 2-octenoic acid, 4-decenoic acid, 9-undecenoic acid, 10-undecenoic acid, 4-dodecenoic acid, 5-dodecenoic acid, 4-tetradecenoic acid, 9 -Tetradecenoic acid, 9-hexadenoic acid, 2-octadecenoic acid, 9-octadenoic acid, icosenoic acid, tocosenoic acid, erucic acid, tetraenoic acid, mycolibenic acid, 2,4-pentadienoic acid, 2,4-hexadienoic acid, diallyl Acetic acid, geranic acid, 2,4-decadienoic acid, 2,4-dodecadienoic acid, 9.12-hexadecadienoic acid, 9.12-octadecadienoic acid, hexadecatrienoic acid, linoleic acid, lylunic acid, octadecadienoic acid Trienoic acid, icosadienoic acid, icosatrienoic acid, icosatetraenoic acid, ricinoleic acid, eleostearic acid, oleic acid, icosapentaenoic acid, erucic acid, docosadienoic acid, docosatrienoic acid, docosatetraenoic acid, docosapentaenoic acid , unsaturated carboxylic acids such as tetraenoic acid, hexacosenoic acid, hexacosenoic acid, octadecenoic acid, and tra-aconthenic acid, or esters, acid amides, and anhydrides of these unsaturated carboxylic acids, or low polymers such as butadiene and isoprene (e.g., average molecular weight 500 to 1oooo) or high molecular weight substances (for example, those with an average molecular weight of ioooo or more)
Examples include those in which maleic anhydride is added to , or those in which carboxylic acid groups, epoxy groups, etc. are introduced.
成分（Ｃ）化合物は、上記した不飽和結合（１）を２つ
以上、及び／又は上記した官能基（２）を２つ以上台ｌ
υだものであってもよい。二種類以上の成分（Ｃ）化合
物を用いることもできる。The component (C) compound has two or more unsaturated bonds (1) described above and/or two or more functional groups (2) described above.
It may be something that is υ. Two or more types of component (C) compounds can also be used.
本発明において、ポリアミドの末端アミノ基対末端カル
ボキシル阜のモル比（以下、末端基比という）が１より
大きいこと、及び成分（Ｃ）を加えることが重要な特徴
である。これによって、意外にも、表面外観の優れた成
形品を与える樹脂組成物が得られまた機械的強度が著し
く改善される。In the present invention, important features are that the molar ratio of terminal amino groups to terminal carboxyl groups (hereinafter referred to as terminal group ratio) of the polyamide is greater than 1 and that component (C) is added. As a result, surprisingly, a resin composition is obtained which gives a molded article with an excellent surface appearance, and the mechanical strength is significantly improved.
通常用いられるポリアミド樹脂は末端基比が１ないしは
それ以下である。また、射出成形用のポリアミドにおい
て、溶融粘度を適痕に調節するために重合成分に末端封
止剤を加えることが行われているが、そのようなポリア
ミドの末端基比は１より小さい。本発明に従い末端基比
が１より大きいポリアミドを用いると、末端基比が１以
下のポリアミドを用いた場合に比べて成形品の外観及び
機械的強度が飛躍的に良くなる。このことは、全く予想
されなかったことであり、決定的な理論的理由付けは今
のところないが、成形品の電子顕微鏡写真によるとポリ
アミド母相中に分散したポリフェニレンオキサイド系樹
脂の粒子の粒径が小さく、かつ均一である。ポリアミド
の末端基比の違いによってこのような顕著な違いが起る
ことは驚きである。末端基比は、好ましくは１．１以上
、より好ましくは１．３以上である。本発明において成
分（Ｃ）を加えないと、上記改善が達成されない。Generally used polyamide resins have a terminal group ratio of 1 or less. Furthermore, in polyamides for injection molding, a terminal capping agent is added to the polymerization component in order to adjust the melt viscosity to an appropriate level, but the terminal group ratio of such polyamides is less than 1. When a polyamide with an end group ratio of more than 1 is used according to the present invention, the appearance and mechanical strength of the molded article are dramatically improved compared to when a polyamide with an end group ratio of 1 or less is used. This was completely unexpected, and there is currently no definitive theoretical reason for this, but electron micrographs of the molded product show that the particles of polyphenylene oxide resin dispersed in the polyamide matrix. The diameter is small and uniform. It is surprising that such a significant difference occurs due to the difference in the end group ratio of polyamide. The terminal group ratio is preferably 1.1 or more, more preferably 1.3 or more. In the present invention, the above improvement cannot be achieved unless component (C) is added.
上記した各成分（＾）〜（Ｃ）は、任意の順に慣用の方
法で配合し、加熱溶融して射出成形することができる。The above-mentioned components (^) to (C) can be blended in any order by a conventional method, heated and melted, and then injection molded.
なお、本発明の組成物に、更に慣用の添加物たとえばゴ
ム様物質、充填剤、難燃剤、可塑剤などを加えることも
できる。加工性を改良するためのスチレン系重合体を添
加することも可能である。Furthermore, conventional additives such as rubber-like substances, fillers, flame retardants, plasticizers, etc. can also be added to the compositions of the present invention. It is also possible to add styrenic polymers to improve processability.
以下、本発明を実施例により説明する。The present invention will be explained below with reference to Examples.
実施例
実施例において、成分（Ａ）としてポリ（２，６−ジメ
チル−１，４−フエニレン）エーテルを用いた。成分（
Ｂ）ポリアミドとしては、二種類のナイロン−６を用意
した。第一のポリアミドは、８．４Ｘ １０−５モル／
ｇの末端アミノ基、１．８Ｘ１０−”モル／ｇの末端カ
ルボキシル基を持つ。第二のポリアミドは、４．６Ｘ
１０−５モル／９の末端アミノ基、７、ＯＸ １０’モ
ル／ｇの末端カルボキシル基を持つ。Examples In the examples, poly(2,6-dimethyl-1,4-phenylene) ether was used as component (A). component(
B) Two types of nylon-6 were prepared as polyamides. The first polyamide is 8.4X 10-5 mol/
The second polyamide has 4.6X terminal amino groups and 1.8
It has a terminal amino group of 10-5 mol/9 and a terminal carboxyl group of 7,OX 10' mol/g.
分子量は共に１３．０００である。この二種類のポリア
ミドを適宜配合することによって、意図する末端基比を
持つポリアミドを得た。なお、このように二種のポリア
ミドの配合によらずに、重合時に末端基比を調節した物
を用いても成形品において同じ結果が得られた。成分（
Ｃ）としては無水マレイン酸を用いた。Both molecular weights are 13.000. By appropriately blending these two types of polyamides, a polyamide having the intended end group ratio was obtained. In addition, the same results were obtained in the molded product even when the end group ratio was adjusted during polymerization instead of blending the two types of polyamides. component(
Maleic anhydride was used as C).
上記各成分を配合した配合物を減圧ベント付き二軸押出
機で２９０℃の温度で押出してペレットを先ず作った。First, pellets were made by extruding a blend of the above-mentioned components at a temperature of 290° C. using a twin-screw extruder equipped with a vacuum vent.
このベレットを、シリンダ一温度２８０℃、射出圧力１
、２０ＯＮｇ／ ｃ＃ｉＮ金型温度８０℃に設定した
射出成形機により成形品を作った。This pellet was heated at a cylinder temperature of 280°C and an injection pressure of 1
, 20ONg/c#iN A molded article was made using an injection molding machine set at a mold temperature of 80°C.
成形品の評価として、ＪＩＳに７１１０に準拠するアイ
ゾツトインパクトテストを行った。成形品の外観は肉眼
で観察した。また、成形品においてポリアミド母相中に
分散するポリフェニレンエーテル樹脂の状態を知るため
に、走査型電子顕微鏡（ＳＥＭ）を用いた。上記アイゾ
ツト試験片より小片を切出し、ミクロトームにより面出
し処理したのち、超音波をかけながらメチレンクロライ
ドで２分間ソルベントエツチングし、金］−ティングし
た後、ＳＥＭにて観察した。As an evaluation of the molded product, an isot impact test based on JIS 7110 was conducted. The appearance of the molded product was observed with the naked eye. In addition, a scanning electron microscope (SEM) was used to determine the state of the polyphenylene ether resin dispersed in the polyamide matrix in the molded product. A small piece was cut out from the above-mentioned Izot test piece, surface-leveled using a microtome, solvent-etched with methylene chloride for 2 minutes while applying ultrasound, gold-etched, and observed using an SEM.
ポリアミドの末端基を種々変えた例、また成分−１２＝ （Ｃ）を含まない例の結果を゛ト記表１に丞す。Examples of various terminal groups of polyamide, and component -12= The results of examples that do not include (C) are shown in Table 1.
比較例１ （ＮＨ２／Ｃｏｏｌ−１＝ ０．６６）、比
較例２（同０．９２）、実施例２（同１．５５）及び実
施例４（同４．７７）で得た成形品の電子顕微鏡写真を
参考写真１〜４として添付する。ポリフェニレンオキザ
イドの粒子の粒径及び粒径分布の違いが明瞭に判る。The molded products obtained in Comparative Example 1 (NH2/Cool-1 = 0.66), Comparative Example 2 (NH2/Cool-1 = 0.92), Example 2 (NH2/Cool-1 = 1.55), and Example 4 (NH2/Cool-1 = 4.77) Electron micrographs are attached as reference photos 1 to 4. Differences in particle size and particle size distribution of polyphenylene oxide particles can be clearly seen.
出 願 人applicant
Claims (1)
量部 （Ｂ）末端アミノ基量が末端カルボキシル基量より多い
ポリアミド樹脂９５〜２０重量部 （Ｃ）上記成分（Ａ）及び（Ｂ）の合計１００重量部に
対して０．０１〜１０重量部の、分子内に（１）炭素−
炭素二重結合又は炭素−炭素三重結 合を有しかつ（２）カルボキシル基、酸無水物基、酸ア
ミド基、イミド基、カルボン酸 エステル基、又はエポキシ基を有する化合 物 を含む樹脂組成物。 ２、成分（Ｂ）の末端アミノ基対末端カルボキシル基の
比が１．０１以上である特許請求の範囲第１項記載の樹
脂組成物。 ３、成分（Ｂ）の末端アミノ基対末端カルボキシル基の
比が１．１以上である特許請求の範囲第２項記載の樹脂
組成物。[Claims] 1. (A) 5 to 80 parts by weight of a polyphenylene oxide resin (B) 95 to 20 parts by weight of a polyamide resin in which the amount of terminal amino groups is greater than the amount of terminal carboxyl groups (C) The above components (A) and 0.01 to 10 parts by weight of (1) carbon-
A resin composition containing a compound having a carbon double bond or a carbon-carbon triple bond and (2) a carboxyl group, an acid anhydride group, an acid amide group, an imide group, a carboxylic acid ester group, or an epoxy group. 2. The resin composition according to claim 1, wherein the ratio of terminal amino groups to terminal carboxyl groups in component (B) is 1.01 or more. 3. The resin composition according to claim 2, wherein the ratio of terminal amino groups to terminal carboxyl groups in component (B) is 1.1 or more.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61091371A JPH0692536B2 (en) | 1986-04-22 | 1986-04-22 | Resin composition |
| EP19870902228 EP0260314B1 (en) | 1986-03-07 | 1987-03-06 | Polyphenylene ether/polyamide blends having improved physical properties |
| PCT/US1987/000498 WO1987005304A1 (en) | 1986-03-07 | 1987-03-06 | Polyphenylene ether/polyamide blends having improved physical properties |
| DE87902228T DE3787240T2 (en) | 1986-03-07 | 1987-03-06 | POLYPHENYLENE ETHER / POLYAMIDE MIXTURES WITH IMPROVED PHYSICAL PROPERTIES. |
| US07/022,836 US4873276A (en) | 1986-03-07 | 1987-03-06 | Polyphenylene ether/polyamide blends having mproved physical properties |
| US08/273,347 USRE35509E (en) | 1986-03-07 | 1994-07-15 | Polyphenylene ether/polyamide blends having improved physical properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61091371A JPH0692536B2 (en) | 1986-04-22 | 1986-04-22 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62250050A true JPS62250050A (en) | 1987-10-30 |
| JPH0692536B2 JPH0692536B2 (en) | 1994-11-16 |
Family
ID=14024517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61091371A Expired - Lifetime JPH0692536B2 (en) | 1986-03-07 | 1986-04-22 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0692536B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63162757A (en) * | 1986-12-26 | 1988-07-06 | Ube Ind Ltd | Resin composition |
| JPS63225655A (en) * | 1986-10-31 | 1988-09-20 | Sumitomo Chem Co Ltd | Thermoplastic polymer composition |
| JPH02127464A (en) * | 1988-11-08 | 1990-05-16 | Eng Plast Kk | Polyphenylene sulfide resin composition having improved physical property |
| JPH02284955A (en) * | 1989-04-26 | 1990-11-22 | Nippon G Ii Plast Kk | Polyphenylene ether-based resin composition |
| US5164440A (en) * | 1988-07-20 | 1992-11-17 | Ube Industries, Ltd. | High rigidity and impact resistance resin composition |
| US5175211A (en) * | 1988-04-14 | 1992-12-29 | Sumitomo Chemical Co., Ltd. | Thermoplastic resin composition |
| US5248720A (en) * | 1988-09-06 | 1993-09-28 | Ube Industries, Ltd. | Process for preparing a polyamide composite material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626913A (en) * | 1979-08-08 | 1981-03-16 | Sumitomo Chem Co Ltd | Resin composition |
| JPS5918756A (en) * | 1982-07-21 | 1984-01-31 | Ube Ind Ltd | Polyamide composition |
-
1986
- 1986-04-22 JP JP61091371A patent/JPH0692536B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626913A (en) * | 1979-08-08 | 1981-03-16 | Sumitomo Chem Co Ltd | Resin composition |
| JPS5918756A (en) * | 1982-07-21 | 1984-01-31 | Ube Ind Ltd | Polyamide composition |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63225655A (en) * | 1986-10-31 | 1988-09-20 | Sumitomo Chem Co Ltd | Thermoplastic polymer composition |
| JPS63162757A (en) * | 1986-12-26 | 1988-07-06 | Ube Ind Ltd | Resin composition |
| US5175211A (en) * | 1988-04-14 | 1992-12-29 | Sumitomo Chemical Co., Ltd. | Thermoplastic resin composition |
| US5164440A (en) * | 1988-07-20 | 1992-11-17 | Ube Industries, Ltd. | High rigidity and impact resistance resin composition |
| US5248720A (en) * | 1988-09-06 | 1993-09-28 | Ube Industries, Ltd. | Process for preparing a polyamide composite material |
| JPH02127464A (en) * | 1988-11-08 | 1990-05-16 | Eng Plast Kk | Polyphenylene sulfide resin composition having improved physical property |
| JPH02284955A (en) * | 1989-04-26 | 1990-11-22 | Nippon G Ii Plast Kk | Polyphenylene ether-based resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0692536B2 (en) | 1994-11-16 |
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