JPS62227616A - Detecting of in-mold resin pressure in injection molding - Google Patents
Detecting of in-mold resin pressure in injection moldingInfo
- Publication number
- JPS62227616A JPS62227616A JP7029386A JP7029386A JPS62227616A JP S62227616 A JPS62227616 A JP S62227616A JP 7029386 A JP7029386 A JP 7029386A JP 7029386 A JP7029386 A JP 7029386A JP S62227616 A JPS62227616 A JP S62227616A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin pressure
- cavity
- dummy
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 57
- 229920005989 resin Polymers 0.000 title claims abstract description 57
- 238000001746 injection moulding Methods 0.000 title claims description 4
- 238000000465 moulding Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 abstract description 7
- 239000007924 injection Substances 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 description 15
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、射出成形品の品質に係わる金型内（成形キャ
ビティ内）の樹脂圧力を検出する方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for detecting resin pressure within a mold (inside a molding cavity), which is related to the quality of an injection molded product.
（従来の技術）
従来、射出成形機の金型内樹脂圧力制御では、金型の成
形キャビティ内又は樹脂通路内の樹脂圧力或は可塑化シ
リンダ内のスクリュを前進さ信号を、射出駆動装置を制
御する制御装置にフィードバックして成形キャビティ内
に所定の樹脂圧力が得られるよう閉ループ制御していた
（特開昭５０−３４３４９号公報、特公昭５８−５２４
８６号公報参照）。(Prior art) Conventionally, in order to control the resin pressure in the mold of an injection molding machine, the injection drive device is controlled by a signal that advances the resin pressure in the molding cavity or resin passage of the mold or the screw in the plasticizing cylinder. Closed-loop control was performed to obtain a predetermined resin pressure in the molding cavity by feeding back to the controlling control device (Japanese Patent Laid-Open No. 50-34349, Japanese Patent Publication No. 58-524)
(See Publication No. 86).
（発明が解決しようとする問題点）
しかし、制御のフィードバック信号源として成形キャビ
ティ以外の場所での圧力を用いる方法では、成形キャビ
ティ内樹脂圧力との関係を推定した間接的な制御となり
、成形機外部の外乱を排除することができず、精度良く
制御できない。金型の樹脂通路に樹脂圧力検出器を設置
する場合、設置位置の選定が難しい。(Problem to be solved by the invention) However, in the method of using pressure at a location other than the molding cavity as a control feedback signal source, the control becomes indirect by estimating the relationship with the resin pressure inside the molding cavity, and the molding machine External disturbances cannot be excluded and control cannot be performed accurately. When installing a resin pressure detector in the resin passage of a mold, it is difficult to select the installation location.
更に、金型の成形キャビティ内樹脂圧力を検出して制御
のフィードバック信号とする方法では、制御に最適な樹
脂圧力を実際値として得て成形キャビティ内の樹脂の状
態変化を直接制御できる反面、エジェクタピン兼用の圧
力検出ピンの後退変位から圧力検出器により成形キャビ
ティ内の樹脂圧力を検出するから、圧力検出器を設置し
た成形キャビティで成形される成形品はピン孔に対応し
た突起を有するものとなり、精密製品では不良品が生じ
ると共に、成形品によっては圧力検出器を設置するのが
難しい等の不都合があった。Furthermore, with the method of detecting the resin pressure in the molding cavity of the mold and using it as a feedback signal for control, it is possible to obtain the optimal resin pressure for control as an actual value and directly control the state change of the resin in the molding cavity. Since the pressure detector detects the resin pressure in the molding cavity from the backward displacement of the pressure detection pin that also serves as a pin, the molded product molded in the molding cavity where the pressure detector is installed will have a protrusion that corresponds to the pin hole. However, precision products may be defective, and some molded products may have problems such as difficulty in installing pressure detectors.
本発明は、前記従来の問題点を解決するためになしたも
ので、金型の成形キャビティ以外の場所で実質的に成形
キャビティ内の樹脂圧力を検出できるようにすることを
目的とする。The present invention was made in order to solve the above-mentioned conventional problems, and an object of the present invention is to make it possible to substantially detect the resin pressure inside the molding cavity at a location other than the molding cavity of the mold.
（問題点を解決するための手段）
本発明に係る射出成形における金型内樹脂圧力の検出方
法は、成形キアビテイ及び該成形キャビティと同様に溶
融樹脂を射出充填可能なダミーキャビティを並設し、該
ダミーキャビティに樹脂圧力検出器を設置した金型を使
用し、射出充填工程或は保圧工程中に樹脂圧力検出器に
より成形キャビティに並設したダミーキャビティ内の樹
脂圧力を検出することを特徴とするものである。(Means for Solving the Problems) A method for detecting resin pressure in a mold in injection molding according to the present invention includes a molding cavity and a dummy cavity that can be injected and filled with molten resin in the same way as the molding cavity. A mold in which a resin pressure detector is installed in the dummy cavity is used, and the resin pressure in the dummy cavity arranged in parallel with the molding cavity is detected by the resin pressure detector during the injection filling process or the pressure holding process. That is.
（実施例） まず、本発明実施用装置の一例を図面に沿い説明する。(Example) First, an example of an apparatus for implementing the present invention will be explained with reference to the drawings.
図中１は固定側金型で、固定プラテン２上に装着されて
おり、該金型１には、スプルー６及びこのスプルー３に
ランナー４とエツジゲート５を介して連通ずる複数個の
成形凹部６を１個のダミー成形凹部７が設けられている
。In the figure, reference numeral 1 denotes a fixed mold, which is mounted on a fixed platen 2. The mold 1 includes a sprue 6 and a plurality of molding recesses 6 that communicate with the sprue 3 via a runner 4 and an edge gate 5. One dummy molded recess 7 is provided.
ダミー成形凹部７は、キャビティ内の樹脂圧力を検出す
るために充分な一定以上の深さく後述するダミーキャビ
ティ１７の肉厚）で形成されている。The dummy molding recess 7 is formed to have a depth greater than a certain level (the thickness of a dummy cavity 17, which will be described later), which is sufficient to detect the resin pressure within the cavity.
８は可動側金型で、可動プラテン９上に装着されて、図
示しない型締装置により固定側金型１に対して前後進可
能に対向配置されており、該金型８のスプルー延長線上
にはコールドスラグウェル１０が設けられている。Reference numeral 8 denotes a movable side mold, which is mounted on a movable platen 9 and is disposed opposite to the stationary side mold 1 so as to be movable back and forth by a mold clamping device (not shown). A cold slug well 10 is provided.
１１はエジェクタピンで、該ピンの一端側を可動側金型
８の、各成形凹部６及びコールドスラグウェル１０に対
応した位置に前後動可能に嵌入され、かつ、他端をエジ
ェクタプレート１２で連結されている。Reference numeral 11 denotes an ejector pin, one end of which is fitted into the movable mold 8 at a position corresponding to each molding recess 6 and the cold slug well 10 so as to be movable back and forth, and the other end is connected by an ejector plate 12. has been done.
１３は圧力検出ピンで、該ピンの一端側をエジェクタピ
ン１１と同様に可動側金型８の、ダミー成形凹部７に対
応した位置に前後動可能に嵌入され、かつ、他端をエジ
ェクタプレート１２に後退可能に嵌入されている。13 is a pressure detection pin, one end of which is fitted in the movable mold 8 at a position corresponding to the dummy molding recess 7 in the same way as the ejector pin 11 so as to be movable back and forth, and the other end is fitted into the ejector plate 12. It is inset so that it can be retracted.
１４は樹脂圧力検出器（直接検出型、間接検出型等の型
式を問わない。）で、エジェクタプレート１２の圧力検
出ピン後退側に内蔵されており、圧力検出ピン１３の後
端変位からピン先端に作用した圧力を検出可能となって
いる。この検出器１４は、図示しない射出駆動装置を制
御する制御装置１５に接続されている。Reference numeral 14 denotes a resin pressure detector (regardless of type, such as direct detection type or indirect detection type), which is built into the ejector plate 12 on the backward side of the pressure detection pin. It is possible to detect the pressure acting on the This detector 14 is connected to a control device 15 that controls an injection drive device (not shown).
圧力検出ピン１３は、樹脂圧力検出器１４に内蔵された
バネ等によりエジェクタプレート１２内のピン前進端位
置に押付は保持されて、エジェクタピン１１と同様、ピ
ン先端を可動側金型８の成形面と面一の位置に配置され
ている。The pressure detection pin 13 is held pressed at the pin forward end position in the ejector plate 12 by a spring or the like built into the resin pressure detector 14, and similarly to the ejector pin 11, the pin tip is molded into the movable mold 8. It is placed flush with the surface.
１６は成形キャビティ、１７はダミーキャビティで、型
締装置の型締め作動により固定側及び可動側金型１，８
により形成され、可塑化シリンダ１８から射出された溶
融樹脂を樹脂通路３゜１０．４．５ を経て充填可能
となっている。16 is a molding cavity, 17 is a dummy cavity, and the fixed side and movable side molds 1 and 8 are closed by the mold clamping operation of the mold clamping device.
The molten resin injected from the plasticizing cylinder 18 can be filled through the resin passage 3°10.4.5.
１９はエジェクタシリンダ、２ｏはエジェクタロッドで
ある。19 is an ejector cylinder, and 2o is an ejector rod.
なお、ダミーキャビティ１７内の樹脂圧力を検出するの
に圧力検出ピン１３を使用した例につき説明したが、該
ピン１３を使用せず、樹脂圧２カ検出器１４を直接ダミ
ーキャビティ１７に設けても同効である。Although the example in which the pressure detection pin 13 is used to detect the resin pressure inside the dummy cavity 17 has been described, it is also possible to provide the resin pressure detector 14 directly in the dummy cavity 17 without using the pin 13. has the same effect.
次に本発明を上記装置を使用して実施する場合を説明す
る。Next, a case will be described in which the present invention is implemented using the above device.
可塑化シリンダ１８から射出された溶融樹脂力ｆ樹脂通
路３，１０，４．５を経て成形キャビティ１６及びダミ
ーキャビティ１７に充填されると、ダミーキャビティ１
７内の樹脂圧力は、圧力検出ピン１３を介して樹脂圧力
検出器１４により検出される。この検出信号は成形キャ
ビティ１６とダミーキャビティ１７とが等しい場合制御
装置１５に実際値信号としてそのままフィードバツクさ
れ、成形キャビティ１６が極薄或は極小等のために圧力
検出に不適な場合、ダミーキャビティ１７を圧力検出に
充分な厚さ或は大きさとし、検出信号を予め測定した換
算値によって修正してフィードバックされる。When the molten resin force f injected from the plasticizing cylinder 18 is filled into the molding cavity 16 and the dummy cavity 17 through the resin passages 3, 10, 4.5, the dummy cavity 1
The resin pressure within 7 is detected by a resin pressure detector 14 via a pressure detection pin 13. This detection signal is directly fed back to the control device 15 as an actual value signal when the molding cavity 16 and the dummy cavity 17 are equal, and when the molding cavity 16 is not suitable for pressure detection because it is extremely thin or extremely small, the dummy cavity 17 has a thickness or size sufficient for pressure detection, and the detection signal is corrected by a converted value measured in advance and fed back.
制御装置１５は、樹脂圧力検出器１４から入力するダミ
ーキャビティ１７内の樹脂圧力と設定値との偏差が許容
範囲内に収まるよう射出駆動装置を閉ループ制御するか
ら、成形キャビティ１６内を所定の樹脂圧力に制御でき
る。The control device 15 controls the injection drive device in a closed loop so that the deviation between the resin pressure in the dummy cavity 17 inputted from the resin pressure detector 14 and the set value falls within an allowable range, so that the inside of the molding cavity 16 is controlled to a predetermined resin level. Can be controlled by pressure.
なお、ダミーキャビティ１７は、成形キャビティ１６と
同様に制限ゲート５によりランナ４を介してスプルー３
と連通しているから、ダミーキャビティ１７内の樹脂圧
力は、成形キャビティ１６内と略同−条件のものとなる
。Note that, similarly to the molding cavity 16, the dummy cavity 17 is connected to the sprue 3 through the runner 4 by the restriction gate 5.
Since the resin pressure inside the dummy cavity 17 is in communication with the inside of the molding cavity 16, the resin pressure is under substantially the same conditions as inside the molding cavity 16.
また、薄肉製品や小物製品などの場合、成形キャビティ
１６内の樹脂圧力は急激に変化し、制御が難しいが、ダ
ミーキャビティ１７に一定一 以上の肉厚と大きさを有
しているため、該ダミーキャビティ１７により樹脂圧力
の変動が緩和され、緩かに変化するから、成形キャビテ
ィ１６内の樹脂圧力を制御装置１５に設定した最適樹脂
圧力に制御することができる。Furthermore, in the case of thin-walled products or small products, the resin pressure inside the molding cavity 16 changes rapidly and is difficult to control. Since the dummy cavity 17 alleviates fluctuations in the resin pressure and changes gently, the resin pressure in the molding cavity 16 can be controlled to the optimum resin pressure set in the control device 15.
（発明の効果）
以上の通り本発明は、ダミーキャビティ及び該ダミーキ
ャビティ内の樹脂圧力を検出する検出器を使用して、成
形キャビティ内の樹脂圧力を間接的ではあるが検出でき
るから、射出充填工程或は保圧工程中の成形キャビティ
内樹脂圧力制御又は射出充填工程から保圧工程への切換
え制御の精度を向上させ、成形品品質のバラツキを少く
できると共に、薄肉製品や小物製品などの場合でもダミ
ーキャビティにより樹脂圧力の変動を緩和して制御用樹
脂圧力の設定を容易にし、かつ、制御性能としての追随
性を向上させ得る。また、ダミーキャビティを使用した
から、精密製品の場合でも従来のように不良品を出さず
に済むと共に、製品の形状及びゲート形状に関わらず圧
力検出に適した一定形状の樹脂圧力検出用ブロックの採
用を可能にできる。さらに、成形中での樹脂圧力の変化
を検出して成形品の良否判別をも行なえる。(Effects of the Invention) As described above, the present invention uses a dummy cavity and a detector that detects the resin pressure in the dummy cavity to indirectly detect the resin pressure in the molding cavity. It improves the accuracy of controlling the resin pressure inside the molding cavity during the process or pressure holding process or switching control from the injection filling process to the pressure holding process, reducing variations in molded product quality, and in the case of thin-walled products and small products. However, the dummy cavity can ease fluctuations in resin pressure, facilitate setting of control resin pressure, and improve followability as control performance. In addition, because a dummy cavity is used, even in the case of precision products, there is no need to produce defective products like in the past, and the resin pressure detection block has a constant shape suitable for pressure detection regardless of the product shape or gate shape. Enables recruitment. Furthermore, it is also possible to determine the quality of the molded product by detecting changes in resin pressure during molding.
第１図は本発明実施用装置の一例を示す概要図、第２図
は同装置の固定側金型を示す■矢視図である。
１・・固定側金型、３・・スプルー、４・・ランナー、
５・・エツジゲート、６・・成形凹部、７・・ダミー成
形凹部、８・・可動側金型、１０・・コールドスラグウ
ェル、１２．・エジェクタプレート、１３・・圧力検出
ピン、１４・・樹脂圧力検出器、１５・・制御装置、１
６・°成形キャビティ、１７・・ダミーキャビティ。FIG. 1 is a schematic view showing an example of an apparatus for carrying out the present invention, and FIG. 2 is a view taken in the direction of arrow 2 showing a stationary mold of the same apparatus. 1. Fixed side mold, 3. Sprue, 4. Runner,
5. Edge gate, 6. Molding recess, 7. Dummy molding recess, 8. Movable mold, 10. Cold slug well, 12. - Ejector plate, 13... Pressure detection pin, 14... Resin pressure detector, 15... Control device, 1
6.° molding cavity, 17.. dummy cavity.
Claims (1)
を射出充填可能なダミーキャビティを並設し、該ダミー
キャビティに樹脂圧力検出器を設置した金型を使用し、
前記樹脂圧力検出器により成形キャビティに並設したダ
ミーキャビティ内の樹脂圧力を検出することを特徴とす
る射出成形における金型内樹脂圧力の検出方法。Using a mold in which a molding cavity and a dummy cavity which can be injected and filled with molten resin in the same way as the molding cavity are arranged side by side, and a resin pressure detector is installed in the dummy cavity,
A method for detecting resin pressure in a mold in injection molding, characterized in that the resin pressure detector detects resin pressure in a dummy cavity arranged in parallel with a molding cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7029386A JPS62227616A (en) | 1986-03-28 | 1986-03-28 | Detecting of in-mold resin pressure in injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7029386A JPS62227616A (en) | 1986-03-28 | 1986-03-28 | Detecting of in-mold resin pressure in injection molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62227616A true JPS62227616A (en) | 1987-10-06 |
| JPH0587370B2 JPH0587370B2 (en) | 1993-12-16 |
Family
ID=13427278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7029386A Granted JPS62227616A (en) | 1986-03-28 | 1986-03-28 | Detecting of in-mold resin pressure in injection molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62227616A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163946A (en) * | 1988-12-16 | 1990-06-25 | Matsushita Electric Ind Co Ltd | Molding press of semiconductor chip |
| JPH07137107A (en) * | 1994-04-20 | 1995-05-30 | Fanuc Ltd | Injection molding method |
| EP0714344A1 (en) * | 1994-05-31 | 1996-06-05 | Rjg Technologies, Inc. | Apparatus for sensing pressure in mold cavity during injection of molded parts |
| JP2004322180A (en) * | 2003-04-25 | 2004-11-18 | Union Seimitsu Kk | Hermetically sealed type release agent coating system of thixomold or die casting mold |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61164812A (en) * | 1985-01-17 | 1986-07-25 | Nissei Plastics Ind Co | Method for measuring cavity internal pressure of injection molding machine and apparatus therefor |
-
1986
- 1986-03-28 JP JP7029386A patent/JPS62227616A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61164812A (en) * | 1985-01-17 | 1986-07-25 | Nissei Plastics Ind Co | Method for measuring cavity internal pressure of injection molding machine and apparatus therefor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02163946A (en) * | 1988-12-16 | 1990-06-25 | Matsushita Electric Ind Co Ltd | Molding press of semiconductor chip |
| JPH07137107A (en) * | 1994-04-20 | 1995-05-30 | Fanuc Ltd | Injection molding method |
| EP0714344A1 (en) * | 1994-05-31 | 1996-06-05 | Rjg Technologies, Inc. | Apparatus for sensing pressure in mold cavity during injection of molded parts |
| EP0714344A4 (en) * | 1994-05-31 | 1997-11-05 | Rjg Technologies Inc | Apparatus for sensing pressure in mold cavity during injection of molded parts |
| JP2004322180A (en) * | 2003-04-25 | 2004-11-18 | Union Seimitsu Kk | Hermetically sealed type release agent coating system of thixomold or die casting mold |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0587370B2 (en) | 1993-12-16 |
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