JPS6222498A - Electronic component mounting apparatus - Google Patents
Electronic component mounting apparatusInfo
- Publication number
- JPS6222498A JPS6222498A JP60162344A JP16234485A JPS6222498A JP S6222498 A JPS6222498 A JP S6222498A JP 60162344 A JP60162344 A JP 60162344A JP 16234485 A JP16234485 A JP 16234485A JP S6222498 A JPS6222498 A JP S6222498A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- supply section
- mounting
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、所望の電子部品をプリント基板上の所定の
位置へ装着する電子部品装着装置に係り、特に電子部品
の識別することを目的としている。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an electronic component mounting device that mounts a desired electronic component to a predetermined position on a printed circuit board, and is particularly designed for the purpose of identifying electronic components. There is.
第８図及び第４図において、（１）は電子部品、（２）
は電子部品（１）を複数個収納した部品供給部で、駆動
部（６）上にｌま１こは複数個配設されている、（３）
は部品供給部（２）内の電子部品（１）を取り出し、プ
リント基板（４）上に装着する装着へ・ラドで、中央１
コｉ状に形成されｆコル孔（６）より不図示の装置で真
空吸引することにより電子部品（１）を吸着把持するも
のである、（５）はプリント基板（４）を装着へ・・・
ド（３）と所定の位置関係を保つように、位置決めする
駆動部である。（９）は制御装置で前記、装着へ・ラド
（３）部１部品供給部（２）の駆動部（６）および、プ
リント基板（４）の駆動部（５）を制御する、
次に動作について説明する８部品供給部（２）内に複数
個収納されｒコミ子部品（１）は装着へラド（３）によ
って供給が行なわれる。装着へ・・・ド（３）は筒状で
中央に縦貫する小孔αυを有しており、不図示の真空発
生装置によって、小孔αυ円を真空状態化して装着ヘッ
ド（３）の先端（２）で電子部品（１）を真空吸着する
１、さて、装着ヘッド（３）は部品供給部（２）円の電
子部品（１）を取り出しのｒこめに、矢印（至）の経路
で電子部品（１）取出し位置α４上に位置し１こ後、矢
印（至）方向に下降して装着へ・Ｉド（３）先端＠部を
電子部品（１）と当接させて真空吸着する。その後不因
示の駆動装置により、再び矢印側の経路を経てプリント
基板（４）上に移動し矢印００方向に下降しプリント基
板（４）に電子部品（１）を押圧させて、プリント基板
（４）上に、予め配され１こ接着剤によって仮固定させ
る。この後、装着ヘッド（３）は矢印αＧ方向と逆方向
すなわち上昇し１こ後、上記動作をくり返し、願次電子
部品（１）をプリント基板（４）上に装着する。In Figures 8 and 4, (1) is an electronic component, (2)
(3) is a component supply section that stores a plurality of electronic components (1), and a plurality of electronic components (1) are arranged on the drive section (6);
Take out the electronic component (1) from the component supply section (2) and mount it on the printed circuit board (4).
It is formed in a coil shape and holds the electronic component (1) by suction by vacuum suction from the f-coll hole (6) with a device not shown.(5) is for mounting the printed circuit board (4).・
This is a drive unit that positions the drive unit so as to maintain a predetermined positional relationship with the door (3). (9) is a control device that controls the drive section (6) of the mounting/rad (3) section 1 component supply section (2) and the drive section (5) of the printed circuit board (4); A plurality of 8-component parts (1) are stored in the 8-component supply section (2) and are supplied to the mounting plate (3). To mounting... The head (3) is cylindrical and has a small hole αυ running vertically through the center.The small hole αυ is evacuated by a vacuum generator (not shown) to the tip of the mounting head (3). At step (2), the electronic component (1) is vacuum-suctioned. 1. Now, the mounting head (3) takes out the electronic component (1) from the component supply section (2) and follows the path shown by the arrow (to). Electronic component (1) is located above the extraction position α4, and after 1 step, descends in the direction of the arrow (to) to be installed. ・Place the tip of I (3) in contact with the electronic component (1) and vacuum suction. . Thereafter, an unspecified drive device moves the electronic component (1) onto the printed circuit board (4) again via the path indicated by the arrow, descends in the direction of arrow 00, presses the electronic component (1) against the printed circuit board (4), and presses the electronic component (1) onto the printed circuit board (4). 4) A piece of adhesive is placed on top and temporarily fixed. Thereafter, the mounting head (3) moves in the opposite direction to the arrow αG direction, that is, rises, and after one step, the above operation is repeated to mount the electronic component (1) on the printed circuit board (4).
一方、部品供給部（２）は駆動部（６）上に１個まＴコ
は複数個所定の間隔で載置されており、駆動部（６）ζ
こよって電子部品（１）を取り出し位置ａ４に所望の部
品供給部（２）が位置するように位置決めされる、さち
１こ、プリント基板（４）は駆動部（５）によって装着
へウド（３）の部品装着位置ζこ制御装置（９）によっ
て位置決めされて、予め設定され１こ順序Ｇこ従いプリ
ント基板（４）上に装着を完了されることとなる、〔発
明が解決しようとする問題点〕
従来の電子部品装着装置はぶよのように構成されている
ので、部品取り出し位置α→に位置決めされ１こ部品供
給部（２）に、所望の電子部品（１）が配置されている
かどうかの判別ができず、結実装着へ、・。On the other hand, one component supply section (2) or a plurality of components are placed on the drive section (6) at predetermined intervals, and the drive section (6) ζ
Thus, the electronic component (1) is positioned so that the desired component supply section (2) is located at the take-out position a4. ) is positioned by the control device (9), and the mounting is completed on the printed circuit board (4) according to a preset order G. [Problem to be Solved by the Invention] [Point] Since the conventional electronic component mounting device is configured like a gnat, it is difficult to determine whether the desired electronic component (1) is positioned at the component take-out position α→ and placed in the component supply section (2). Unable to determine, I decided to attach the binding.
ド（３）がプリント基板（４）上ζこ電子部品（１）を
誤装着する危惧があつ１こ。さｒ・に装着完了後の検査
工程で誤装置が判明して、生産効率の低下４・余儀なく
するなどの問題があっ１こ。There is a risk that the board (3) may incorrectly mount the electronic component (1) on the printed circuit board (4). There are problems such as incorrect equipment being discovered during the inspection process after the installation is completed, resulting in a decline in production efficiency.
この発明は上記欠点を解決するために成され１こもので
、装着へＮＪドで取出す電子部品が所望のものか否かの
自動判別用能な電子部品装着装置を得ることを目的とし
ている、
〔問題点を解決するｒこめの手段〕
この発明に係る電子部品装着装置は、電子部品対応の部
品種類、！気的特性値等の情報を表わす読み取り用手段
を部品供給部に設けて、電子部品の情報を判別できるよ
うにし１こものである、〔作用〕
この発明においては、部品供給部に設けられた読み取り
用手段によって指定の電子部品が供給されたか識別され
る７
〔発明の実施例〕
第１図、第１図３．第２図はこの発明の一実施例を示し
、第１図は電子部品装着装置の構成を示す斜視図、第］
１１ ａは第１図中矢視Ａより見た詳細図、第２図は
制御構成を示す図であり、（１）〜（６）。The present invention has been made to solve the above-mentioned drawbacks, and its object is to provide an electronic component mounting device capable of automatically determining whether or not an electronic component to be taken out for mounting is a desired one. [Means for Solving the Problems] The electronic component mounting apparatus according to the present invention is capable of handling various types of electronic components, ! [Operation] In the present invention, a reading means for displaying information such as chemical characteristic values is provided in the parts supply section so that information on the electronic components can be determined. 7 [Embodiments of the Invention] FIG. 1, FIG. 13. FIG. 2 shows an embodiment of the present invention, and FIG. 1 is a perspective view showing the configuration of an electronic component mounting device.
11a is a detailed view seen from arrow A in FIG. 1, and FIG. 2 is a diagram showing the control configuration, (1) to (6).
０υ〜ＯＧは上記従来装置と全く同一の６のである。0υ~OG is 6, which is exactly the same as the above conventional device.
（７）は部品供給部（２）に設け＾れ７：読み取り用手
段であるバーコード表示体で複数のバーが平行に所定の
関係をもって配列されており、その間隔、バー０１幅よ
り無数の組み合わせが可能で、これにより種々の異なっ
た情報を容易に作り出すことができるｆ、（８）はバー
コード表示体（７）に表わされたバーコードを読み取り
、その読み取っｒ、：出力信号をアウトブ１．．卜する
バーコードリーダー・である。αＱは電子部品（１）の
種類、電気特性値等の情報を記憶する記憶装置であり、
制御装置（９）とリンクしている、次に動作について説
明オろ、
装着動作およびプリント基板（４）位置決めについては
従来例と同じなので説明を省略する。装着動作を行なう
為、制御装置（９）は予め設定された順序に従って、対
象部品供給部（２）を電子部品（１）取出し位置α引と
位置決めする。この位置決めが完了された部品供給部（
２）に設け＾れ１こバーコード表示体（７）に表わされ
たバーコードをバーコードリーダー（８）で読み取り、
その読み取り信号を制御装置（９）へ出力する。バーコ
ードリーダー（８）より出力信号を受け１こ制御装置（
９）は、制御装置（９）にリンクされて予め電子部品（
１）の情報を記憶している記憶装置ａＯ内の記憶データ
と比較し、取出し位置（６）の当該部品供給部（２）が
所望の電子部品（１）対応か否かを判別し、装着へウド
（３）の不因示駆動部に制御信号を出力する、
このようにして、部品供給部（２）の適否を判断して、
否判断をしＴこときは、駆動停止をさせると同時に警報
を制御装置（９）より発して不適合部品の取出しを未然
に防止する、
まＴコ、上記実施例では電子部品（１）の情報を表わ才
のにバーコード表示体（７）を使つＴこが、バーコード
以外の例えばバーを複数配列してもよく、その構成の変
化によって種々の異なる信号を得られるものであれば以
下様でも良い、
ま１こ、バーコード表示体（７）に表わされＴこバーコ
ードを読むのに、バーコードリーター（８）を使つｆコ
が、ファイバーセンサーを複数個構成してその各々の出
力信号によって判別してもよく、上記実施例と同様の効
果を奏する。(7) is provided in the parts supply section (2) 7: A bar code display body serving as a reading means has a plurality of bars arranged in parallel with a predetermined relationship, and the distance between them and the width of the bar 01 allows for an innumerable number of bars to be displayed. Combinations are possible, thereby easily creating various different information f, (8) reads the barcode displayed on the barcode display body (7), and reads the barcode r,: the output signal. Autobu 1. ．． It is a barcode reader that reads αQ is a storage device that stores information such as the type of electronic component (1) and electrical characteristic values;
Next, the operation linked to the control device (9) will be explained. Since the mounting operation and the positioning of the printed circuit board (4) are the same as in the conventional example, the explanation will be omitted. In order to perform the mounting operation, the control device (9) positions the target component supply section (2) at the electronic component (1) removal position α in accordance with a preset order. The parts supply section where this positioning has been completed (
2) Read the barcode displayed on the barcode display body (7) with the barcode reader (8),
The read signal is output to the control device (9). One control device receives the output signal from the barcode reader (8).
9) is linked to the control device (9) and has the electronic components (
The information in 1) is compared with the stored data in the storage device aO, and it is determined whether the component supply section (2) at the extraction position (6) is compatible with the desired electronic component (1), and the mounting is performed. A control signal is output to the passive drive section of the head (3).In this way, the suitability of the parts supply section (2) is judged,
If a negative judgment is made, the drive is stopped and at the same time an alarm is issued from the control device (9) to prevent the removal of non-conforming parts.In the above embodiment, information on the electronic parts (1) is issued. Although the barcode display body (7) is used to represent the following, it is also possible to arrange a plurality of bars other than barcodes, as long as various different signals can be obtained by changing the configuration. The following may also be used: In order to read the barcode displayed on the barcode display body (7), the barcode reader (8) is used to configure a plurality of fiber sensors. The discrimination may be made based on the respective output signals, and the same effect as in the above embodiment can be achieved.
この発明は以上説明しγことおり、部品供給部に読み取
り用手段を設け１こので、プリント基板に電子部品を装
着のｒコめに取り出す前に所望の電子部品か否か判別す
ることができ、異種部品の装着。As described above, the present invention is provided with a reading means in the component supply section, so that it is possible to determine whether or not the electronic component is a desired electronic component before the electronic component is mounted on a printed circuit board. , installation of dissimilar parts.
すなわち誤装着が防止できろといった効果がある。In other words, it has the effect of preventing incorrect attachment.
第１図はこの発明の一実施例を示す電子部品装着装置の
構成を示す斜視図、第］１３ａは第１図中、矢視Ａより
見ｆコ詳細図、第２図は制御構成を示す図、第３因は従
来の電子部品装着装置の構成を示す斜視図、第４図は制
御構成を示す図である。
図において、（１）は電子部品、（２）は部品供給部、
（３）は装着ヘッド、（４）はプリント基板、（７）は
バーコード表示体である。
なお、各図中同一符号は同一まγこは相当部分を示す２FIG. 1 is a perspective view showing the configuration of an electronic component mounting apparatus showing an embodiment of the present invention, 13a is a detailed view of F as seen from arrow A in FIG. 1, and FIG. 2 is a control configuration. The third factor is a perspective view showing the configuration of a conventional electronic component mounting apparatus, and FIG. 4 is a diagram showing the control configuration. In the figure, (1) is an electronic component, (2) is a component supply section,
(3) is a mounting head, (4) is a printed circuit board, and (7) is a barcode display body. In addition, the same symbols in each figure are the same, and γ indicates corresponding parts.
Claims (3)
り電子部品を取り出し、プリント基板上へ装着する装着
ヘッドとを備え、上記部品供給部には読み取り用手段を
設けてなることを特徴とする電子部品装着装置。(1) A component supply section that supplies electronic components, and a mounting head that takes out electronic components from the component supply section and mounts them onto a printed circuit board, and the component supply section is provided with reading means. Electronic component mounting equipment.
ーダによつて電子部品の種類、電気的特性等を識別する
ことを特徴とする特許請求の範囲第１項記載の電子部品
装着装置。(2) The electronic component mounting apparatus according to claim 1, wherein the reading means is a bar coder, and the type, electrical characteristics, etc. of the electronic component are identified by the bar coder.
のバーによつて電子部品の種類、電気的特性等を識別す
ることを特徴とする特許請求の範囲第１項記載の電子部
品装着装置。(3) The electronic component mounting apparatus according to claim 1, wherein the reading means is a plurality of bars arranged, and the type, electrical characteristics, etc. of the electronic component are identified by the bars. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60162344A JPS6222498A (en) | 1985-07-23 | 1985-07-23 | Electronic component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60162344A JPS6222498A (en) | 1985-07-23 | 1985-07-23 | Electronic component mounting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6222498A true JPS6222498A (en) | 1987-01-30 |
Family
ID=15752768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60162344A Pending JPS6222498A (en) | 1985-07-23 | 1985-07-23 | Electronic component mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6222498A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209000A (en) * | 1989-02-08 | 1990-08-20 | Fujitsu Ltd | Mis-mounting prevention system of chip component |
| JP2007507097A (en) * | 2003-09-25 | 2007-03-22 | テレント ゲーエムベーハー | Manufacturing method of high-frequency assembly |
| WO2014203331A1 (en) * | 2013-06-18 | 2014-12-24 | 富士機械製造株式会社 | Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method |
| US11174527B2 (en) | 2015-03-03 | 2021-11-16 | Mitsui High-Tec, Inc. | Heat-treatment apparatus and heat-treatment method |
-
1985
- 1985-07-23 JP JP60162344A patent/JPS6222498A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209000A (en) * | 1989-02-08 | 1990-08-20 | Fujitsu Ltd | Mis-mounting prevention system of chip component |
| JP2007507097A (en) * | 2003-09-25 | 2007-03-22 | テレント ゲーエムベーハー | Manufacturing method of high-frequency assembly |
| US8014890B2 (en) | 2003-09-25 | 2011-09-06 | Ericsson Ab | Method for manufacturing a high-frequency assembly |
| WO2014203331A1 (en) * | 2013-06-18 | 2014-12-24 | 富士機械製造株式会社 | Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method |
| JPWO2014203331A1 (en) * | 2013-06-18 | 2017-02-23 | 富士機械製造株式会社 | Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method |
| US10182520B2 (en) | 2013-06-18 | 2019-01-15 | Fuji Corporation | Mounting management device, mounting process device, mounting system, mounting management method, and mounting process method |
| US11174527B2 (en) | 2015-03-03 | 2021-11-16 | Mitsui High-Tec, Inc. | Heat-treatment apparatus and heat-treatment method |
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