JPS62211940A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS62211940A JPS62211940A JP5634186A JP5634186A JPS62211940A JP S62211940 A JPS62211940 A JP S62211940A JP 5634186 A JP5634186 A JP 5634186A JP 5634186 A JP5634186 A JP 5634186A JP S62211940 A JPS62211940 A JP S62211940A
- Authority
- JP
- Japan
- Prior art keywords
- tear
- boundary
- lead frame
- parts
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 description 11
- 238000000926 separation method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 244000007853 Sarothamnus scoparius Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はモールド処理後不要部゛分を引きちぎつて除
去するり一ドフレームに関し、予定の切り離し境界でよ
り確実に切り離せるようにしたものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a frame in which unnecessary parts are torn off and removed after molding, and the frame can be separated more reliably at a scheduled separation boundary. It is.
第２図（ａ）（ｂｌはいずれも従来のリードフレームを
用いた半導体装置を示す、それぞれ、平面図とそのｌｌ
ｂ −ｊｌｂ断面図であり、（１１は半導体チップ、（
２１は半導体チップ（１）を固定するダイパッドであっ
て、こ＼ではその左の部分が放熱フィンの働きをするも
の、（３１はこ＼では１本が一体化されたダイパッドを
介して半導体チップ（１１０基板に接続され、他の２本
がワイヤボンディングにより、半導体チップ（１１の内
部電極に接続されるものであって、半導体チップ（１１
の外部端子どなるＩＪ −ド、（４）は半導体チップ（
１）、ダイパッド（２）およびリード（田の外部接続部
分を除く全体を埋め込み被覆絶縁する樹脂モールド、（
５１は樹脂モールド（４）に設けられたビス穴、（猷）
は樹脂モールド（４）により、ダイパッド（２１とリー
ド（３）とを固定するまでそれらの相互位置を固定する
ために設けられていた第３図に示されるす−ドフレーム
（６１の支持部分のモールド処理後、除去されずに残る
残存部分、（７ａ）は残存部分（−）の切り離し境界で
ある。Figures 2(a) and 2(bl) show a plan view and ll of a semiconductor device using a conventional lead frame, respectively.
b - jlb sectional view, (11 is a semiconductor chip, (11 is a semiconductor chip, (
21 is a die pad that fixes the semiconductor chip (1), and in this case, the left part functions as a heat dissipation fin. (110 is connected to the substrate, and the other two wires are connected to the internal electrodes of the semiconductor chip (11) by wire bonding.
(4) is the semiconductor chip (
1), Resin mold that embeds and insulates the entire die pad (2) and leads (except for the external connection part), (
51 is a screw hole provided in the resin mold (4), (猷)
The support portion of the die pad (21) and the lead (3) shown in FIG. After the molding process, the remaining portion (7a) that remains without being removed is the separation boundary of the remaining portion (-).
第３図について補足すると一枚の金属板から形成され、
前記と同一符号は半導体装置となった段階でそれぞれ対
応する部分となる、リードフレーム（６１０部分であり
、（６ａＯ）はリードフレームのフレーム部分である。To add on to Figure 3, it is formed from a single metal plate,
The same reference numerals as above refer to the lead frame (610), which are the corresponding parts at the stage of forming a semiconductor device, and (6aO) is a frame portion of the lead frame.
従来のリードフレームを用いた半導体装置は上記のよう
に構成されていたので、第４図に示すように半導体装置
凹をヒートシンク（２０）にビス（３０）により固定し
、リード（３）に他の電子回路部品と相互配線するよう
になっていた。Since a conventional semiconductor device using a lead frame was constructed as described above, the semiconductor device recess was fixed to the heat sink (20) with screws (30) as shown in FIG. It was designed to be interconnected with other electronic circuit components.
上記の従来のリードフレームにおいては、切り離し境界
（７ａ）が樹脂モールド処理後、シェア等で切り離しが
行われる関係上、樹脂モールド（４）の外部に来る。そ
のため第４図の如く、ヒートシンク（２■に固定したよ
うな場合に、たとえ第５図（ａｌの如く、切り離し境界
（７ａ）を絶縁樹脂（２）を塗布して保護するようにし
ても第５図（１〕）の如くこの境界（７ａ）が露出する
のを皆無Ｃ二することは不可能でヒートシンク（２０）
との間に高電圧が加わってアーク放電や沿面放電を生じ
るようなこの切り離し境界（７ａ）に、周囲からの電気
的擾乱を避けることが山菜ない問題点があった。In the conventional lead frame described above, the separation boundary (7a) is located outside the resin mold (4) because separation is performed by shearing or the like after resin mold processing. Therefore, in the case where the heat sink (2) is fixed as shown in Figure 4, even if the separation boundary (7a) is coated with insulating resin (2) to protect it as shown in Figure 5 (al), the As shown in Figure 5 (1), it is impossible to completely prevent this boundary (7a) from being exposed, so the heat sink (20)
There is a problem in that it is impossible to avoid electrical disturbances from the surroundings at this separation boundary (7a) where a high voltage is applied between the two and causes arc discharge or creeping discharge.
この解決策として、同一出願人により以下のものが並行
して出願されている。この並行用願書の目的は前記切り
離し境界を、樹脂モールド（４）内部に来るようにして
、外部から電気的擾乱を与えるものの最接近距離を犬に
して解決すると云うものである。As a solution to this problem, the following applications have been filed in parallel by the same applicant. The purpose of this parallel application is to place the separation boundary inside the resin mold (4) so as to minimize the closest approach distance of an external electrical disturbance.
その具体的手段として示されているものは、第６図の拡
大断面図の如く、引きちぎり境界（７ｂ）に切り欠き（
９）を設けて引きちぎりを容易にすると云うものである
。As shown in the enlarged cross-sectional view of FIG. 6, the specific means shown is a notch (
9) to facilitate tearing.
この発明は上記の並行出願の目的に加え、上記の従来の
ものの問題点をより確実に解決するためになされたもの
で、引きちぎり境界から除去される部分の強度を高めて
この境界で確実に切り離すことのできるリードフレーム
を提供することを目的とする。In addition to the purpose of the above-mentioned parallel application, this invention was made in order to more reliably solve the problems of the above-mentioned conventional methods. The purpose is to provide a lead frame that can be separated.
この発９Ｊに係るリードフレームはグイパッド部分およ
び複数のリード部分間の相互位置を固定するため、引き
ちぎり部分が、これらの部分のいずれかに引きちぎり境
界を経てつながるように一枚の板から、これらと共に形
成され、かつ、モールド処理後の除去時に樹脂モールド
の外部から内部の前記境界まで達し、前記境界から引き
ちぎり除去することが予定され、この引きちぎり部分の
引っばり応力に垂直な断面積が前記境界の幅と前記板の
厚さの積より大にされたものである。In order to fix the mutual positions between the Guipad part and the plurality of lead parts, the lead frame according to Issue 9J is made from a single plate so that the tear-off part is connected to any of these parts through the tear-off boundary. The cross-sectional area perpendicular to the tensile stress of this torn-off part is formed together with these and is planned to reach from the outside of the resin mold to the said boundary inside the resin mold and be torn off from the said boundary when removed after the molding process. is larger than the product of the width of the boundary and the thickness of the plate.
引きちぎり部分の断面積を引きちぎり境界の幅と板の厚
さの積より大にすることにより、前記引きちぎり部分で
ちぎれるのを防ぐ。By making the cross-sectional area of the tear-off part larger than the product of the width of the tear-off boundary and the thickness of the plate, tearing at the tear-off part is prevented.
第１図はこの発明の一実施例を示す平面図であり、前記
と同一符号は同一または相当部分、（６ｃ）はモールド
処理後の不要部分除去工程でまずフレーム（６ａ Ｏ）
からシェアで切り離れたのち、引きちぎり境界（７Ｄ）
から引っばって除去されるものであって、境界（７ｂ）
から幅が徐々に拡大するテーパ状の引きちぎり部分であ
る。FIG. 1 is a plan view showing an embodiment of the present invention, in which the same reference numerals as above refer to the same or corresponding parts, and (6c) is a frame (6a O) that is removed in the unnecessary part removal process after molding.
After being separated from the share, the tearing boundary (7D)
is removed by pulling from the boundary (7b)
It is a tapered tear-off part whose width gradually increases from .
この実施例は上記のように構成したのでモールド処理後
、引きちぎり境界（７ｂ）で引きちぎる際、引きちぎり
部分（６Ｃ）の強度をより大きくしであるのでこの部分
で誤ってちぎれることが少くなり前記問題点を解決でき
ることは明らかである。Since this embodiment is constructed as described above, when it is torn off at the tear-off boundary (7b) after the molding process, the strength of the tear-off part (6C) is increased, so that it is less likely to be accidentally torn at this part. It is clear that the above problems can be solved.
なお、上記実施例では引きちぎり部分［Ｆ］Ｃ）にテー
パなつける場合について述べたが１．箒早噛十←も引き
ちぎり境界（７ｂ）から、幅広（二しても同様の効果が
期待でき、この部分（６Ｃ）に他の板を貼り合せるなど
して厚さを増してもよく、さらには引きちぎり境界（７
ｂ）の反対側の残存部分に以上のことを施こすとより効
果を大≦二できる。この場合この境界（７ｂ）に切り欠
き（９）を入れなくて良いよう≦：もできる。In addition, in the above embodiment, the case where the torn part [F]C) is tapered is described, but 1. The same effect can be expected even if the broom is made wider from the tearing boundary (7b), and the thickness may be increased by attaching another board to this part (6C). Furthermore, the tear-off boundary (7
If the above steps are applied to the remaining portion on the opposite side of b), the effect can be increased by ≦2. In this case, it is also possible to omit the notch (9) at this boundary (7b).
また、上記実施例ではグイパッド部分（２）は、冷却フ
ィンと１〜ての働きも要求される場合について述へてお
り、この部分（２）は他の部分にうｌ 、（６ａ） （
６ｃ）と共に打ち抜きで作られる元の一枚の板以外に熱
伝導を良くするために、別の板で緘打ちされることがあ
るがこれの有無はこれまで効果に無関係であることは云
うまでもない。In addition, in the above embodiment, the case where the Gui pad part (2) is required to function as a cooling fin is described, and this part (2) is attached to other parts, (6a) (
6c) In addition to the original board made by stamping, other boards are sometimes used to improve heat conduction, but it goes without saying that the presence or absence of this has no relation to the effectiveness. Nor.
また上記実施例ではトランジスタ等の個別半導体素子に
適用する場合であったが集積回路等１−も適用できるこ
とは云うまでもない。Further, in the above embodiment, the present invention is applied to individual semiconductor elements such as transistors, but it goes without saying that the present invention can also be applied to integrated circuits, etc. 1-.
この発明は上記の通り、引きちぎり部分を補強したので
、引きちぎり境界でより確実に切り離すことができる効
果がある。As described above, this invention has the effect of reinforcing the tear-off portion, which allows for more reliable separation at the tear-off boundary.
第１図はこの発明の一実施例を示す平面図、第２図（ａ
ｌ 、 ＋ｒ〕＋はいずれも従来のリードフレームを用
いた半導体装１ｕを示す、それぞれ平面図とその［ｂ−
［ｂ断面図、第３図は従来のリードフレームを示す平面
図、第４図は従来のリードフレームを用いた半導体装置
の使用状態を示す側面図、第５図ｆａ）図において、（
２１はダイパッド１１１４分、に４）はリード部分、（
６Ｃ）は引きちぎり部分、（７ｂ）は引きちぎり境界で
ある。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
l, +r]+ are a plan view and its [b-
[b sectional view, FIG. 3 is a plan view showing a conventional lead frame, FIG. 4 is a side view showing the state of use of a semiconductor device using a conventional lead frame, and FIG.
21 is the die pad 1114 minutes, 4) is the lead part, (
6C) is the tearing part, and (7b) is the tearing boundary. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (2)
位置を固定するため、これらの部分のいずれかに引きち
ぎり境界を経てつながるように一枚の板からこれらの部
分と共に形成され、かつ、モールド処理後の除去時に樹
脂モールドの外部から内部の前記境界まで達し、前記境
界から引きちぎり除去することが予定される引きちぎり
部分を備え、前記引きちぎり部分の引つぱり応力に垂直
な断面積が前記境界の幅と前記板の厚さの積より大にし
たことを特徴とするリードフレーム。(1) In order to fix the mutual position between the die pad portion and the plurality of lead portions, the die pad portion and the plurality of lead portions are formed together with these portions from a single plate so as to be connected to any of these portions through a tear boundary, and are molded. A tear-off portion is provided that reaches the boundary from the outside of the resin mold to the inside of the resin mold during subsequent removal, and is planned to be torn off from the boundary, and the cross-sectional area perpendicular to the tensile stress of the tear-off portion is A lead frame characterized in that the lead frame is larger than the product of the width of the boundary and the thickness of the plate.
るテーパ状にしたことを特徴とする特許請求の範囲第１
項記載のリードフレーム。(2) Claim 1, characterized in that the tear-off portion has a tapered shape that gradually widens from the tear-off boundary.
Lead frame as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5634186A JPS62211940A (en) | 1986-03-12 | 1986-03-12 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5634186A JPS62211940A (en) | 1986-03-12 | 1986-03-12 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62211940A true JPS62211940A (en) | 1987-09-17 |
Family
ID=13024523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5634186A Pending JPS62211940A (en) | 1986-03-12 | 1986-03-12 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62211940A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173574A (en) * | 1990-06-30 | 1992-12-22 | Johannes Heidenhain Gmbh | Soldering connector and method for manufacturing an electric circuit with this soldering connector |
-
1986
- 1986-03-12 JP JP5634186A patent/JPS62211940A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5173574A (en) * | 1990-06-30 | 1992-12-22 | Johannes Heidenhain Gmbh | Soldering connector and method for manufacturing an electric circuit with this soldering connector |
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