JPS62210693A - Circuit module with built-in capacitor - Google Patents
Circuit module with built-in capacitorInfo
- Publication number
- JPS62210693A JPS62210693A JP61052604A JP5260486A JPS62210693A JP S62210693 A JPS62210693 A JP S62210693A JP 61052604 A JP61052604 A JP 61052604A JP 5260486 A JP5260486 A JP 5260486A JP S62210693 A JPS62210693 A JP S62210693A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- circuit module
- wiring
- built
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims description 17
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 239000010408 film Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 5
- -1 polyethylene Polymers 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 241000723438 Cercidiphyllum japonicum Species 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は回路モジュールに係わり、特に内層にコンデン
サー素子を取り入れ、多層配線により薄型化した回路モ
ジュールに関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a circuit module, and particularly to a circuit module that incorporates a capacitor element in an inner layer and is thinned by multilayer wiring.
近年、電子機器の小型化、多機能化が急速に進み、これ
に伴い部品は小型化、薄膜化し、さらに回路も複雑にな
るために同一平面内での配線は困難となっている。配線
の多層化には厚膜印刷、グリーンシート多層、スルーホ
ール多層等槽々あり、それぞれ実用化される様になって
きているが、部品を基板内に内蔵し、多層化技術により
配線形成されると、回路モジュールはさらに小型化する
ことができる。最近この様な回路モジュールとして、グ
リ−シート多層配線層内にコンデンサー用セラミックシ
ートを積層した多層配線回路モジュールが提案されてい
る。この例を第２図に示す。アルミナ粉末と有機バイン
ダーと溶剤を主成分とするスラリーを用いて、ドクタブ
レードにより５０〜５００μのシート（７）を形成し、
タングステン系導体ペーント（９）により配線形成を行
なう。コンデンサーとなるシートはセラミックシート（
７）の両面に電極（８）が配置している。これらシート
を複数枚積層し、圧着後１３００℃〜１６００℃の温度
中にて焼成し、コンデンサ内蔵のセラミック多層基板を
得るものである。しかしながらこの基板はグリーンシー
ト多層のもつ本質的な欠点、すなわちプロセスが高温で
あるためコスト的に高くなること、才た１シートの厚さ
が耐電圧的な限界と、機械的強度が要求されるため、通
常１００μ以上必要であり積層数が多くなると、全体の
専みが増大するという欠点があった。さらにコンデンサ
ーの特性からみると、グリーンシート材料のアルミナの
訪電率が約８であり、しかも既述のように一層の厚さを
薄くできないため、１素子あたりの容量は比較的小さく
、１０００ｐＦ 桂度が限界であった。BACKGROUND ART In recent years, electronic devices have rapidly become smaller and more multifunctional, and as a result, components have become smaller and thinner, and circuits have become more complex, making it difficult to wire them on the same plane. Multi-layer wiring includes thick film printing, green sheet multi-layer, through-hole multi-layer, etc., each of which is being put into practical use. As a result, the circuit module can be further downsized. Recently, as such a circuit module, a multilayer wiring circuit module in which a capacitor ceramic sheet is laminated within a green sheet multilayer wiring layer has been proposed. An example of this is shown in FIG. Using a slurry mainly composed of alumina powder, an organic binder, and a solvent, a sheet (7) of 50 to 500 μm is formed using a doctor blade,
Wiring is formed using tungsten conductor paint (9). The sheet that becomes the capacitor is a ceramic sheet (
Electrodes (8) are arranged on both sides of 7). A plurality of these sheets are laminated, pressure bonded, and then fired at a temperature of 1300° C. to 1600° C. to obtain a ceramic multilayer substrate with a built-in capacitor. However, this substrate has the essential drawbacks of multilayer green sheets, namely, the process is high temperature, which increases the cost, the thickness of a single sheet has a voltage limit, and mechanical strength is required. Therefore, a thickness of 100 μm or more is usually required, and as the number of laminated layers increases, there is a drawback that the overall burden increases. Furthermore, looking at the characteristics of a capacitor, the current visiting rate of alumina, which is a green sheet material, is approximately 8, and as mentioned above, the thickness of the layer cannot be made even thinner, so the capacitance per element is relatively small, 1000pF Katsura. The degree was the limit.
本発明は上述の欠点を鑑みてなされたもので、製品プロ
セスが簡単で低コストであって、しかも薄型化に適した
コンデンサー内蔵回路モジュールを提供することにある
。The present invention has been made in view of the above-mentioned drawbacks, and it is an object of the present invention to provide a circuit module with a built-in capacitor that has a simple product process, is low cost, and is suitable for thinning.
本発明は熱可塑性基材とこの基材の片面ないしは両面に
形成された導体配線パターンとからなる単位配線シート
を複数枚重ねて一体成形した多層印刷配線板において、
該配線板内層部にｇ電体フィルムを積層し、該誘電体フ
ィルムの両面に電極を配置した回路モジュールである。The present invention provides a multilayer printed wiring board in which a plurality of unit wiring sheets each consisting of a thermoplastic base material and a conductive wiring pattern formed on one or both sides of the base material are stacked and integrally formed.
This is a circuit module in which a g-electric film is laminated on the inner layer of the wiring board, and electrodes are arranged on both sides of the dielectric film.
本発明について図面を持ってさらに詳細に説明する。第
１図（ａ）〜（Ｃ）は本発明によるコンデンサ内蔵回路
モジュールの製造例を示すものである。第１図（ａ）は
シート状に成形した熱可塑性樹脂製絶縁基材（１）を示
したもので、この基材には予めスルーホール（２）が設
けられている。この基板（１）上に導電性ペーストを印
刷に乾燥し、コンデンサの上部電極と配線Ｊ−を形成す
る。また同様に熱可搬性基材（６）上にコンデンサの下
部電極（５）を印刷した配線シートを形成し、誘電体フ
ィルムを内層に配置する。The present invention will be explained in more detail with reference to the drawings. FIGS. 1A to 1C show examples of manufacturing a circuit module with a built-in capacitor according to the present invention. FIG. 1(a) shows an insulating base material (1) made of thermoplastic resin molded into a sheet, and through holes (2) are provided in advance in this base material. A conductive paste is printed and dried on this substrate (1) to form the upper electrode of the capacitor and the wiring J-. Similarly, a wiring sheet with a lower electrode (5) of a capacitor printed thereon is formed on a thermotransportable substrate (6), and a dielectric film is placed on the inner layer.
ここで配線層（３） 、 （４１は熱可塑性基材ｆｉｌ
ないしく６）に塗布した例を示したが、誘電体フィルム
の両面に配線形成しても良い。Here, the wiring layer (3), (41 is the thermoplastic base material fil
Although the example in which the dielectric film is applied is shown in (6) to (6) above, wiring may be formed on both sides of the dielectric film.
また該誘電体シートにはあらかじめ孔を設けておき、該
誘電体シートをはさんで相互に接続できる様に加工して
もさしつかえない。ここで用いる単位配線シートとなる
熱可塑性基材として具体的にはポリ塩化ビニル、ポリス
チレン、飽和ポリエステル樹脂、ポリエチレン、ポリプ
ロピレン、ポリカーボネート、ポリフェニレンオキサイ
ド、ポリスルフォン、ポリフェニレンサルファイド、ポ
リアセタール、ポリアミド等が挙げられる。一方配線用
導体ペーストとしては上記熱可塑性有機樹脂あるいは他
の熱可塑性樹脂をバインダとしてこれと金属粉体とを混
線、調整したものを用い、必要があれば溶剤を適宜添加
する。金属粉体には鉄。Alternatively, holes may be formed in the dielectric sheet in advance, and the holes may be processed so that they can be connected to each other by sandwiching the dielectric sheet. Specific examples of the thermoplastic base material for the unit wiring sheet used here include polyvinyl chloride, polystyrene, saturated polyester resin, polyethylene, polypropylene, polycarbonate, polyphenylene oxide, polysulfone, polyphenylene sulfide, polyacetal, polyamide, and the like. On the other hand, the conductor paste for wiring is prepared by mixing the above-mentioned thermoplastic organic resin or other thermoplastic resin as a binder with metal powder, and if necessary, a solvent is added as appropriate. Iron for metal powder.
銅、ニッケル、金、白金、アルミニウム等のいづれを用
いても良いが、導電性、経沖」性を考慮すると銅、銀が
適当である。Any of copper, nickel, gold, platinum, aluminum, etc. may be used, but copper and silver are suitable in consideration of conductivity and transmissibility.
該コンデンサー用該電体フィルムとしては上記熱可塑性
樹脂を使用することができるが、特に強靭で耐熱性の高
い薄いフィルムが容易に得られるポリフェニレンサルフ
ァイド、ポリブチレンテレクタレート、ポリエチレンテ
レクタレート、ポリカーボネート樹脂等が好適である。The above-mentioned thermoplastic resins can be used as the electric film for the capacitor, but polyphenylene sulfide, polybutylene terretalate, polyethylene terretalate, and polycarbonate are particularly suitable for easily forming a thin film with high strength and heat resistance. Resin etc. are suitable.
次いで上記の様にして得られた単位配線シートと該電体
シートを第１図（ｂ）に示す様に複数枚積層し、熱プレ
スを用いて加熱圧着する。熱プレスの温度、圧力、加圧
時間は使用した樹脂材料により異なり、その条件は適宜
選択する。Next, a plurality of the unit wiring sheets and the electric sheet obtained as described above are laminated as shown in FIG. 1(b), and they are heat-pressed using a hot press. The temperature, pressure, and pressurizing time of the hot press vary depending on the resin material used, and the conditions are selected as appropriate.
この加熱圧着により各単位配線シートと誘電体シートは
第１図（Ｃ）に示す様に一体成型されるとともに、スル
ーホール内の電気的接続を含めて最終的な導体パターン
が同時に形成される。この場合、導体ペーストは熱可塑
性樹脂でできているため、加熱圧着により上、下の単位
配線シート上の導体パターン同志が加熱融着され、電気
的コンタクトが確実に形成される。さらにコンデンサ用
の誘電体フィルムに単位配線シートよりも熱変形温度が
高い基材を用いれば、加熱圧漸の際に該コンデンサ用の
誘電体フィルムが熱変形を生じせずに初期の誘電体特性
を維持できるので好ましい。By this heating and pressure bonding, each unit wiring sheet and dielectric sheet are integrally molded as shown in FIG. 1(C), and the final conductor pattern including electrical connections in the through holes is simultaneously formed. In this case, since the conductor paste is made of thermoplastic resin, the conductor patterns on the upper and lower unit wiring sheets are heat-fused together by heat-pressing, and electrical contact is reliably formed. Furthermore, if a base material with a higher thermal deformation temperature than the unit wiring sheet is used for the dielectric film for capacitors, the dielectric film for capacitors will not undergo thermal deformation during heating and pressure, and will maintain its initial dielectric properties. This is preferable because it allows the maintenance of
し発明の効果〕
本発明によれば、導体配線パターンをあらかじめ形成し
た複数枚の配線シートと、誘電体フィルムとを用意し、
これらを加熱圧着成形することにより一体成形してコン
デンサー内蔵の多層回路基板を得ることができるので、
従来のグリ−シート方式のコンデンサ内蔵基板にくらべ
、誘電体の厚みを薄くできるため、１０００ｐＦ以上の
コンデンサも容易に形成できる。さらに加熱圧着によっ
て一体成形と多層化を行なうために、全体の厚さを非常
に薄くでき、しかも層間配線にともなう複雑なプロセス
を省くことができる。[Effects of the Invention] According to the present invention, a plurality of wiring sheets on which conductor wiring patterns are formed in advance and a dielectric film are prepared,
By heat-pressing molding these, it is possible to integrally form a multilayer circuit board with a built-in capacitor.
Compared to the conventional green sheet type capacitor-embedded substrate, the dielectric thickness can be made thinner, so capacitors of 1000 pF or more can be easily formed. Furthermore, since integral molding and multilayering are performed by heat and pressure bonding, the overall thickness can be made extremely thin, and the complicated process associated with interlayer wiring can be omitted.
熱可胆性絶に基材として厚さ１００μｍ１外形５０ｆｆ
ｌＩ１）×６０ｆｆｉＩｍのポリカーボネートのシート
を用い、その所定位置に０１５ｗφのスルーホールを形
成した。この熱可塑性絶縁基材の一方の面上にバインダ
として、ポリ塩化ビニルを用い、銀粉と溶剤とを以下の
組成に混練−整した導体ペーストを印刷した。Thickness 100 μm 1 external size 50 ff as a thermoplastic base material
A polycarbonate sheet of lI1)×60ffiIm was used, and a through hole of 015 wφ was formed at a predetermined position. On one side of this thermoplastic insulating base material, polyvinyl chloride was used as a binder, and a conductive paste prepared by kneading silver powder and a solvent into the following composition was printed.
導体ペースト組成
塩化ビニル−酢酸ビニルコーポリマー（酢酸ビニル比２
０チ） ２１０重量部
銀粉（粒径３μ） ：９０重量部
溶剤（シクロへキサノン２ブチルカルピトールの混合溶
剤） ２９０重量部
次に８０℃２０分間乾燥させ印刷された導体ペーストの
溶剤を除去し、基材の他方の面に同じ導体ペーストを印
刷しコンデンサの上部電極として５Ｘ５ｍ、１０Ｘ１０
ｍ、２０Ｘ２０ｍｍの電極パターンを形成した。次いで
誘電体フィルムとして、透孔を施こした厚さ２５μｍＰ
Ｐ５（ポリフェニレンサルファイド：呉羽化学製ＫＰＳ
）を用意した。Conductor paste composition Vinyl chloride-vinyl acetate copolymer (vinyl acetate ratio 2
0chi) 210 parts by weight Silver powder (particle size 3μ): 90 parts by weight Solvent (mixed solvent of cyclohexanone 2-butylcarpitol) 290 parts by weight Next, the solvent was removed from the printed conductor paste by drying at 80°C for 20 minutes. , print the same conductive paste on the other side of the base material and use it as the upper electrode of the capacitor, 5x5m, 10x10
An electrode pattern of 20×20 mm was formed. Next, as a dielectric film, a 25 μm thick P film with through holes was prepared.
P5 (polyphenylene sulfide: KPS manufactured by Kureha Chemical Co., Ltd.
) was prepared.
次に下部電極としてポリカーボネート樹脂シートに既述
の導体ペーストを用いて４０Ｘ５０ｍｍの下部電極パタ
ーンを印刷形成した。これら４枚の単位配線シートを第
１図（ｂ）のごとく積層し、卓上型熱プレスを用いてヒ
ータ一温度１５０℃樹脂２０＃／−保持時間５分として
熱圧着を行ない、直に冷却して取り出した。得られた基
板の上面にはコンデンサの下層電極がプレスにより誘電
体フィルムのスルーホールを通って露出し、電気的測定
が可能となっている。ここで３つのパターンの容量をＹ
ＨＰ製ＬＲＣメーターを用い、測定周波数ＩＭＨｚで
測定した結果、以下であった。Next, as a lower electrode, a 40×50 mm lower electrode pattern was printed on a polycarbonate resin sheet using the conductive paste described above. These four unit wiring sheets were laminated as shown in Figure 1(b), thermocompression bonded using a tabletop heat press with a heater temperature of 150°C, resin 20#/- and a holding time of 5 minutes, and then cooled directly. I took it out. On the upper surface of the obtained substrate, the lower electrode of the capacitor was exposed through a through hole in the dielectric film by pressing, making it possible to perform electrical measurements. Here, the capacity of the three patterns is Y
The results of measurement using an HP LRC meter at a measurement frequency of IMHz were as follows.
またトータルの厚みは約２００μであり、スルーホール
を含む接続の信頼性も一４０℃〜＋６０℃２００サイク
ルで異状は見られず良好であった。Further, the total thickness was about 200μ, and the reliability of the connections including through holes was good with no abnormalities observed after 200 cycles of -40°C to +60°C.
第１図は本発明によるコンデンサ内蔵回路モジュールを
説明するための図を示し、第２図は従来技術によるグリ
ーンシート方式コンデンサー内蔵基板を示すものである
。
１・・・熱可塑性基材、
２・・・スルーホール、
３・・・配線パターン（上部電極パターン）、４・・・
誘電体フィルム、
５・・・下部電極パターン、
６・・・熱可塑性基材、
７・・・アルミナ、
８・・・電極、
９・・・ペースト
代理人 弁理士 則 近 憲 佑
同 竹 花 喜久男FIG. 1 shows a diagram for explaining a circuit module with a built-in capacitor according to the present invention, and FIG. 2 shows a green sheet type capacitor-built-in board according to the prior art. 1... Thermoplastic base material, 2... Through hole, 3... Wiring pattern (upper electrode pattern), 4...
Dielectric film, 5... Lower electrode pattern, 6... Thermoplastic base material, 7... Alumina, 8... Electrode, 9... Paste agent, patent attorney Norihiko Ken Yudo Kikuo Takehana
Claims (3)
面に形成された導体配線パターンとからなる単位配線シ
ートを複数枚重ねて一体成形した多層印刷配線板におい
て、該配線板内層部に誘電体フィルムを積層し、該誘電
体フィルムの両面に電極を配置したことを特徴とするコ
ンデンサー内蔵回路モジュール。(1) In a multilayer printed wiring board that is integrally formed by stacking a plurality of unit wiring sheets consisting of a thermoplastic insulating base material and a conductor wiring pattern formed on one or both sides of this base material, the inner layer of the wiring board A circuit module with a built-in capacitor, characterized in that dielectric films are laminated and electrodes are arranged on both sides of the dielectric films.
性基材よりも熱変形温度が高い誘電体フィルムを用いる
ことを特徴とした特許請求の範囲第１項記載のコンデン
サ内蔵回路モジュール。(2) The circuit module with a built-in capacitor according to claim 1, wherein a dielectric film having a higher thermal deformation temperature than the thermoplastic base material used for the wiring sheet is used as the electric film.
イド樹脂フィルムを用いることを特徴とする特許請求の
範囲第１項記載のコンデンサー内蔵回路モジュール。(3) A circuit module with a built-in capacitor according to claim 1, wherein a polyphenylene sulfide resin film is used as the dielectric film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61052604A JPH0691321B2 (en) | 1986-03-12 | 1986-03-12 | Capacitor-Built-in circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61052604A JPH0691321B2 (en) | 1986-03-12 | 1986-03-12 | Capacitor-Built-in circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62210693A true JPS62210693A (en) | 1987-09-16 |
| JPH0691321B2 JPH0691321B2 (en) | 1994-11-14 |
Family
ID=12919389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61052604A Expired - Lifetime JPH0691321B2 (en) | 1986-03-12 | 1986-03-12 | Capacitor-Built-in circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0691321B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7038143B2 (en) | 2002-05-16 | 2006-05-02 | Mitsubishi Denki Kabushiki Kaisha | Wiring board, fabrication method of wiring board, and semiconductor device |
| US7286367B2 (en) | 2002-01-11 | 2007-10-23 | Denso Corporation | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board |
-
1986
- 1986-03-12 JP JP61052604A patent/JPH0691321B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7286367B2 (en) | 2002-01-11 | 2007-10-23 | Denso Corporation | Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board |
| US7038143B2 (en) | 2002-05-16 | 2006-05-02 | Mitsubishi Denki Kabushiki Kaisha | Wiring board, fabrication method of wiring board, and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0691321B2 (en) | 1994-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |