JPS62199743A - High strength copper alloy and its manufacture - Google Patents
High strength copper alloy and its manufactureInfo
- Publication number
- JPS62199743A JPS62199743A JP61043859A JP4385986A JPS62199743A JP S62199743 A JPS62199743 A JP S62199743A JP 61043859 A JP61043859 A JP 61043859A JP 4385986 A JP4385986 A JP 4385986A JP S62199743 A JPS62199743 A JP S62199743A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- based alloy
- strength copper
- strength
- elongation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000032683 aging Effects 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 11
- 238000005482 strain hardening Methods 0.000 claims abstract description 9
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 7
- 239000002244 precipitate Substances 0.000 claims abstract description 6
- 238000000137 annealing Methods 0.000 claims abstract description 3
- 238000001556 precipitation Methods 0.000 claims description 20
- 238000011282 treatment Methods 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 238000007712 rapid solidification Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 4
- 230000001376 precipitating effect Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000010587 phase diagram Methods 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- OOYGSFOGFJDDHP-KMCOLRRFSA-N kanamycin A sulfate Chemical group OS(O)(=O)=O.O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CN)O[C@@H]1O[C@H]1[C@H](O)[C@@H](O[C@@H]2[C@@H]([C@@H](N)[C@H](O)[C@@H](CO)O2)O)[C@H](N)C[C@@H]1N OOYGSFOGFJDDHP-KMCOLRRFSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は導電ばね材料に好適な強度と導電性とに優れた
高強度銅基合金の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a high-strength copper-based alloy having excellent strength and conductivity and suitable for use as a conductive spring material.
（従来の技術）
強度と導電性とに優れた導電ばね材料として代表的なも
のは、ＪＴＳ １１３１３０に合金番号Ｃ１７２０とし
て定められている１、８ ％Ｂｅ、０．２５％ＣＯ１残
部Ｃｕの析出硬化型の合金があるが、高価なりｅを多量
に含有するために地合せ価格が極めて高くなるという欠
点があった。一方、Ｃｕをベースとし、Ｂ、Ｓｉ 、
Ｐ、 Ｇｅ、 Ｔｃ等の半金属元素と、Ｂｅ又はＳとを
加えた合金を溶融状態から急冷凝固して粒度０．５〜１
５μｍの急冷凝固組織とすることにより導電性、強度、
硬度等を向上させるという新しい試みが特公昭６０−４
３８９５号公報に示されている。ところがこの合金は多
量の半金属元素を含むために導電性が悪いこと、硬度及
び強度が不十分であること、伸びが小さく脆いため曲げ
成形性に劣ること等の理由から、導電ばね材料としては
実用性に乏し〈従来の析出硬化型のＣｕ ｆｌｅ合金
よりも劣るものであった。(Prior art) A typical conductive spring material with excellent strength and conductivity is precipitation hardening of 1.8% Be, 0.25% CO, and the balance Cu specified as alloy number C1720 in JTS 113130. There is a type alloy, but it has the disadvantage that it is expensive and contains a large amount of e, making the preparation price extremely high. On the other hand, based on Cu, B, Si,
An alloy containing metalloid elements such as P, Ge, and Tc and Be or S is rapidly solidified from a molten state to a particle size of 0.5 to 1.
By forming a rapidly solidified structure of 5 μm, conductivity, strength,
A new attempt to improve hardness etc. was made in 1986-4.
It is shown in Japanese Patent No. 3895. However, this alloy is not suitable as a conductive spring material because it contains a large amount of semi-metallic elements, resulting in poor conductivity, insufficient hardness and strength, and low elongation and brittleness, resulting in poor bending formability. It lacked practicality and was inferior to conventional precipitation hardening type Cu fle alloys.
（発明が解決しようとする問題点）
本発明はこのような従来の問題点を解決し、Ｂｅの含有
率を低くして地合せ価格を安価なものとするとともに、
急冷凝固法を利用して組織の微細化を図り、しかも硬度
、強度、導電性等の導電ばね材に要求される特性を十分
に満足することができる高強度銅基合金及びその製造方
法を目的として完成されたものである。(Problems to be Solved by the Invention) The present invention solves these conventional problems, lowers the Be content, lowers the combined price, and
The purpose is to create a high-strength copper-based alloy that uses a rapid solidification method to refine its structure and that satisfies the properties required for conductive spring materials, such as hardness, strength, and conductivity, and a method for producing the same. It was completed as.
（問題点を解決するための手段）
本願第１の発明はＢｅ ０．１５〜１．０％（重量％、
以下同じ） 、Ｎｉ、 Ｇｏの一方又は双方を合計量で
０．５〜６．０％、残部Ｃｕ及び不可避的不純物からな
る急冷凝固組織中に、加工により析出サイトを増加させ
時効処理後の析出物を均一に分散させてビッカース硬度
３００以上、伸び３％以上の特性を持たせたことを特徴
とするものであり、また本願第２の発明はＢｅ ０．１
５〜１．０％、Ｎｉ、Ｃｏの一方又は双方を合計量で０
．５〜６．０％、残部Ｃｕ及び不可避的不純物からなる
合金を溶融状態から急冷凝固して結晶粒度が０．２〜２
５μｍの急冷凝固組織としたのち、９５％以下の冷間加
工を行い、更に時効析出処理により金属間化合物を均一
に析出させたことを特徴とするものである。(Means for solving the problem) The first invention of the present application contains Be 0.15 to 1.0% (wt%,
The same applies hereinafter), Ni, Go, or both in a total amount of 0.5 to 6.0%, and the balance is Cu and unavoidable impurities.The precipitation sites are increased by processing in the rapidly solidified structure, and the precipitation after aging treatment is The second invention of the present application is characterized in that the material is uniformly dispersed to have a Vickers hardness of 300 or more and an elongation of 3% or more.
5-1.0%, one or both of Ni and Co in total amount 0
．． 5 to 6.0%, the balance being Cu and unavoidable impurities, the alloy is rapidly solidified from a molten state to have a crystal grain size of 0.2 to 2.
After forming a rapidly solidified structure of 5 μm, cold working of 95% or less is performed, and intermetallic compounds are uniformly precipitated by aging precipitation treatment.
上記のような組成の合金は、第１図のＣｕ −Ｂｅ−Ｎ
ｉ系合金の３％Ｎｉ切断面平衡状態図に見られるように
常温におけるＢ’ｅ、Ｎｉの固溶限が非常に狭くなるの
で本来析出硬化性に優れた合金である。しかしながら通
常の溶解鋳造工程を経た材料ではほとんどのＢｅ、 Ｎ
ｉは析出物としてマトリックスから排出された状態にあ
り、後に熱間加工や焼鈍を行っても容易にはマトリック
ス中に溶は込まないので析出硬化性が不十分となる。ま
た溶体化処理も結晶粒の粗大化防止のためにあまり高温
では行えず、通常は９００〜９５０℃で行われるが、こ
の程度の温度ではやはり析出物であるＢｅやＮｉは完全
にはマトリックス中に固？容されない。ところが５００
℃／秒を越える高速急冷凝固に伴う非平衡凝固の場合
にはＢｅ、旧、Ｃｏ等のマトリックス中への固溶度が大
きくなり、その後の時効析出処理における析出強化作用
は著しいものとなる。また凝固時に一度固溶された’Ｂ
ｅ、 Ｎｉ、 Ｃｏ等は凝固後に溶体化処理を行った場
合にも結晶粒成長を効果的に抑制し、溶体化処理温度を
上昇させても粒成長を著しく抑制する特徴を持つ。The alloy with the above composition is Cu-Be-N shown in Figure 1.
As seen in the equilibrium phase diagram of the 3% Ni cross section of the i-series alloy, the solid solubility limit of B'e and Ni at room temperature is extremely narrow, so it is an alloy that inherently has excellent precipitation hardenability. However, in materials that have gone through the normal melting and casting process, most Be and N
i is in a state of being discharged from the matrix as a precipitate, and even if hot working or annealing is performed later, it does not easily dissolve into the matrix, resulting in insufficient precipitation hardenability. In addition, solution treatment cannot be carried out at very high temperatures to prevent coarsening of crystal grains, and is usually carried out at 900 to 950°C, but at this temperature, Be and Ni precipitates are not completely absorbed into the matrix. Hard? Not tolerated. However, 500
In the case of non-equilibrium solidification accompanying rapid solidification at a rate exceeding .degree. C./sec, the solid solubility of Be, old, Co, etc. in the matrix increases, and the precipitation strengthening effect in the subsequent aging precipitation treatment becomes significant. In addition, 'B, which was once solid-dissolved during solidification,
E, Ni, Co, etc. have the characteristics of effectively suppressing grain growth even when solution treatment is performed after solidification, and significantly suppressing grain growth even when the solution treatment temperature is increased.
本発明は上記のような時効析出挙動を呈する銅基合金を
溶融状態から急冷凝固させることにより平衡凝固によっ
ては不可能な過剰量のＢｅ ％ Ｎ ｉ 、Ｃ。In the present invention, by rapidly cooling and solidifying a copper-based alloy exhibiting aging precipitation behavior as described above from a molten state, it is possible to obtain an excessive amount of Be % N i , C that cannot be achieved by equilibrium solidification.
等の溶質原子をマトリックス中に固溶させた極めて微細
な急冷凝固＆ｌＩ織を得たうえ、これに冷間加工を加え
て加工欠陥を金属組織中に生成させ、更にこれを時効析
出処理して多量の金属間化合物を均一微細に析出させる
ことにより硬度、強度、曲げ成形性を高めることに成功
したものである。次に本発明の各構成要件について更に
具体的に説明する。An extremely fine rapidly solidified &lI weave with solute atoms dissolved in the matrix was obtained, and this was subjected to cold working to generate processing defects in the metal structure, which was then subjected to aging precipitation treatment. By uniformly and finely precipitating a large amount of intermetallic compounds, we succeeded in increasing hardness, strength, and bending formability. Next, each component of the present invention will be explained in more detail.
本発明の銅基合金中Ｂｅは析出硬化性を生せしめるため
の基本的な元素であり、０．１５％未満では析出硬化性
が不十分で機械的強度の向上が得られず、逆に１．０％
を越えると地合せ価格が上昇して本発明の目的が達成さ
れなくなるとともに、急冷凝固法によっても全体がマト
リックス中に固溶できなくなり、含有量増加に見合った
合金特性向上効果が得られない、ので０．１５〜１．０
％の範囲とするもので、特に０．４〜０４８％の範囲
が最適である。次に旧及びＣｏも８ｅと同様に析出硬化
性を付与するための元素であって、その合計量が０．５
％未満では析出硬化性が不十分であり、６．０％を越え
ると急冷凝固時にマトリックス中に固溶できない部分が
生ずるうえ導電率を悪化させるので０．５〜６．０％と
することが必要で、特に２．０〜５．０％の範囲が好ま
しいものである。これらのＮｉとＣｏはいずれか一方又
は双方を上記の範囲内で用いればよい。ＢｅとＮｉ＋Ｃ
ｏは強化に寄与する金属間化合物の化学量論的組成に近
付けるため、原子比を１：０．Ｓ〜１゜２の範囲とする
ことが好ましい。Be in the copper-based alloy of the present invention is a basic element for producing precipitation hardenability, and if it is less than 0.15%, precipitation hardenability is insufficient and mechanical strength cannot be improved; .0%
If it exceeds this amount, the formation price will increase and the object of the present invention will not be achieved, and even by the rapid solidification method, the whole will not be able to be solidly dissolved in the matrix, and the effect of improving alloy properties commensurate with the increase in content will not be obtained. So 0.15~1.0
%, and a range of 0.4 to 0.48% is particularly optimal. Next, similar to 8e, Co and Co are elements for imparting precipitation hardenability, and their total amount is 0.5
If it is less than 1%, precipitation hardenability is insufficient, and if it exceeds 6.0%, there will be a portion that cannot be solidly dissolved in the matrix during rapid solidification, and the conductivity will deteriorate, so it is recommended to set it to 0.5 to 6.0%. It is necessary and particularly preferably in the range of 2.0 to 5.0%. Either or both of Ni and Co may be used within the above range. Be and Ni+C
o has an atomic ratio of 1:0 to approximate the stoichiometric composition of the intermetallic compound that contributes to strengthening. It is preferably in the range of S to 1°2.
このような合金は溶融状態から例えば回転ローラ間に流
し込む等の方法によって５００ ℃／秒を越す高連変で
瞬時に冷却固化される。このような急冷凝固の結果、結
晶粒度が０．２〜２５μｍの微細な急冷凝固組織が得ら
れるとともに、前述したとおりＢｅ、 Ｎｉ、 Ｃｏ等
の元素は平衡冷却によっては到底固溶できない多くの分
量がマトリックス中に固溶し、強化に寄与しない粗大析
出物をほとんど生じない。本発明においてはこの組織に
圧延等により９５％以下の冷間加工を加えて組織内に加
工欠陥を生成させ、更に必要に応じて５５０〜１０００
℃の溶体化処理と８０％以下の冷間加工とを加えたのち
、２５０〜５００℃で時効析出処理を行う。これらの処
理によって急冷凝固組織中に加工による析出サイトが増
加してＢｅｓ Ｎｉ、 Ｃｏの金属間化合物が均一微細
に析出し、後の実施例のデータにも示すとおり材料の硬
度がビッカース硬度で３００以上、伸び３％以上となる
ほか、引張強度、曲げ加工性等が著しく向上する。特に
本発明においては急冷凝固法により過剰量のＢｅ、 Ｎ
ｉ又はＣｏ元素をマトリックス中に固溶させであるため
、時効析出処理により短時間で均一かつ微細な金属間化
合物が一斉に析出することとなり、硬度、伸び、強度、
曲げ加工性等を著しく向上させることができる。また本
発明においては溶体化処理を行った場合にも、急冷凝固
法により固溶されたＢｅ、 Ｎｉ又はＣｏが結晶粒成長
を効果的に抑制し、最ｕ ｕ 織の粒度は２５μｍを越
えることはない。Such an alloy is instantaneously cooled and solidified from a molten state by, for example, being poured between rotating rollers at a rapid rate of change over 500° C./sec. As a result of such rapid solidification, a fine rapidly solidified structure with a grain size of 0.2 to 25 μm is obtained, and as mentioned above, elements such as Be, Ni, and Co are dissolved in large amounts that cannot be solidified by equilibrium cooling. is dissolved in the matrix, and hardly any coarse precipitates that do not contribute to strengthening are formed. In the present invention, this structure is subjected to cold working of 95% or less by rolling or the like to generate processing defects within the structure, and if necessary, 550 to 1000
After solution treatment at 250-500°C and cold working at 80% or less, aging precipitation treatment is performed at 250-500°C. Through these treatments, the number of precipitation sites due to processing increases in the rapidly solidified structure, and the intermetallic compounds of BesNi and Co precipitate uniformly and finely, and as shown in the data of the later examples, the hardness of the material increased to 300 on the Vickers hardness scale. As a result, the elongation is 3% or more, and the tensile strength, bending workability, etc. are significantly improved. In particular, in the present invention, excessive amounts of Be and N are removed by the rapid solidification method.
Since the i or Co element is dissolved in the matrix, uniform and fine intermetallic compounds are precipitated all at once in a short period of time through aging precipitation treatment, resulting in improvements in hardness, elongation, strength,
Bending workability etc. can be significantly improved. Furthermore, in the present invention, even when solution treatment is performed, Be, Ni or Co dissolved in solid solution by the rapid solidification method effectively suppresses crystal grain growth, and the grain size of the most woven fabric exceeds 25 μm. There isn't.
なお、冷間加工の程度を９５％以下としたのは、組織中
に加工欠陥を十分に生じさせるために必要なだめであり
、また結晶粒度を０．２〜２．５ μｍとしたのは、０
．２ μｍ未満の結晶を生じさせることは困難であり、
逆に２５μｍを越えると延性や曲げ成形性が低下するか
らである。更に、得られた合金のビッカース硬度を３０
０以上、伸びを３％以上と限定したのは、特に導電ばね
材料として好ましい範囲を明確化したもめである。The degree of cold working was set to 95% or less because it was necessary to sufficiently generate processing defects in the structure, and the grain size was set to 0.2 to 2.5 μm because 0
．． It is difficult to produce crystals smaller than 2 μm;
On the other hand, if it exceeds 25 μm, ductility and bending formability will decrease. Furthermore, the Vickers hardness of the obtained alloy was set to 30.
The reason why the elongation was limited to 0 or more and the elongation to 3% or more was to clarify the preferable range for a conductive spring material.
このように本発明の合金は低ベリリウムであるにもかか
わらず硬度、伸び、強度に優れ、しかも組織が緻密であ
るため延性及び曲げ成形性に優れるうえ、導電性を阻害
する元素や粗大析出物をほとんど含まないので導電ばね
材料として好適な高い導電性を有するものである。As described above, the alloy of the present invention has excellent hardness, elongation, and strength despite its low beryllium content, and has a dense structure that provides excellent ductility and bending formability. Since it contains almost no carbon, it has high conductivity and is suitable as a conductive spring material.
（実施例）
第１表に示される陽１〜隘１５の種々の組成の合金を高
速で回転するローラ間に噴き出し、５００ ℃／秒以上
の速度で溶融状態から急冷凝固して厚さ０．３１ ｍ−
の薄板を作成した。これを第１表中にａ、ｂ、ｃ、ｄ等
の記号で示す処理工程により処理したうえでビッカース
硬さ、引張強度、伸び、導電率を測定し同表に記した。(Example) Alloys having various compositions shown in Table 1, 1 to 15, are jetted between rollers rotating at high speed, and rapidly solidified from a molten state at a rate of 500° C./second or more to a thickness of 0. 31 m-
A thin plate was created. These were treated in the treatment steps indicated by symbols a, b, c, d, etc. in Table 1, and their Vickers hardness, tensile strength, elongation, and electrical conductivity were measured and recorded in the same table.
また第２表は合金組成が本発明の範囲を外れた合金（−
１〜７）及び通常工程品（１１ｋ１８〜９）、特公昭６
０−４３８９５号の範囲内の合金（ｍｌＯ〜１２）につ
き、第１表に示したと同様の測定値を示したものである
。なお、３〜ｇの記号で示した処理工程の内容は第３表
にまとめて示した。Table 2 also shows alloys whose alloy compositions are outside the range of the present invention (-
1 to 7) and normal process products (11k18 to 9), Special Publication Showa 6
Measurements similar to those shown in Table 1 are shown for alloys within the range of No. 0-43895 (mlO~12). The contents of the treatment steps indicated by symbols 3 to g are summarized in Table 3.
第１表
第２表
第３表拠理工柵
（発明の効果）
本発明は以上の説明からも明らかなように、Ｂｅ含含量
量低くして地合せ価格を引下げるとともに、急冷凝固と
冷間加工と時効析出処理の組合せにより硬度、強度、導
電性、曲げ成形性等の導電ばね材ネ４に要求される緒特
性をバランス良く向上させることに成功、したものであ
るから、従来のＣｕ −Ｂｅ合金及び従来の急冷凝固合
金の問題点を一掃したものとして、産業の発展に寄与す
るところは極めて大きいものである。Table 1, Table 2, Table 3, Facing Rural Fence (Effects of the Invention) As is clear from the above description, the present invention lowers the Be content to lower the formation price, and also improves rapid solidification and cold solidification. By combining processing and aging precipitation treatment, we succeeded in improving the properties required for conductive spring materials 4, such as hardness, strength, conductivity, and bending formability, in a well-balanced manner. As it eliminates the problems of Be alloys and conventional rapidly solidified alloys, it will greatly contribute to the development of industry.
第１図はＣｕ −Ｂｅ −Ｎｉ系合金の３％Ｎ＋切断面
平衡状態図である。
Ｉｌ１図
乙−８ｃ−東糸Ｓｔ句３％連切叶千慟駿札図（ｌａ謁
ｒ ＮＬＢｅ相
３６粍
−東袷FIG. 1 is an equilibrium phase diagram of a 3% N+ cut surface of a Cu-Be-Ni alloy. Il1 Diagram Otsu-8c-Toito St 3% Renkiri Kano Chikyo Shunfuda (la audience) NLBe phase 36mm-Toban
Claims (1)
ｉ、Ｃｏの一方又は双方を合計量で０．５〜６．０％、
残部Ｃｕ及び不可避的不純物からなる急冷凝固組織中に
、加工による析出サイトを増加させ時効処理後の析出物
を均一微細に分散させてビッカース硬度３００以上、伸
び３％以上の特性を持たせたことを特徴とする高強度銅
基合金。 ２、Ｂｅ、Ｎｉ、Ｃｏの含有量をＢｅ０．４〜０．８％
、ＮｉとＣｏの合計量を２．０〜５．０％とした特許請
求の範囲第１項記載の高強度銅基合金。 ３、Ｂｅ、Ｎｉ＋Ｃｏの原子比を１：０．８〜１．２と
した特許請求の範囲第１項記載の高強度銅基合金。 ４、引張強度が１００ｋｇ／ｍｍ＾２以上、ビッカース
硬度が３５０以上である特許請求の範囲第１項記載の高
強度銅基合金。 ５、Ｂｅ０．１５〜１．０％、Ｎｉ、Ｃｏの一方又は双
方を合計量で０．５〜６．０％、残部Ｃｕ及び不可避的
不純物からなる合金を溶融状態から急冷凝固して結晶粒
度が０．２〜２５μｍの急冷凝固組織としたのち、９５
％以下の冷間加工を行い、更に時効析出処理により金属
間化合物を均一微細に析出させたことを特徴とする高強
度銅基合金の製造方法。 ６、急冷凝固を５００℃／秒以上の速度で行う特許請求
の範囲第５項記載の高強度銅基合金の製造方法。 ７、冷間加工ののち、５５０〜１０００℃の焼鈍又は溶
体化処理と８０％以下の冷間加工を行ったうえ２５０〜
５５０℃で時効析出処理を行う特許請求の範囲第５項記
載の高強度銅基合金の製造方法。[Claims] 1. Be 0.15-1.0% (weight %, same hereinafter), N
i, one or both of Co in a total amount of 0.5 to 6.0%,
By increasing the precipitation sites through processing and uniformly and finely dispersing the precipitates after aging treatment in the rapidly solidified structure consisting of the remaining Cu and unavoidable impurities, the material has the characteristics of a Vickers hardness of 300 or more and an elongation of 3% or more. A high-strength copper-based alloy characterized by 2. Be, Ni, Co content: Be0.4-0.8%
, the high-strength copper-based alloy according to claim 1, wherein the total amount of Ni and Co is 2.0 to 5.0%. 3. The high-strength copper-based alloy according to claim 1, wherein the atomic ratio of Be, Ni+Co is 1:0.8 to 1.2. 4. The high-strength copper-based alloy according to claim 1, which has a tensile strength of 100 kg/mm^2 or more and a Vickers hardness of 350 or more. 5. An alloy consisting of 0.15-1.0% Be, 0.5-6.0% total of one or both of Ni and Co, and the balance Cu and unavoidable impurities is rapidly solidified from a molten state to determine the grain size. After forming a rapidly solidified structure with a diameter of 0.2 to 25 μm, 95
A method for producing a high-strength copper-based alloy, characterized by performing cold working of less than %, and further precipitating intermetallic compounds uniformly and finely by aging precipitation treatment. 6. The method for producing a high-strength copper-based alloy according to claim 5, wherein the rapid solidification is performed at a rate of 500° C./second or more. 7. After cold working, annealing or solution treatment at 550 to 1000°C and cold working to 80% or less, and then 250 to 1000°C
The method for producing a high-strength copper-based alloy according to claim 5, wherein the aging precipitation treatment is performed at 550°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61043859A JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61043859A JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199743A true JPS62199743A (en) | 1987-09-03 |
| JPH0356295B2 JPH0356295B2 (en) | 1991-08-27 |
Family
ID=12675425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61043859A Granted JPS62199743A (en) | 1986-02-27 | 1986-02-27 | High strength copper alloy and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199743A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017250A (en) * | 1989-07-26 | 1991-05-21 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| US5039478A (en) * | 1989-07-26 | 1991-08-13 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| JPH05214465A (en) * | 1992-02-03 | 1993-08-24 | Nippon Steel Corp | Metallic sheet minimal in anisotropy of characteristic and excellent in spring limit value and strength and its production |
| WO2006103994A1 (en) | 2005-03-29 | 2006-10-05 | Ngk Insulators, Ltd. | Beryllium-copper, method and apparatus for producing beryllium-copper |
| EP1967597A3 (en) * | 2007-02-27 | 2012-04-11 | Fisk Alloy Wire, Inc. | Beryllium-Copper conductor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2857496B1 (en) | 2012-06-04 | 2017-07-12 | Ensuiko Sugar Refining Co., Ltd. | D-glucaric acid-producing bacterium, and method for manufacturing d-glucaric acid |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262932A (en) * | 1984-06-08 | 1985-12-26 | ブラツシユ ウエルマン インコ−ポレイテツド | Copper alloy |
-
1986
- 1986-02-27 JP JP61043859A patent/JPS62199743A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262932A (en) * | 1984-06-08 | 1985-12-26 | ブラツシユ ウエルマン インコ−ポレイテツド | Copper alloy |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017250A (en) * | 1989-07-26 | 1991-05-21 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| US5039478A (en) * | 1989-07-26 | 1991-08-13 | Olin Corporation | Copper alloys having improved softening resistance and a method of manufacture thereof |
| US5336342A (en) * | 1989-07-26 | 1994-08-09 | Olin Corporation | Copper-iron-zirconium alloy having improved properties and a method of manufacture thereof |
| JPH05214465A (en) * | 1992-02-03 | 1993-08-24 | Nippon Steel Corp | Metallic sheet minimal in anisotropy of characteristic and excellent in spring limit value and strength and its production |
| WO2006103994A1 (en) | 2005-03-29 | 2006-10-05 | Ngk Insulators, Ltd. | Beryllium-copper, method and apparatus for producing beryllium-copper |
| EP1870480A1 (en) * | 2005-03-29 | 2007-12-26 | Ngk Insulators, Ltd. | Beryllium-copper, method and apparatus for producing beryllium-copper |
| EP1870480A4 (en) * | 2005-03-29 | 2009-07-08 | Ngk Insulators Ltd | Beryllium-copper, method and apparatus for producing beryllium-copper |
| US7976652B2 (en) | 2005-03-29 | 2011-07-12 | Ngk Insulators, Ltd. | Method for producing beryllium-copper |
| JP5213022B2 (en) * | 2005-03-29 | 2013-06-19 | 日本碍子株式会社 | Beryllium copper, beryllium copper manufacturing method and beryllium copper manufacturing apparatus for manufacturing the beryllium copper |
| EP1967597A3 (en) * | 2007-02-27 | 2012-04-11 | Fisk Alloy Wire, Inc. | Beryllium-Copper conductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356295B2 (en) | 1991-08-27 |
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