JPS62192699U - - Google Patents

Info

Publication number
JPS62192699U
JPS62192699U JP8154986U JP8154986U JPS62192699U JP S62192699 U JPS62192699 U JP S62192699U JP 8154986 U JP8154986 U JP 8154986U JP 8154986 U JP8154986 U JP 8154986U JP S62192699 U JPS62192699 U JP S62192699U
Authority
JP
Japan
Prior art keywords
circuit board
flexible
flexible circuit
bending
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8154986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8154986U priority Critical patent/JPS62192699U/ja
Publication of JPS62192699U publication Critical patent/JPS62192699U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の一実施例に従つて構成され
た可撓性回路基板の屈曲部シールド構造の概念的
な部分切欠展開平面構成図、第２図は、第１図の
シールド部を屈曲可撓部に重ねてその両端部を部
分的に接合した状態の側面概観図、そして、第３
図は、この可撓性回路基板の屈曲使用態様の一例
を説明する為の図である。 １：回路基板本体、２：シールド部、３：絶縁
ベースシート、４：回路配線パターン、５：連設
部、６：シールドパターン、７：表面保護層、８
：接続部又は実装部、９：接合用粘着剤。 FIG. 1 is a conceptual partially cutaway developed plan configuration diagram of a bending part shield structure of a flexible circuit board constructed according to an embodiment of the present invention, and FIG. 2 shows the shield part of FIG. 1. A side schematic view of a state in which the bending flexible part is overlapped and both ends thereof are partially joined, and a third
The figure is a diagram for explaining an example of a bending usage mode of this flexible circuit board. 1: Circuit board body, 2: Shield part, 3: Insulating base sheet, 4: Circuit wiring pattern, 5: Continuous part, 6: Shield pattern, 7: Surface protective layer, 8
: Connection part or mounting part, 9: Bonding adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 屈曲可撓部とその両端に形成された接続部又は
実装部とを有する可撓性回路基板に於いて、上記
屈曲可撓部の配線パターンをシールドする為のシ
ールド部を備え、該シールド部の両端部のみを上
記屈曲可撓部と接続部又は実装部との各移行部に
それぞれ接合するように構成したことを特徴とす
る可撓性回路基板の屈曲部シールド構造。 A flexible circuit board having a bendable flexible part and connection parts or mounting parts formed at both ends of the flexible circuit board includes a shield part for shielding the wiring pattern of the bendable flexible part; 1. A bending part shield structure for a flexible circuit board, characterized in that only both ends are connected to respective transition parts between the bending flexible part and the connecting part or the mounting part.
JP8154986U 1986-05-29 1986-05-29 Pending JPS62192699U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8154986U JPS62192699U (en) 1986-05-29 1986-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8154986U JPS62192699U (en) 1986-05-29 1986-05-29

Publications (1)

Publication Number Publication Date
JPS62192699U true JPS62192699U (en) 1987-12-08

Family

ID=30933390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8154986U Pending JPS62192699U (en) 1986-05-29 1986-05-29

Country Status (1)

Country Link
JP (1) JPS62192699U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327097U (en) * 1986-08-04 1988-02-22
JPH0288264U (en) * 1988-12-27 1990-07-12
JP2017022173A (en) * 2015-07-07 2017-01-26 日本メクトロン株式会社 Elastic conductive substrate and elastic conductive laminate
JP2021085961A (en) * 2019-11-27 2021-06-03 キヤノン株式会社 Electronic apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529276U (en) * 1978-08-16 1980-02-26
JPS5819415B2 (en) * 1977-03-09 1983-04-18 株式会社ソディック Electrical discharge machining method and equipment
JPS5936270B2 (en) * 1978-12-02 1984-09-03 リヒヤルト・ヒルシユマン・ラデイオテヒニツシエス・ヴエルク An acoustic signal generator that generates an output signal whose frequency changes periodically
JPS60160684A (en) * 1984-01-31 1985-08-22 ソニーケミカル株式会社 Electromagnetically shileded printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819415B2 (en) * 1977-03-09 1983-04-18 株式会社ソディック Electrical discharge machining method and equipment
JPS5529276U (en) * 1978-08-16 1980-02-26
JPS5936270B2 (en) * 1978-12-02 1984-09-03 リヒヤルト・ヒルシユマン・ラデイオテヒニツシエス・ヴエルク An acoustic signal generator that generates an output signal whose frequency changes periodically
JPS60160684A (en) * 1984-01-31 1985-08-22 ソニーケミカル株式会社 Electromagnetically shileded printed circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327097U (en) * 1986-08-04 1988-02-22
JPH0288264U (en) * 1988-12-27 1990-07-12
JP2017022173A (en) * 2015-07-07 2017-01-26 日本メクトロン株式会社 Elastic conductive substrate and elastic conductive laminate
JP2021085961A (en) * 2019-11-27 2021-06-03 キヤノン株式会社 Electronic apparatus

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