JPS62192693U - - Google Patents

Info

Publication number
JPS62192693U
JPS62192693U JP8035786U JP8035786U JPS62192693U JP S62192693 U JPS62192693 U JP S62192693U JP 8035786 U JP8035786 U JP 8035786U JP 8035786 U JP8035786 U JP 8035786U JP S62192693 U JPS62192693 U JP S62192693U
Authority
JP
Japan
Prior art keywords
metal foils
electronic component
circuit board
printed circuit
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8035786U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8035786U priority Critical patent/JPS62192693U/ja
Publication of JPS62192693U publication Critical patent/JPS62192693U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本考案の一実施例を示す図、
第３図は金属箔の斜視図を示す図、第４図は従来
の電子部品放熱構造を示す図である。 図中、１はＩＣ、２は放熱板、３はプリント基
板、４は筐体、５，６は金属箔、７はスルーホー
ルである。 FIGS. 1 and 2 are diagrams showing an embodiment of the present invention,
FIG. 3 is a perspective view of the metal foil, and FIG. 4 is a diagram showing a conventional electronic component heat dissipation structure. In the figure, 1 is an IC, 2 is a heat sink, 3 is a printed circuit board, 4 is a housing, 5 and 6 are metal foils, and 7 is a through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板における電子部品実装部位の表裏
面に金属箔を形成し、該夫々の金属箔を接続する
とともに、一方の金属箔上に前記電子部品を実装
し、他方の金属箔を筐体に接触させてなることを
特徴とする電子部品の放熱構造。 Metal foils are formed on the front and back surfaces of the electronic component mounting area on the printed circuit board, the respective metal foils are connected, and the electronic component is mounted on one of the metal foils, and the other metal foil is brought into contact with the casing. A heat dissipation structure for electronic components that is characterized by
JP8035786U 1986-05-27 1986-05-27 Pending JPS62192693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8035786U JPS62192693U (en) 1986-05-27 1986-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8035786U JPS62192693U (en) 1986-05-27 1986-05-27

Publications (1)

Publication Number Publication Date
JPS62192693U true JPS62192693U (en) 1987-12-08

Family

ID=30931090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8035786U Pending JPS62192693U (en) 1986-05-27 1986-05-27

Country Status (1)

Country Link
JP (1) JPS62192693U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739596A (en) * 1980-08-21 1982-03-04 Tokyo Shibaura Electric Co Printed cirucit board
JPS5726895B2 (en) * 1976-10-01 1982-06-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726895B2 (en) * 1976-10-01 1982-06-07
JPS5739596A (en) * 1980-08-21 1982-03-04 Tokyo Shibaura Electric Co Printed cirucit board

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