JPS62190342U - - Google Patents
Info
- Publication number
- JPS62190342U JPS62190342U JP1986078042U JP7804286U JPS62190342U JP S62190342 U JPS62190342 U JP S62190342U JP 1986078042 U JP1986078042 U JP 1986078042U JP 7804286 U JP7804286 U JP 7804286U JP S62190342 U JPS62190342 U JP S62190342U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor device
- mounting
- flexible wiring
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図から第３図はこの考案の一実施例を示し
、第１図は配線基板の要部底面図、第２図はその
Ａ―Ａ断面図、第３図は配線基板に半導体素子を
接続した状態の断面図、第４図から第６図は従来
例を示し、第４図はその配線基板の断面図、第５
図は配線基板に半導体素子を接続した状態の断面
図、第６図は他の接続状態を示す断面図である。
１……配線基板、２……バンプ、３……配線パ
ターン、５……半導体素子、６……電極パツド、
１０……スペーサ。
Figures 1 to 3 show an embodiment of this invention; Figure 1 is a bottom view of the main parts of a wiring board, Figure 2 is a sectional view taken along line AA, and Figure 3 shows semiconductor elements mounted on a wiring board. 4 to 6 show a conventional example, and FIG. 4 is a sectional view of the wiring board, and FIG.
The figure is a cross-sectional view of a state in which a semiconductor element is connected to a wiring board, and FIG. 6 is a cross-sectional view showing another connection state. 1... Wiring board, 2... Bump, 3... Wiring pattern, 5... Semiconductor element, 6... Electrode pad,
10...Spacer.
Claims (1)
位置にバンプの形成された半導体素子搭載用フレ
キシブル配線基板において、 少なくとも前記半導体素子のエツジ部と対応す
る部分にスペーサを設けたことを特徴とする半導
体素子搭載用フレキシブル配線基板。[Claims for Utility Model Registration] A flexible wiring board for mounting a semiconductor device in which bumps are formed at positions corresponding to the electrode pads of the semiconductor device to be mounted, in which a spacer is provided at least in a portion corresponding to the edge portion of the semiconductor device. A flexible wiring board for mounting semiconductor elements, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986078042U JPS62190342U (en) | 1986-05-26 | 1986-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986078042U JPS62190342U (en) | 1986-05-26 | 1986-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190342U true JPS62190342U (en) | 1987-12-03 |
Family
ID=30926616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986078042U Pending JPS62190342U (en) | 1986-05-26 | 1986-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190342U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02226736A (en) * | 1989-02-28 | 1990-09-10 | Sony Corp | Wiring board |
| WO2000002243A1 (en) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Semiconductor device, method of manufacture, circuit board, and electronic device |
-
1986
- 1986-05-26 JP JP1986078042U patent/JPS62190342U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02226736A (en) * | 1989-02-28 | 1990-09-10 | Sony Corp | Wiring board |
| WO2000002243A1 (en) * | 1998-07-01 | 2000-01-13 | Seiko Epson Corporation | Semiconductor device, method of manufacture, circuit board, and electronic device |