JPS62188677A - Electrocast sharp edged abrasive wheel - Google Patents
Electrocast sharp edged abrasive wheelInfo
- Publication number
- JPS62188677A JPS62188677A JP2634686A JP2634686A JPS62188677A JP S62188677 A JPS62188677 A JP S62188677A JP 2634686 A JP2634686 A JP 2634686A JP 2634686 A JP2634686 A JP 2634686A JP S62188677 A JPS62188677 A JP S62188677A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive wheel
- board
- layer
- electrocast
- sharp edged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 229910003286 Ni-Mn Inorganic materials 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 229910003460 diamond Inorganic materials 0.000 abstract description 5
- 239000010432 diamond Substances 0.000 abstract description 5
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 5
- 239000006061 abrasive grain Substances 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000005238 degreasing Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 238000004080 punching Methods 0.000 abstract description 2
- 238000005406 washing Methods 0.000 abstract description 2
- 230000001680 brushing effect Effects 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 238000000227 grinding Methods 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 10
- 238000003754 machining Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229910000914 Mn alloy Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910018062 Ni-M Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
コノ発明は、特に高い精度を要求されるシリコンやフェ
ライト等の切断や?14加工に用いて好適な電鋳薄刃砥
石に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention is applicable to the cutting of silicon, ferrite, etc., which require particularly high precision. The present invention relates to an electroformed thin blade grindstone suitable for use in No. 14 processing.
[従来の技術]
例えば、シリコン、GaAs、フェライト等の電子材料
あるいはセラミックス、水晶、ガラス等の硬脆材料に、
高い精度による切断加工や溝加工を施す場合には、一般
に金属メッキ層内に超砥粒を分散さ仕てなる電鋳薄刃砥
石と呼ばれる薄刃砥石が用いられている。[Prior Art] For example, electronic materials such as silicon, GaAs, and ferrite, or hard and brittle materials such as ceramics, crystal, and glass,
When cutting or grooving with high precision, a thin-blade grindstone called an electroformed thin-blade grindstone, which has superabrasive grains dispersed within a metal plating layer, is generally used.
図は従来のこの種の電鋳薄刃砥石を示すもので、この電
鋳薄刃砥石1は、Niからなる金属メッキ層内にダイヤ
モンドやCBS等の超砥粒を分散させることによって形
成された、厚さ数十μm〜数百μmの輪環板状のもので
ある。The figure shows a conventional electroformed thin-blade grindstone of this type. It has an annular plate shape with a length of several tens of micrometers to several hundred micrometers.
そして、上記電鋳薄刃砥石!は、両側面に配設された一
対の取付用フランジ2.2間に挾まれたうえ、ナツト3
により軸線回りに回転する砥石軸4に締付は固定されて
使用に供される。And the above electroformed thin blade whetstone! is sandwiched between a pair of mounting flanges 2.2 provided on both sides, and is also fitted with a nut 3.
The grindstone shaft 4, which rotates around its axis, is fastened and ready for use.
[発明が解決しようとする問題点]
ところが、上記従来の電鋳薄刃砥石lにあっては、例え
ば外径51φmm、内径40φmmおよび厚さ0゜01
5mmの各部寸法に形成したらのでシリコンウエハのダ
イシングを行うと、通常刃先部か摩耗して砥石寿命に至
る以萌に、上記取付用フランジ2の外周縁との当接部1
a11aにおいて円環状の割れを生じ、二の結果使用で
きなくなってしまうという問題点があった。[Problems to be Solved by the Invention] However, in the conventional electroformed thin-blade grindstone l described above, for example, the outer diameter is 51φmm, the inner diameter is 40φmm, and the thickness is 0°01mm.
When the silicon wafer is diced after each part has been formed to a size of 5 mm, the cutting edge usually wears out and the life of the grinding wheel ends.
There was a problem that an annular crack was generated in a11a, and as a result, it became unusable.
また、例えば外径100φmm、内径40φmmおよび
厚さ0.2111mの各部寸法に形成したもので磁気ヘ
ッド用のフェライトの溝加工を行うと、刃先部が曲 ゛
がってその加工精度が低下してしまうという問題点があ
った。加えて、いずれの用途に用いた場合にも砥石摩耗
が早く、よってその使用寿命が短いという問題点があっ
た。Furthermore, when grooving a ferrite for a magnetic head using a tool formed to dimensions of, for example, an outer diameter of 100 φmm, an inner diameter of 40 φmm, and a thickness of 0.2111 m, the cutting edge becomes bent and the processing accuracy decreases. There was a problem with it being put away. In addition, when used for any purpose, the grinding wheel wears out quickly, resulting in a short service life.
そこで、本発明者等は、これらの問題点を解消すべく鋭
意研究を重ねた結果、上記問題点が主として上記金属メ
ッキ層を形成するNiの耐疲労性および結合相としての
剛性や機械的強度が充分でないことに起因すること、並
びにその刃先部が加工時に摩擦熱で高温に達するにも拘
わらずその耐熱性が充分でないことが上記問題点の発生
を一層助長していることを解明した。Therefore, as a result of intensive research to solve these problems, the present inventors have found that the above problems are mainly due to the fatigue resistance of Ni forming the metal plating layer and the stiffness and mechanical strength as a binder phase. It has been found that the occurrence of the above problems is further exacerbated by the fact that the heat resistance is insufficient even though the cutting edge reaches high temperatures due to frictional heat during machining.
加えて、電気Niメッキの場合においては、通常メッキ
膜の内部応力を小さくするためにN1メッキ液にサッカ
リンNa等の応力減少剤(イオウ化合物)が添加される
。そしてこの応力減少剤はメッキの進行に従って徐々に
僅がづつ電気分解され、その分解生成物であるイオウが
上記Niメッキ膜中に共析してくる。ところが、この微
mのイオウを含む合金は、200℃以上に加熱されると
結晶粒界にN i −Sの金属間化合物を形成し非常に
脆くなる。他方、砥石刃先部は研削熟により高温に達す
るため、以上の結果から上述した脆化現象が助長されて
上記砥石の摩耗が促進されると考えた。In addition, in the case of electrolytic Ni plating, a stress reducing agent (sulfur compound) such as saccharin Na is usually added to the N1 plating solution in order to reduce the internal stress of the plating film. This stress reducing agent is gradually electrolyzed as the plating progresses, and sulfur, a decomposition product, is eutectoided into the Ni plating film. However, when this alloy containing a minute amount of sulfur is heated to 200° C. or higher, an intermetallic compound of Ni-S is formed at the grain boundaries and becomes extremely brittle. On the other hand, since the cutting edge of the grinding wheel reaches a high temperature due to ripening, it was considered from the above results that the above-mentioned embrittlement phenomenon was promoted and the wear of the grinding wheel was accelerated.
そして、さらに本発明者等は、上記金属メッキ層として
Ni−Mnを用いた場合に、上記取付用フランジ2との
当接部1aにおける割れの発生を低下させるとと乙に砥
石寿命を向上させることができ、しかもその脆化現象を
助長するNi−8の金属間化合物の形成を抑えることが
できて上記問題点を効果的に改善することができるとい
う知見を得るに至った。Furthermore, the present inventors have found that when Ni-Mn is used as the metal plating layer, the occurrence of cracks at the contact portion 1a with the mounting flange 2 can be reduced, and the life of the grinding wheel can be improved. It has been found that the above problems can be effectively improved by suppressing the formation of Ni-8 intermetallic compounds that promote the embrittlement phenomenon.
[発明の目的コ
この発明は、上記知見に基づいてなされたもので、耐熱
性および耐疲労性に優れてその使用寿命が長く、加えて
高い加工精度を得ることができる電鋳薄刃砥石を提供す
ることを目的とするものである。[Purpose of the Invention] This invention was made based on the above knowledge, and provides an electroformed thin-blade grindstone that has excellent heat resistance and fatigue resistance, has a long service life, and can obtain high machining accuracy. The purpose is to
[問題点を解決するための手段]
この発明の電鋳薄刃砥石は、Ni−Mn合金メッキ層内
に超砥粒を分散さ什たらのである。[Means for Solving the Problems] The electroformed thin-blade grindstone of the present invention has superabrasive grains dispersed within the Ni-Mn alloy plating layer.
[実施例]
以下、この発明の電鋳薄刃砥石の第一実施例について、
その製造方法の一例に基づいて詳細に説明する。[Example] Hereinafter, a first example of the electroformed thin blade grindstone of the present invention will be described.
A detailed explanation will be given based on an example of the manufacturing method.
先ず、メッキされる金属に対して剥離性を有する基板の
表面に砥石の原型形状をなす部分を残してマスキングを
施した後、脱脂等の清浄化処理を施す。次に、この入(
板の表面に、ダイヤモンド等の超砥粒を分散させたNi
基を含む電気メツキ液を用いて、N i −M n合金
メッキ層内に上記超砥粒を分散させた砥石層を形成する
。First, the surface of the substrate, which is removable from the metal to be plated, is masked leaving a portion forming the prototype shape of the grindstone, and then a cleaning process such as degreasing is performed. Next, this input (
Ni with super abrasive grains such as diamond dispersed on the surface of the plate
A grindstone layer in which the superabrasive grains are dispersed within the Ni-Mn alloy plating layer is formed using an electroplating solution containing a base.
ここで、上記Ni−Mn合金メッキ層内におけるMnの
含有mとしては、0.005wt%以上で1.Owj%
以下とすることが望ましい。すなわち、上記Mnの含有
量が0,005wt%に満たないと、充分な耐熱性、耐
疲労性およびNi−5の形成の抑制効果を得ることがで
きず、また1、0wt%を超えてらそれに見合う効果を
得ろことかできないからである。Here, the Mn content m in the Ni-Mn alloy plating layer is 0.005 wt% or more and 1. Owj%
The following is desirable. That is, if the Mn content is less than 0,005 wt%, sufficient heat resistance, fatigue resistance, and Ni-5 formation suppression effect cannot be obtained, and if it exceeds 1.0 wt%, This is because you can only get the desired effect.
また、上記Ni−Mn合金メッキ層内における上記超砥
粒の含有率としてはIO〜50vol%であることが望
ましい。ずなわち、上記超砥粒の含有率がlovol%
に満たないと切れ味が低下するとともに使用寿命が短く
なり、他方50vol%を超えろと金属メッキ層を形成
する金属が相対的に減少して砥石強度および超砥粒の保
持力か低下し、相応の研削比が得られず不経済になって
しまうからである。Further, the content of the superabrasive grains in the Ni--Mn alloy plating layer is preferably IO to 50 vol%. That is, the content of the superabrasive grains is lovol%.
If it is less than 50 vol%, the sharpness will deteriorate and the service life will be shortened, while if it exceeds 50 vol%, the metal forming the metal plating layer will be relatively reduced, and the strength of the grinding wheel and the holding power of the superabrasive will decrease, and the This is because the grinding ratio cannot be obtained and it becomes uneconomical.
そして次に、このようにして砥石層を形成した基板にブ
ラツノング等を含む水洗処理を施した後、この基板から
上記砥石層を剥離ケる。次いて、得られた砥石層をパン
チング加工等により円形の砥石形状に成型し、さらに真
円に加工して電鋳薄刃砥石を得る。Next, the substrate on which the whetstone layer has been formed in this way is subjected to a water washing treatment including a cleaning agent, and then the abrasive layer is peeled off from the substrate. Next, the obtained whetstone layer is formed into a circular whetstone shape by punching or the like, and further processed into a perfect circle to obtain an electroformed thin-blade whetstone.
しかして、このようにしてivられた電鋳薄刃砥石にあ
っては、超砥粒を保持する金属メッキ層としてNi−M
n合金メッキ層を用いているので、耐疲労性および耐熱
性を大幅に向上させることができ、しかもNi−5等の
金属間化合物の形成を抑えることができるため、よって
取付用フランジとの当接部での割れの発生を大幅に減少
させることができる。また、これと同時に高い機械的強
度ら得ることができるため、例えば溝加工等に用いた場
合にも、刃先部が曲がってその加工精度の低下を招くこ
とがなく優れた加工精度を得ることができる。さらに、
耐熱性が向上した結果刃先部における耐摩耗性が向上し
、上述した効果と相まって長い砥石寿命を得ることがで
きる。However, in the electroformed thin-blade grindstone produced in this way, Ni-M is used as the metal plating layer that holds the superabrasive grains.
Since the n-alloy plating layer is used, fatigue resistance and heat resistance can be greatly improved, and the formation of intermetallic compounds such as Ni-5 can be suppressed, so there is no contact with the mounting flange. The occurrence of cracks at the joint can be significantly reduced. In addition, since high mechanical strength can be obtained at the same time, even when used for groove machining, for example, excellent machining accuracy can be obtained without causing the cutting edge to bend and reducing machining accuracy. can. moreover,
As a result of the improved heat resistance, the wear resistance at the cutting edge is improved, and in combination with the above-mentioned effects, a long grinding wheel life can be obtained.
[実験例〕
不働態化皮膜が形成されたステンレス鋼からなる基板の
表面に、以下の条件で電気メッキを施して、ダイヤモン
ドの含(Tmが31vol%でNiの金属メッキ層内に
Mnを含む砥石層(厚さ100μm)を形成した。[Experiment example] Electroplating was performed on the surface of a stainless steel substrate on which a passivation film was formed under the following conditions, and diamond-containing (Tm was 31 vol% and Mn was included in the Ni metal plating layer) was electroplated under the following conditions. A grindstone layer (thickness: 100 μm) was formed.
(イ)電気メツキ液の組成
スルファミン酸N i+ 4509IQ、 塩化N
i: 10@/(!。(a) Composition of electroplating solution Sulfamic acid Ni+ 4509IQ, N chloride
i: 10@/(!.
スルファミン酸M n: 25g/(!、 ホウ酸:
309/Q、、応力減少剤、光沢剤、ピット防止剤:
3少量、超砥粒の種類・ダイヤモンド、
超砥粒の粒径:5〜IOμm、
超砥粒の液中濃度: 2009/Q、 P I−1・
4.0(ロ)メッキ条件
浴温:50℃、 陰極電流密度:3A/dm’メッキ
時間:130分間、
次に、上記堰板から砥石層を剥離し、この砥石層を放電
加工によって輪環板状の砥石形状に成型したのち、さら
にその外周部を研削して真円加工を施し、外径が100
φa++aで厚さがO,1mmである上記第一実施例に
示した電鋳薄刃砥石(本発明例1)を作成した。Sulfamic acid Mn: 25g/(!, Boric acid:
309/Q, stress reducer, brightener, pit preventer:
3 Small amount, type of superabrasive: diamond, particle size of superabrasive: 5~IOμm, concentration of superabrasive in liquid: 2009/Q, P I-1・
4.0 (b) Plating conditions Bath temperature: 50°C, cathode current density: 3A/dm' Plating time: 130 minutes Next, the grindstone layer was peeled off from the above weir plate, and this grindstone layer was formed into a ring by electrical discharge machining. After forming it into a plate-like whetstone shape, the outer periphery is further ground to create a perfect circle, with an outer diameter of 100 mm.
An electroformed thin-blade grindstone (Example 1 of the present invention) shown in the above first example having a diameter of φa++a and a thickness of 0.1 mm was produced.
さらに、比較のために従来例として、同様の寸法に形成
された金属メッキ層がNiのみからなる電鋳薄刃砥石(
従来例1)を作成した。Furthermore, for comparison, as a conventional example, an electroformed thin-blade grindstone (
Conventional example 1) was created.
次に、以上と同様の製造方法で、それぞれダイヤモンド
の粒径が4〜6μmで外径が50φlllInで厚さが
0.02+nmである2種類の電鋳薄刃砥石(本発明例
2、従来例2)を作成した。Next, using the same manufacturing method as above, two types of electroformed thin-blade grindstones (invention example 2, conventional example 2) each having a diamond grain size of 4 to 6 μm, an outer diameter of 50φlllIn, and a thickness of 0.02+nm were manufactured. )It was created.
そして、これら各々2種類の電鋳薄刃砥石で、以下の条
件によるガラスあるいはノリコンウェハの研削試験を行
った。Using each of these two types of electroformed thin-blade grindstones, a glass or Noricon wafer grinding test was conducted under the following conditions.
第1表および第2表は、それぞれ上記各2種類の電鋳薄
刃砥石の各寸法、組成およびそれぞれの試験結果を示す
ものである。Tables 1 and 2 show the dimensions, compositions, and test results of the two types of electroformed thin-blade grindstones, respectively.
(以下、余白) 研削条件 彼削材 ニガラス、 砥石周速 :1500 m/min 刃先突出しl:3mm、 送り速度 200 mm/min 切込み量 : 2mm。(Hereafter, margin) Grinding conditions: Grinding material: Nigarasu, Grinding wheel peripheral speed: 1500 m/min Blade tip protrusion l: 3mm, Feed speed 200mm/min Depth of cut: 2mm.
研削液 : 水溶性
第2表
切削条件 被削材 : シリコンウェハ砥石回転数:
30.Goo r、P、m。Grinding fluid: Water soluble Table 2 Cutting conditions Work material: Silicon wafer Grinding wheel rotation speed:
30. Goo r, P, m.
刃先突出し量: 0.4 as
送り速度: 200 mm/win
切込みMl: 0.15aug
研削液 : 水
[発明の効果]
以上説明したように、この発明のm鋳薄刃砥石はN i
−M n合金メッキ層内に超砥粒を分散させた乙ので
あるので耐熱性才jよび耐疲労性等に優れ、しかしその
脆化を助長4゛る金属間化合物の形成を抑制ずろことが
できろ。これにより、長期に亙って使用ケろことかでき
るととらに、さらに高い加工精度をも得ることができる
。Amount of cutting edge protrusion: 0.4 as Feed rate: 200 mm/win Depth of cut Ml: 0.15 aug Grinding fluid: Water [Effects of the invention] As explained above, the m cast thin blade grindstone of this invention has Ni
- Since superabrasive grains are dispersed within the Mn alloy plating layer, it has excellent heat resistance and fatigue resistance, but it may inhibit the formation of intermetallic compounds that promote embrittlement. You can do it. This allows for long-term use and even higher processing accuracy.
図は、砥石軸に固定された従来の電鋳薄刃砥石を示す概
略側断面図である。The figure is a schematic side sectional view showing a conventional electroformed thin-blade grindstone fixed to a grindstone shaft.
Claims (3)
超砥粒を分散させてなることを特徴とする電鋳薄刃砥石
。(1) An electroformed thin-blade whetstone characterized by having a thin plate shape and having superabrasive grains dispersed within a Ni-Mn alloy plating layer.
〜1.0wt%含むことを特徴とする特許請求の範囲第
1項記載の電鋳薄刃砥石。(2) The Ni-Mn alloy plating layer has Mn of 0.005
The electroformed thin blade grindstone according to claim 1, characterized in that it contains ~1.0 wt%.
粒の含有率が10〜50vol%であることを特徴とす
る特許請求の範囲第1項又は第2項記載の電鋳薄刃砥石
。(3) The electroformed thin-blade grindstone according to claim 1 or 2, wherein the content of the superabrasive grains in the Ni-Mn alloy plating layer is 10 to 50 vol%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2634686A JPH0683962B2 (en) | 1986-02-08 | 1986-02-08 | Electroformed thin blade grindstone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2634686A JPH0683962B2 (en) | 1986-02-08 | 1986-02-08 | Electroformed thin blade grindstone |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62188677A true JPS62188677A (en) | 1987-08-18 |
JPH0683962B2 JPH0683962B2 (en) | 1994-10-26 |
Family
ID=12190885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2634686A Expired - Lifetime JPH0683962B2 (en) | 1986-02-08 | 1986-02-08 | Electroformed thin blade grindstone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0683962B2 (en) |
-
1986
- 1986-02-08 JP JP2634686A patent/JPH0683962B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0683962B2 (en) | 1994-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |