JPS62186650A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To obtain a solid-state image pickup element with no optical adjustment, very short optical path and low cost by sending optical information to the solid-state image pickup element through the optical guide path close to the solid-state image pickup element having photoelectric transducing elements arranged linearly. CONSTITUTION:The solid-state image pickup element 204 consists of photoelectric transducing elements 203 arranged linearly and the optical guide path 202 close to the element 204. In case an original 201 is white, in the light transmitting through the original from a light source 200, only the light through the white light transmitting part of the optical guide path 202 reaches the elements 203. In case an original 201' is black, the light attenuated by an black original reaches the element 203 through the optical guide path 202 to read the original. In this case, the light transmitting part of the optical guide path 202 has the area of the elements 203 or below to prevent the leakage of the light of adjacent photoelectric transducing elements thereby preventing the deterioration in the resolution. Further, the optical guide path 202 consists of the white light transmitting part and the light untransmitting part shown in hatched lines.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はレンズが不必要な＠着像の固体撮隊装牧に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-state imaging system that does not require a lens.

〔発明の概要〕[Summary of the invention]

本発明はレンズを用いて固体撮鍬素子上に結はさせる固
体撮像装置の方式と異なり、鍬の元情報を先導波路内で
、直接固本撮泳素子に送るもので、固体撮は素子の画素
（光電ｆ換素子）の面積以下■光透過部分（４０２）を
通してｙｔ、情報を込り、該元情報が所定Ｑ光透過部分
からもれない様に、光不透過な部分（４０１）７＆：設
けたこと全特徴としたも０である。The present invention differs from a solid-state imaging device that uses a lens to focus on a solid-state imaging device, in which the original information of the imaging device is sent directly to a solid-state imaging device within a guiding wavepath. Less than the area of the pixel (photoelectric f conversion element) yt, information is included through the light-transmitting part (402), and the light-impermeable part (401) 7& is included so that the original information does not leak from the predetermined Q light-transmitting part : All features provided are 0.

〔従来の技術〕[Conventional technology]

従来、密着型■固体逢慮装置は嶋４図に示す様に、５Ｙ
、源１０２２等倍正立実鍬が得られるレンズ１０３、及
び、固体撮像素子１０４で開成され。Conventionally, the close-contact type solid-state mixing device is 5Y as shown in Figure 4.
, a source 1022, a lens 103 that can obtain an erect image at the same magnification, and a solid-state image sensor 104.

通常、＃光源１０２としてＬＥＤアレイ光源、該レンズ
１０３としてはセル７オツクレンズ（日本板硝子法式会
社商標）、該固本撮隊素子としては硫化カドミウムや非
晶質シリコンなどｔ光電変換素子として１次元に配クリ
した固体撮は１０４が用いられている。１０１は原稿を
示す。Usually, the light source 102 is an LED array light source, the lens 103 is a cell 7 lens (trademark of Nippon Sheet Glass Co., Ltd.), and the solid-state camera element is a one-dimensional photoelectric conversion element such as cadmium sulfide or amorphous silicon. 104 is used for solid-state photography. 101 indicates a manuscript.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来、以下の嫌な問題点を仔していた。 In the past, the following unpleasant problems were encountered.

ω　レンズ１０３を用いて、固体撮＠素子１０４上に結
縁させるため、原稿１０１．レンズ及び固体撮像素子の
位置決めに、高精度を要し、光学調整が必要である。ω Using the lens 103, the original 101. High precision is required for positioning the lens and solid-state image sensor, and optical adjustment is required.

（２）　　レンズを用ハるため、光路長を最少でも１４
ｍ程度有し、又、光路長を少さくすると（１４ｓｎ−２
０、）色収差が大きく、単色光源しか用＾ることかでき
ない。(2) Optical path length should be at least 14 mm due to lens usage.
m, and if the optical path length is shortened (14sn-2
0,) Chromatic aberration is large and only a monochromatic light source can be used.

（３）　　密着型の固体撮は装置は光源１０１．レンズ
１０２、固体撮は素子１０３．外枠１０５がすべて原稿
長と同寸か、それ以上大きく、低コスト化が離しい、￥
ｉに、該レンズ１０２が高コストである。(3) For close-contact solid-state imaging, the device uses a light source 101. Lens 102, solid-state imaging element 103. All the outer frames 105 are the same size as the document length or larger, and the cost is much lower.
i. The lens 102 is expensive.

本発明はかかる問題点を除去するもＯで、その目的は光
学調整が不要で、光路長■甑めて短ｉ１低コストな固体
機縁装＃を提供することにある。The purpose of the present invention is to eliminate such problems, and to provide a solid-state device that does not require optical adjustment, has a short optical path length, and is low in cost.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は一次元に配列したｙｔ、電変換素子を有する固
体撮像素子と、該固体撮は素子と密接した光導波路から
成り、該光導波路を通して、光情報を該固体撮は素子へ
送る。レンズ不要の固体機縁装置である。The present invention comprises a solid-state imaging device having electric conversion elements arranged in one dimension, and an optical waveguide in close contact with the solid-state imaging device, through which optical information is sent to the solid-state imaging device. It is a solid-state device that does not require a lens.

〔作用〕[Effect]

第１図は本発明の固体撮像装置の断面溝部を示したもの
で、以下、第１図を用いて本発明の原理を示す、２００
は光源、２０１，２０１’はそれぞれ読み取り原稿で、
白及び黒の状態である。２０２は光導波路で、該光導波
路は光が不透過な部分（斜線部）と光透過性の部分（白
い部分）から成る。２０４は固体撮像素子、２０３は該
固体撮像素子内の光電変換索子、矢印は紙送り方向を示
す。FIG. 1 shows the cross-sectional groove of the solid-state imaging device of the present invention, and hereinafter, the principle of the present invention will be explained using FIG.
is the light source, 201 and 201' are the originals to be read,
The state is white and black. Reference numeral 202 denotes an optical waveguide, which consists of a light-opaque portion (hatched portion) and a light-transmissive portion (white portion). 204 is a solid-state image sensor, 203 is a photoelectric conversion element within the solid-state image sensor, and the arrow indicates the paper feeding direction.

嬉１図（ロ）に示す様に、原稿が白の場合、原稿を透過
した光は光導波路２０２の光透過性の部分Ｏみの光が光
電変換索子２０３に到達する、又、第１図（ｂ）　Ｋ示
す様に、原稿が黒の場合、黒の原稿で減光された元が光
導波路２０２によって、同様に光電変換素子２０３に到
達し、原稿を読み敗ることが可能となる。この時、光導
波路の光透過性の部分ｉｊ　ｆｆｉ　を変換素子の面積
以下でないと、隣りの光電変換索子元のリークが生じ、
解像度の低下を招く。As shown in Figure 1 (b), when the original is white, the light that passes through the original reaches the optically transparent portion of the optical waveguide 202 and reaches the photoelectric conversion cable 203; As shown in Figure (b) K, when the original is black, the light attenuated by the black original reaches the photoelectric conversion element 203 through the optical waveguide 202, and the original can be read and lost. . At this time, if the optically transparent portion ij ffi of the optical waveguide is not smaller than the area of the conversion element, leakage from the adjacent photoelectric conversion element will occur.
This results in a decrease in resolution.

すなわち、光４波路の光透過部分が光電変換索子画積よ
り大きい場合は光導波路の光透過部分■大きさで固体機
縁装置の解陳度が決まる。That is, when the light transmitting portion of the four optical waveguides is larger than the photoelectric conversion module area, the degree of resolution of the solid-state device is determined by the size of the light transmitting portion of the optical waveguide.

〔実施列１〕 帆２図に、本実施飼の固体撮は装置の構成図を示す、３
０１はＬＩＤアレイ光源、３０２は光導波路、３０３は
原稿、３０４は紙（原稿）送りローラーである。読み取
り原理は前記〔作用〕で述べた。様に、該先導波路３０
２上面を原稿が密着しながら、紙送りローラーで送られ
、その時刻々の原稿３０３の演淡の光情報が該光導波路
３０２を通りて、該光導波路に密接した光電変換素子２
０３に伝えられ、読み取られる。第３図に実施列１の光
導波路の拡大図を示す、４０１は光の不透過部分で黒色
の有！！樹脂で形成される。４０２は該有機樹脂に複数
の貫通穴を開け、透明有機樹脂で埋め、ピンチＰ　、　
ＰＩは６２．５μｍで、穴径間μｍで光透過部分を形成
した。また％厚みｔは３藺と匝めて博い１本実施列の固
体撮像素子は８画素／Ｕのｙｔ、電変換素子（ピッチ１
２５μ？？Ｌ）でちり、Ｐ、Ｐ“よりピッチが粗いため
、光導波路と固体撮像素子の位＃を会せはほとんど行わ
なくとも４１ルーでＭ　Ｔ　１！’　４０％以上が得ら
れる上、環境温度の影響による解像度の低下もほとんど
受けな＾ことがわかった。また、原稿紙による光導波路
の摩耗による性能劣下も観測されなｉ、優れた固体機縁
装置が得られた。[Implementation row 1] Figure 2 shows the configuration of the solid-state imaging equipment used in this experiment, and Figure 3
01 is an LID array light source, 302 is an optical waveguide, 303 is an original, and 304 is a paper (original) feeding roller. The reading principle was described above in [Operation]. Similarly, the leading waveguide 30
While the original 303 is in close contact with the upper surface of the original 303, it is fed by a paper feed roller, and the optical information of the rendering of the original 303 at each moment passes through the optical waveguide 302 and is transferred to the photoelectric conversion element 2 that is in close contact with the optical waveguide.
03 and read. FIG. 3 shows an enlarged view of the optical waveguide of the first row. 401 is a black portion that does not transmit light. ! Made of resin. 402 makes a plurality of through holes in the organic resin, fills them with transparent organic resin, pinches P,
PI was 62.5 μm, and a light transmitting portion was formed with a hole diameter of μm. In addition, the % thickness t is 3 times, and the solid-state image sensor in one implementation row has a yt of 8 pixels/U, and the electric conversion element (pitch 1
25μ? ? Since the pitch is coarser than that of L), P, and P", M T 1!' of 40% or more can be obtained with 41 ru even if the optical waveguide and solid-state image sensor are hardly aligned, and the environmental temperature It was found that there was almost no decrease in resolution due to the influence of paper.Also, no deterioration in performance due to abrasion of the optical waveguide due to the manuscript paper was observed, and an excellent solid-state device was obtained.

〔実施列２〕 透明なガラス繊維やプラスチック繊維を束ね、前記光導
波路を形成しても同様の効果が得られた。[Run 2] Similar effects were obtained when the optical waveguide was formed by bundling transparent glass fibers or plastic fibers.

〔発明の効果〕〔Effect of the invention〕

本発Ｕ！Ａを用＾れば以下の効果を得ることができる。 Hon U! By using A, you can obtain the following effects.

住）光学調整が不要である。) Optical adjustment is not required.

（２）光路長を従来に比べて殆〜榛以下にできる。(2) The optical path length can be reduced to approximately 1000 to less than that of the conventional method.

Ｃ３）ｍ境温度による性能劣下が非常に少なく、又原稿
紙による摩耗の劣下を受けず信頼性が高い。C3) There is very little performance deterioration due to ambient temperature, and there is no deterioration due to abrasion caused by original paper, and the reliability is high.

（４）光導波路のｍ造が蘭学で （５）固体撮像素子の凸凹の影ｒｒＩを受けにくい。(4) The construction of optical waveguides is a Dutch study. (5) It is less susceptible to the shadow rrI of unevenness of the solid-state image sensor.

非常に安価である。Very cheap.

等、浸れた効果を有し、電子黒板、ファクシミリ、イメ
ージリーダー、ＯＣＲ、バーコードリーダー等に応用で
きる。It has a unique effect and can be applied to electronic whiteboards, facsimiles, image readers, OCR, barcode readers, etc.

【図面の簡単な説明】[Brief explanation of drawings]

鎮１図（α）　、　（ｂ）は本発明の固体撮太装固Ｑ髄
面図である。 麻２図は実施列の固体撮像装置■構成図である。 第３図は実施列の５［波路拡大図である。 欲４図は従来の固体撮像装置の構成図である。 光源ｅ・・２００ ＬＥＤアレイ光源・・・３０１．１０１光導波路・・・
２０２，３０２ 光導波路の不透過部分＃０・４０１ 光導波路Ｑ元透過部分・−・４０２ 光町変換素子・・・２０３ 固体撮像素子・拳・２０４，１０４ 以　　　上 出願人　セイコーエプソン株式会社 −て一２０４暑鉗旧桑ｆ製−＃−き ■１恥（１木ｊ−釘釦函 １１図（久） １］体操イ＆喉１１誹菌娼 第　　１　　　図　　（トノ ３０１、ＬＥＤアレイ光隠 １鶏ＩＡミコＡシイ１辷１に置　、ａべ図第２凶Figures 1 (α) and (b) are solid-state Q medullary views of the present invention. Figure 2 is a configuration diagram of the solid-state imaging device in the actual row. FIG. 3 is an enlarged view of the 5th wave path in the implementation row. Figure 4 is a configuration diagram of a conventional solid-state imaging device. Light source e...200 LED array light source...301.101 Optical waveguide...
202,302 Non-transparent part #0 of optical waveguide 401 Q-transparent part of optical waveguide 402 Optical town conversion element 203 Solid-state image sensor fist 204,104 Applicant Seiko Epson Corporation - 1 204 Hot hammer made of old mulberry f - # - Ki ■ 1 Shame (1 Wood j - Nail button box 11 diagram (Ku) 1] Gymnastics I & Throat 11 Bacteria prostitute Figure 1 (Tonneau 301, LED array light cover 1 Chicken IA Miko A Sea 1 side 1, abe diagram 2nd row

Claims (1)

【特許請求の範囲】 １）一次元に配列した光電変換素子を有する固体撮像素
子と、該固体撮像素子と密接した光導波路から成ること
を特徴とした固体撮像装置。 ２）前記光電変換素子の面積より小さい光透過部分（４
０２）と、光が不透過な部分（４０１）から成る光導波
路から成ることを特徴とする特許請求の範囲第１項記載
の固体撮像装置。[Scope of Claims] 1) A solid-state imaging device comprising a solid-state imaging device having photoelectric conversion elements arranged in one dimension, and an optical waveguide in close contact with the solid-state imaging device. 2) A light transmitting portion (4) smaller than the area of the photoelectric conversion element
02) and a light-impermeable portion (401).