JPS62176966A - Method of joining ceramic to metal - Google Patents
Method of joining ceramic to metalInfo
- Publication number
- JPS62176966A JPS62176966A JP1817486A JP1817486A JPS62176966A JP S62176966 A JPS62176966 A JP S62176966A JP 1817486 A JP1817486 A JP 1817486A JP 1817486 A JP1817486 A JP 1817486A JP S62176966 A JPS62176966 A JP S62176966A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic
- metal
- base material
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 32
- 239000002184 metal Substances 0.000 title claims description 29
- 229910052751 metal Inorganic materials 0.000 title claims description 29
- 239000000919 ceramic Substances 0.000 title claims description 20
- 238000005304 joining Methods 0.000 title claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 53
- 229910052759 nickel Inorganic materials 0.000 claims description 26
- 229910010293 ceramic material Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 238000009792 diffusion process Methods 0.000 claims description 11
- 239000007790 solid phase Substances 0.000 claims description 10
- 230000008646 thermal stress Effects 0.000 description 7
- 230000035882 stress Effects 0.000 description 6
- 238000007751 thermal spraying Methods 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 229910001208 Crucible steel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910001235 nimonic Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミックと金属の接合方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for joining ceramics and metals.
セラミックは高温における強度、耐食性。 Ceramic has strength and corrosion resistance at high temperatures.
耐摩耗性等に優れているため、ガスタービンやディーゼ
ルエンジン等の内燃機関の高温部材として注目されてい
る。しかし、セラミックは脆いという根本的な欠点があ
り。Due to its excellent wear resistance, it is attracting attention as a high-temperature component for internal combustion engines such as gas turbines and diesel engines. However, ceramic has a fundamental drawback of being brittle.
このため実用化に当っては、使用条件の厳しい部分のみ
をセラミックとし、これを金属と接合させて使用する方
法が有望である。Therefore, for practical use, it is promising to use ceramic only in the parts that require severe usage conditions and to use it by bonding it with metal.
内燃機関用セラミックとしては、５ＩＣ９Ｓ１３Ｎ４が
最も有力であるが、これらは共有結合性が高く、金属と
の接合は困難である。5IC9S13N4 is the most promising ceramic for internal combustion engines, but these have high covalent bonding properties and are difficult to bond to metals.
従来、高温使用を目的としたセラミックと金属の接合法
としては、■メタライジング法、■ろう付法、■固相拡
散接合法が知られているＯ
しかし、これらのうち■の方法は工程が複雑でコストが
高くつく欠点があり、また■の方法は現在量も広く研究
開発が行われているが、そのほとんどにおいてろう付温
度が９００℃以上となり、金属側の強度が低下するおそ
れがある。Conventionally, known methods for joining ceramics and metals for high-temperature use include ■metallizing method, ■brazing method, and ■solid-phase diffusion bonding method.However, among these methods, ■method is difficult to process. It has the disadvantage of being complicated and expensive, and although method (2) is currently being widely researched and developed, in most of them the brazing temperature is over 900℃, which may reduce the strength of the metal side. .
これに対し■の方法は、工程が簡単でしかも液相状態を
必要としないため、適当な中間層を選定することにより
接合温度を下げることが可能である。しかしこの方法で
も、ＳｉＣやＳｉ３Ｎ番等のセラミックの熱膨張係数（
約４ｘｔＯ／’Ｃ）が、内燃機関に使われるＮｉ基耐熱
合金、耐熱鋼、耐熱鋳鋼等の金属材料の熱膨張係数（約
１３Ｘ１０／℃）に較べて著しく小さく、このため接合
後の冷却中や運転中に生じる熱応力によりセラミックに
割れを生じてしまう。このような熱応力の緩和方法とし
ては、゛セラミックと金属の間に、中間層として両部材
の中間の熱膨張係数を有する金属や塑性変形能の大きな
軟質金属を介在させるという方法も提案されているが、
これだけでは十分な効果をあげることはできない。On the other hand, method (2) requires a simple process and does not require a liquid phase state, so it is possible to lower the bonding temperature by selecting an appropriate intermediate layer. However, even with this method, the thermal expansion coefficient (
4xtO/'C) is significantly smaller than the coefficient of thermal expansion (approximately 13x10/'C) of metal materials such as Ni-based heat-resistant alloys, heat-resistant steel, and heat-resistant cast steel used in internal combustion engines. Thermal stress generated during operation can cause cracks in the ceramic. As a method for alleviating such thermal stress, a method has also been proposed in which a metal with a coefficient of thermal expansion between the two materials or a soft metal with large plastic deformability is interposed as an intermediate layer between the ceramic and the metal. There are, but
This alone cannot produce sufficient effects.
本発明はこのような従来の問題に鑑み、セラミックの接
合を容易にし、しかも熱応力によるセラミックの割れが
適切に防止されるという観点から、金属母材とセラミッ
ク材との間に介在させるべき中間部材及びセラミック材
の接合方式について検討を重ねたものであり、この結果
、金属母材とこれに接合されるセラミック材との間に、
金属母材側から銅層及びニッケル層を設け、該ニッケル
層に対しセラミック材を固相拡散接合することにより、
セラミックの接合を容易に行うことができ、しかも接合
後の熱応力によるセラミックの割れを適切に防止し得る
ことを見い出した。In view of such conventional problems, the present invention aims to facilitate the joining of ceramics and to appropriately prevent cracking of the ceramics due to thermal stress. The method of joining components and ceramic materials has been studied repeatedly, and as a result, there is a gap between the metal base material and the ceramic material that is joined to it.
By providing a copper layer and a nickel layer from the metal base material side and solid-phase diffusion bonding a ceramic material to the nickel layer,
It has been found that ceramics can be easily joined and, moreover, cracking of the ceramics due to thermal stress after joining can be appropriately prevented.
以下、本発明を図面に基づいて説明する。Hereinafter, the present invention will be explained based on the drawings.
第１図は１本発明の一実施状況を示すもので、（１）は
セラミックを接合すべき金属母材。FIG. 1 shows a state of implementation of the present invention, in which (1) shows a metal base material to which ceramics are to be joined.
（２）はセラミック材であり、主としてＳｉＣ，５ｉｓ
Ｎ＋等のセラミックが接合対象とされる。(2) is a ceramic material, mainly SiC, 5is
Ceramics such as N+ are to be bonded.
本発明では、セラミック材（２）を金属母材（１）に接
合するに轟り、両部材の間に金属母材側から銅層（３）
及びニッケル層（４）を形成させ、該ニッケル層（４）
に対しセラミック材（２）を固相拡散接合する。In the present invention, a ceramic material (2) is joined to a metal base material (1), and a copper layer (3) is placed between both members from the metal base material side.
and forming a nickel layer (4), the nickel layer (4)
A ceramic material (2) is solid phase diffusion bonded to the ceramic material (2).
前記銅層（３）及びニッケル層（４）は、通常金属母材
（１目こ予め形成され、しかる後、上層のニッケル層（
４）にセラミック材（２）が固相拡散接合される。図中
（５）は荷重負荷ロッド％（６ンは高周波誘導コイルで
あり、この高周波誘導コイル（６）で加熱しつつ荷重負
荷ロッド（５）で加圧することによりセラミック材（２
）はニッケル層（４）に対し、接合される。The copper layer (3) and the nickel layer (4) are usually formed in advance on the metal base material (first layer), and then the upper nickel layer (
Ceramic material (2) is solid phase diffusion bonded to 4). In the figure, (5) is a load-bearing rod (%) (6 is a high-frequency induction coil, and the ceramic material (2
) is bonded to the nickel layer (4).
上記銅層（３Ｊ及びニッケル層（４）は、溶射により金
属母材面に予め形成させておくことができ、この溶射法
を用いることにより、各層の厚さを任意に制御すること
ができるとともに、円錐面や球面のような！！雑な形状
を持つ母材面上にも容易に形成させることができる。The above-mentioned copper layer (3J) and nickel layer (4) can be formed in advance on the metal base material surface by thermal spraying, and by using this thermal spraying method, the thickness of each layer can be arbitrarily controlled. It can be easily formed on base material surfaces with rough shapes such as conical or spherical surfaces.
このように銅層（３７及びニッケル層（４）の形成は溶
射法が特に有利な方法と言えるが、板状等の金属部材そ
のものを固相拡散接合により金属母材（１）に予め接合
する方法や、メッキ法。In this way, thermal spraying is a particularly advantageous method for forming the copper layer (37) and the nickel layer (4), but the metal member itself, such as a plate, can be bonded to the metal base material (1) in advance by solid-phase diffusion bonding. method and plating method.
ＣＶＤ法、ＰＶＤ法等のコーティング法により上記銅層
（３３及びニッケルＪ’ｉ （４）を形成させるように
することを妨げるものではない、また以上のような銅層
及びニッケル層を予め形成させる方法に対し、例えば銅
層を構成すべき金属部材、ニッケル層を構成すべき金属
部材及びセラミック材を金属母材上に積層配置し。This does not preclude forming the copper layer (33 and nickel J'i (4)) by a coating method such as a CVD method or a PVD method. For example, a metal member to constitute a copper layer, a metal member to constitute a nickel layer, and a ceramic material are stacked and arranged on a metal base material.
各部材間を同時に固相拡散接合させるようにすることも
できる。It is also possible to perform solid-phase diffusion bonding between each member at the same time.
以上のような本発明では、金属母材とセラミック材間の
中間層のうち、銅層（３７がセラミック材（２）に生じ
る熱応力を緩和する作用をし、またニッケル層（４）は
同相拡散接合方式によるセラミック材（２）の接合を容
易にし、また低い接合温度による接合を可能ならしめる
。In the present invention as described above, among the intermediate layers between the metal base material and the ceramic material, the copper layer (37) acts to relieve the thermal stress generated in the ceramic material (2), and the nickel layer (4) acts in the same phase. This facilitates the bonding of the ceramic material (2) using the diffusion bonding method, and also enables bonding at a low bonding temperature.
第１表は１本発明におけるニッケルとｓｌｃ 。Table 1 shows nickel and SLC in the present invention.
５ｉｓＮ４の台セラミック材との接合実験結果を示すも
のであり、通常ＳａＣでは７００℃以上。This shows the results of a bonding experiment with 5isN4 base ceramic material, which is usually 700°C or higher for SaC.
５ｌｓＮ、では８００℃以上で接合が可能であることが
示されている。It has been shown that bonding is possible at 800° C. or higher at 5lsN.
第 １ 表
注１）接合圧力 ５．０助／１１／
接合時間 １ ｈｒ
第２図（ＡＸＢ）は本発明法により得られた接合体及び
中間層を設けない従来の接合体について、セラミック材
に生じる最大主応力値を弾塑性解析ζこより求めた結果
を等応力線図で示すもので、σＳは接合後の冷却中に生
じたセラミック材内の最大主応力値である。なお、本発
明例及び従来例ともに金属母材としてＮｉｍｏｎｉｃ
８０ Ａ 、 セラミックスして５ｉｌＮ４を用いた
ものである。これｉこよれば、セラミック材を金属母材
に対して直接接合した従来例の場合はσ５＝５７．０Ｋ
ｆ／１Ｉ１１！であるのに対し、本発明法により得られ
た接合体ではσ９＝２０．０Ｖ−と著しく小さくなって
おり、熱応力が適切に緩和されていることが判る。Table 1 Note 1) Bonding pressure 5.0 aid/11/ Bonding time 1 hr Figure 2 (AXB) shows the bonded body obtained by the method of the present invention and the conventional bonded body without an intermediate layer. The resulting maximum principal stress value obtained from the elastic-plastic analysis ζ is shown in an iso-stress diagram, where σS is the maximum principal stress value generated in the ceramic material during cooling after joining. In addition, in both the present invention example and the conventional example, Nimonic was used as the metal base material.
80A, using 5ilN4 ceramics. According to this, in the case of the conventional example in which the ceramic material is directly joined to the metal base material, σ5 = 57.0K
f/1I11! On the other hand, in the bonded body obtained by the method of the present invention, σ9=20.0V-, which is significantly smaller, indicating that the thermal stress is appropriately alleviated.
なお、上記中間層（銅層及びニッケル／Ｉ）の厚さは接
合体の使用環境等に応じ任意に選択できるが、実用的に
は銅層は１００〜１０００μＦ７！、ニッケル層は５０
μｍが好ましい。第３図はニッケル層の厚みとセラミッ
ク材中に生じる最大主応力値との関係（銅層厚１１００
０ｐの場合）を示すものであり、ニッケル層の厚みを５
０μｍ以下とすることにより最大主応力値をほぼ３０
Ｋｇ／Ｉｍ！以下に抑えることができることが示されて
いる。Note that the thickness of the intermediate layer (copper layer and nickel/I) can be arbitrarily selected depending on the usage environment of the joined body, etc., but in practical terms, the thickness of the copper layer is 100 to 1000 μF7! , the nickel layer is 50
μm is preferred. Figure 3 shows the relationship between the thickness of the nickel layer and the maximum principal stress value generated in the ceramic material (copper layer thickness 1100
0p), and the thickness of the nickel layer is 5
By setting it to 0 μm or less, the maximum principal stress value can be reduced to approximately 30
Kg/Im! It has been shown that it is possible to reduce the
また、固相拡散接合は例えば以下のような条件で行われ
る。Furthermore, solid-phase diffusion bonding is performed, for example, under the following conditions.
雰囲気：真空中（ＩＸｌｏ ｔｏｒｒ程度）もしくは
不活性ガス雰囲気
接合温度： ７００〜１０００℃
接合圧カニ １〜ｌＯ〜ｈノ
また、固相拡散接合のための加熱は、高周波誘導加熱、
電気炉加熱等の適宜の方式を採ることができる。Atmosphere: In vacuum (about IXlo torr) or inert gas atmosphere Bonding temperature: 700 to 1000°C Bonding pressure 1 to 10 to 1000 ℃ Also, the heating for solid phase diffusion bonding is high frequency induction heating,
An appropriate method such as electric furnace heating can be used.
本発明法により、第４図に示すような焼結セラミックフ
ェース部を有する排気弁を以下の条件により製造した６
図中（ａ）はフェース部であり、この部分の母材（１）
とセラミック材（２）との間には、母材側から銅層（３
）とニッケル層（４ンとが介在した構造となっている。By the method of the present invention, an exhaust valve having a sintered ceramic face portion as shown in Fig. 4 was manufactured under the following conditions.
(a) in the figure is the face part, and the base material (1) of this part
A copper layer (3) is placed between the base material and the ceramic material (2).
) and a nickel layer (4) interposed therebetween.
また、各中間層は、その上部の部材（または層）を表面
を除き被包するような構造となっている。Furthermore, each intermediate layer has a structure that covers the member (or layer) above it except for the surface.
すなわち、ニッケル層（４）はその上部のセラミック材
（２）を、また銅層（３）はその上部のニッケル層（４
）をそれぞれその周縁まで包むように被包している。That is, the nickel layer (4) covers the ceramic material (2) above it, and the copper layer (3) covers the nickel layer (4) above it.
) are wrapped around each other to the periphery.
イ）材 料 フェース部材Ｃ５ｉｓＮ番 弁母材： Ｎｌｍｏｎｉｃ ８０Ａ 中間層ニッケル層： ４０μｍ 銅 層： ５００μｍ 口）製造法 第４図に示した円錐面を有する弁母材 フェース面にショツトブラスト処理を 施し、脱脂後、第１層に銅を、第２層 にニッケルを溶射し、中間層を形成さ せた。b) Material Face member C5isN number Valve base material: Nlmonic 80A Intermediate nickel layer: 40μm Copper layer: 500μm 口）Manufacturing method Valve base material with conical surface shown in Figure 4 Shot blasting treatment on the face After applying and degreasing, apply copper to the first layer, and apply copper to the second layer. nickel is thermally sprayed to form an intermediate layer. I set it.
この中間層を形成させた接合面に１円 錐面を有するリング状の焼結セラミッ クスを合せ、以下の条件で固相拡散接 合を行った。1 yen on the joint surface where this intermediate layer was formed. Ring-shaped sintered ceramic with conical surface solid-phase diffusion welding under the following conditions. We held a meeting.
雰囲気： ｌＸｌ０ ｔｏｒｒ真空中接合温度： ８
５０℃Ｘ Ｉ Ｈｒ
接合圧カニ５Ｋｆ／−”
なお１本実施例では中間層の形成に溶射法を用いている
ため、中間層を隙間なく、且つ均一に形成させることが
できた。Atmosphere: lXl0 torr in vacuum Bonding temperature: 8
50° C. X I Hr Bonding pressure: 5 Kf/-” Note that in this example, since a thermal spraying method was used to form the intermediate layer, the intermediate layer could be formed uniformly without any gaps.
以上述べた本発明によれば、熱応力によるセラミック材
の割れを適切に防止できる接合構造を得ることができ、
加えてセラミック材の接合を極めて容易に行うことがで
きるとともに、接合温度も低く抑えることができるため
、金属側の強度低下も適切に防止することができる効果
がある。According to the present invention described above, it is possible to obtain a joining structure that can appropriately prevent cracking of ceramic materials due to thermal stress,
In addition, ceramic materials can be bonded extremely easily and the bonding temperature can be kept low, which has the effect of appropriately preventing a decrease in strength on the metal side.
ｌＡ−面の簡単な説明
第１図は本発明法の実施状況を示す説明−である。第２
図（ＡＸＢ）は本発明法により得られた接合体及び中間
層を設けない従来の接合体について、セラミック材に生
じる応力を示す等応力線図である。第３因は本発明法を
より得られる接合体のニッケル層厚とセラミックに生じ
る最大主応力値との関係を示すものである。第４図は本
発明の一実施例において製造された排気弁の構造を示す
半断面囚である。Brief Explanation of the IA Plane FIG. 1 is an explanatory diagram showing the implementation of the method of the present invention. Second
The figure (AXB) is an iso-stress diagram showing the stress generated in the ceramic material for the joined body obtained by the method of the present invention and the conventional joined body without an intermediate layer. The third factor shows the relationship between the nickel layer thickness of the bonded body obtained by the method of the present invention and the maximum principal stress value generated in the ceramic. FIG. 4 is a half cross-sectional view showing the structure of an exhaust valve manufactured in one embodiment of the present invention.
図において、（υは金属母材、（２）はセラミック材、
（３）は銅層、（４）はニッケル層を各示す・In the figure, (υ is the metal base material, (2) is the ceramic material,
(3) shows the copper layer, and (4) shows the nickel layer.
Claims (1)
母材側から銅層及びニッケル層を設け、該ニッケル層に
対しセラミック材を固相拡散接合することを特徴とする
セラミックと金属の接合方法。A method of bonding ceramic and metal, characterized in that a copper layer and a nickel layer are provided from the metal base material side between a metal base material and a ceramic material to be bonded thereto, and the ceramic material is solid-phase diffusion bonded to the nickel layer. Joining method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1817486A JPS62176966A (en) | 1986-01-31 | 1986-01-31 | Method of joining ceramic to metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1817486A JPS62176966A (en) | 1986-01-31 | 1986-01-31 | Method of joining ceramic to metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62176966A true JPS62176966A (en) | 1987-08-03 |
| JPH0339992B2 JPH0339992B2 (en) | 1991-06-17 |
Family
ID=11964247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1817486A Granted JPS62176966A (en) | 1986-01-31 | 1986-01-31 | Method of joining ceramic to metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62176966A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2634756A1 (en) * | 1988-07-28 | 1990-02-02 | Lilliwyte Sa | METHOD FOR JOINING CERAMIC COMPONENTS WITH METAL COMPONENTS AND MANUFACTURED PRODUCTS OBTAINED THEREBY |
| JP2009090121A (en) * | 2007-10-10 | 2009-04-30 | Zimmer Inc | Method for bonding tantalum structure to cobalt-alloy substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS613663A (en) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | Pretreatment for brazing of metallic members |
-
1986
- 1986-01-31 JP JP1817486A patent/JPS62176966A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS613663A (en) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | Pretreatment for brazing of metallic members |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2634756A1 (en) * | 1988-07-28 | 1990-02-02 | Lilliwyte Sa | METHOD FOR JOINING CERAMIC COMPONENTS WITH METAL COMPONENTS AND MANUFACTURED PRODUCTS OBTAINED THEREBY |
| JP2009090121A (en) * | 2007-10-10 | 2009-04-30 | Zimmer Inc | Method for bonding tantalum structure to cobalt-alloy substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339992B2 (en) | 1991-06-17 |
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