JPS6216750B2 - - Google Patents

Info

Publication number: JPS6216750B2
Authority: JP; Japan
Prior art keywords: brazing filler; filler metal; melting point; based alloy; soldering
Prior art date: 1980-05-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP6982280A

Other languages

English (en)

Japanese (ja)

Other versions

JPS56165591A (en

Inventor

Masaki Morikawa

Hideaki Yoshida

Kunio Kishida

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Metal Corp

Original Assignee

Mitsubishi Metal Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1980-05-26

Filing date

1980-05-26

Publication date

1987-04-14

1980-05-26 Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp

1980-05-26 Priority to JP6982280A priority Critical patent/JPS56165591A/ja

1981-12-19 Publication of JPS56165591A publication Critical patent/JPS56165591A/ja

1987-04-14 Publication of JPS6216750B2 publication Critical patent/JPS6216750B2/ja

Status Granted legal-status Critical Current

Links

238000005219 brazing Methods 0.000 claims description 43
239000000945 filler Substances 0.000 claims description 29
229910052751 metal Inorganic materials 0.000 claims description 29
239000002184 metal Substances 0.000 claims description 29
230000008018 melting Effects 0.000 claims description 17
238000002844 melting Methods 0.000 claims description 17
229910045601 alloy Inorganic materials 0.000 claims description 14
239000000956 alloy Substances 0.000 claims description 14
229910017566 Cu-Mn Inorganic materials 0.000 claims description 11
229910017871 Cu—Mn Inorganic materials 0.000 claims description 11
229910052709 silver Inorganic materials 0.000 claims description 8
229910052742 iron Inorganic materials 0.000 claims description 6
229910052759 nickel Inorganic materials 0.000 claims description 6
239000012535 impurity Substances 0.000 claims description 5
239000000203 mixture Substances 0.000 claims description 5
229910052761 rare earth metal Inorganic materials 0.000 claims description 5
229910052725 zinc Inorganic materials 0.000 claims description 5
229910052802 copper Inorganic materials 0.000 claims description 2
229910000679 solder Inorganic materials 0.000 description 20
238000005476 soldering Methods 0.000 description 20
230000000694 effects Effects 0.000 description 13
239000000463 material Substances 0.000 description 10
230000003647 oxidation Effects 0.000 description 7
238000007254 oxidation reaction Methods 0.000 description 7
230000000052 comparative effect Effects 0.000 description 4
238000005553 drilling Methods 0.000 description 4
238000004519 manufacturing process Methods 0.000 description 4
239000010953 base metal Substances 0.000 description 3
238000004090 dissolution Methods 0.000 description 3
239000007789 gas Substances 0.000 description 3
230000006872 improvement Effects 0.000 description 3
150000002739 metals Chemical class 0.000 description 3
238000000034 method Methods 0.000 description 3
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
230000009471 action Effects 0.000 description 2
230000007547 defect Effects 0.000 description 2
230000008569 process Effects 0.000 description 2
239000011435 rock Substances 0.000 description 2
239000004332 silver Substances 0.000 description 2
238000005728 strengthening Methods 0.000 description 2
229910000831 Steel Inorganic materials 0.000 description 1
229910009043 WC-Co Inorganic materials 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000004907 flux Effects 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
230000001771 impaired effect Effects 0.000 description 1
239000011261 inert gas Substances 0.000 description 1
238000005259 measurement Methods 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
238000005096 rolling process Methods 0.000 description 1
239000006104 solid solution Substances 0.000 description 1
238000003892 spreading Methods 0.000 description 1
230000007480 spreading Effects 0.000 description 1
239000010959 steel Substances 0.000 description 1
238000005491 wire drawing Methods 0.000 description 1

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Ceramic Products (AREA)
Conductive Materials (AREA)

JP6982280A 1980-05-26 1980-05-26 Low melting point cu-mn base alloy brazing filler metal having good wetting property Granted JPS56165591A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP6982280A JPS56165591A (en)	1980-05-26	1980-05-26	Low melting point cu-mn base alloy brazing filler metal having good wetting property

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP6982280A JPS56165591A (en)	1980-05-26	1980-05-26	Low melting point cu-mn base alloy brazing filler metal having good wetting property

Publications (2)

Publication Number	Publication Date
JPS56165591A JPS56165591A (en)	1981-12-19
JPS6216750B2 true JPS6216750B2 (zh)	1987-04-14

Family

ID=13413826

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP6982280A Granted JPS56165591A (en)	1980-05-26	1980-05-26	Low melting point cu-mn base alloy brazing filler metal having good wetting property

Country Status (1)

Country	Link
JP (1)	JPS56165591A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103358051A (zh) *	2013-07-23	2013-10-23	华南理工大学	一种铜基钎料及其制备方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4587097A (en) *	1984-06-22	1986-05-06	Allied Corporation	Homogeneous low melting temperature brazing filler metal for joining ferrous and non-ferrous alloys
JPS62259696A (ja) *	1986-05-07	1987-11-12	Mitsubishi Metal Corp	超硬合金部材と鋼部材とのろう付け用Ｃｕ合金ろう材
KR20030012584A (ko) *	2001-08-01	2003-02-12	주식회사삼화합금사	용가재용 합금 조성물 및 그 제조방법
JP4766850B2 (ja) *	2004-07-29	2011-09-07	ダイハツ工業株式会社	ろう材
CN110936062A (zh) *	2019-12-18	2020-03-31	陕西易莱德新材料科技有限公司	一种添加有铂金属的焊料及其制备方法

1980
- 1980-05-26 JP JP6982280A patent/JPS56165591A/ja active Granted

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN103358051A (zh) *	2013-07-23	2013-10-23	华南理工大学	一种铜基钎料及其制备方法
CN103358051B (zh) *	2013-07-23	2015-08-26	华南理工大学	一种铜基钎料及其制备方法

Also Published As

Publication number	Publication date
JPS56165591A (en)	1981-12-19

Publication	Publication Date	Title
US20200030921A1 (en)	2020-01-30	Alloys
US4121750A (en)	1978-10-24	Processes for soldering aluminum-containing workpieces
JP2016532560A (ja)	2016-10-20	ろう付け合金
JPH059619A (ja)	1993-01-19	高力銅合金の製造方法
JPS6216750B2 (zh)	1987-04-14
JPS6113916B2 (zh)	1986-04-16
GB2270086A (en)	1994-03-02	Aluminium base alloys
US4905887A (en)	1990-03-06	Process for soldering aluminum containing workpieces
JPS6113912B2 (zh)	1986-04-16
US3948432A (en)	1976-04-06	Brazing preforms and method of brazing
JPS6216749B2 (zh)	1987-04-14
JP5562749B2 (ja)	2014-07-30	Ｃｕ−Ｍｎ系ろう材細線およびその製造方法
JPS6236800B2 (zh)	1987-08-08
JP7290222B2 (ja)	2023-06-13	銀ろう材及び該銀ろう材を用いた接合方法
JPS5831275B2 (ja)	1983-07-05	ＷＣ−Ｃｏ系超硬合金のフラックスなしろう付け用ろう材
JPH11179588A (ja)	1999-07-06	ステンレス鋼ろう付用ろう
JP3057662B2 (ja)	2000-07-04	ロウ材料
CN114571129B (zh)	2024-07-12	铜基钎料及其制备方法和应用
JPS6111158B2 (zh)	1986-04-01
JPH0220359B2 (zh)	1990-05-09
JP2523677B2 (ja)	1996-08-14	低熱膨張リ―ドフレ―ム材料
JPS6216752B2 (zh)	1987-04-14
JPH01165733A (ja)	1989-06-29	高強度高導電性銅合金
JPH0679496A (ja)	1994-03-22	共晶銅鉄合金線材
JP3519863B2 (ja)	2004-04-19	表面割れ感受性の低いりん青銅及びその製造方法