JPS62151729U - - Google Patents

Info

Publication number
JPS62151729U
JPS62151729U JP3997586U JP3997586U JPS62151729U JP S62151729 U JPS62151729 U JP S62151729U JP 3997586 U JP3997586 U JP 3997586U JP 3997586 U JP3997586 U JP 3997586U JP S62151729 U JPS62151729 U JP S62151729U
Authority
JP
Japan
Prior art keywords
sided adhesive
wafer support
frame
transport frame
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3997586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3997586U priority Critical patent/JPS62151729U/ja
Publication of JPS62151729U publication Critical patent/JPS62151729U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、この考案に係るウエーハ支持体の一
実施例を示す斜視図、第２図及び第３図は同上の
他の実施例を示す斜視図、第４図は従来のウエー
ハ支持体を示す斜視図、第５図は同上のウエーハ
をダイシングした状態を示す斜視図である。 １……搬送用フレーム、２……ウエーハ、３…
…テープ、４′……織別記号。 FIG. 1 is a perspective view showing one embodiment of a wafer support according to this invention, FIGS. 2 and 3 are perspective views showing other embodiments of the same, and FIG. 4 is a perspective view showing a conventional wafer support. FIG. 5 is a perspective view showing a state in which the above wafer is diced. 1...Transportation frame, 2...Wafer, 3...
...tape, 4'...original symbol.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 環状の搬送用フレームと、そのフレームの内側
に置かれたウエーハとを一枚の片面粘着でマウン
トしたウエーハ支持体において、前記搬送用フレ
ームと片面粘着テープの少なくとも一方にロツト
ナンバや内容に関するデータ等を示す識別記号を
プリントしたことを特徴とするウエーハ支持体。 In a wafer support in which an annular transport frame and a wafer placed inside the frame are mounted with a single-sided adhesive, a lot number, data regarding contents, etc. are attached to at least one of the transport frame and the single-sided adhesive tape. A wafer support having an identification symbol printed thereon.
JP3997586U 1986-03-17 1986-03-17 Pending JPS62151729U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3997586U JPS62151729U (en) 1986-03-17 1986-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3997586U JPS62151729U (en) 1986-03-17 1986-03-17

Publications (1)

Publication Number Publication Date
JPS62151729U true JPS62151729U (en) 1987-09-26

Family

ID=30853644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3997586U Pending JPS62151729U (en) 1986-03-17 1986-03-17

Country Status (1)

Country Link
JP (1) JPS62151729U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (en) * 1987-11-06 1989-09-13 Tel Sagami Ltd Method and apparatus for transferring semiconductor wafer and heat treating boat for semiconductor wafer
JP2018114575A (en) * 2017-01-17 2018-07-26 株式会社ディスコ Dressing board, dressing method for cutting blade and cutting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194351A (en) * 1982-02-19 1983-11-12 プレシジョン・モノリシックス・インコ−ポレ−テッド Device and method for searching integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194351A (en) * 1982-02-19 1983-11-12 プレシジョン・モノリシックス・インコ−ポレ−テッド Device and method for searching integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (en) * 1987-11-06 1989-09-13 Tel Sagami Ltd Method and apparatus for transferring semiconductor wafer and heat treating boat for semiconductor wafer
JP2018114575A (en) * 2017-01-17 2018-07-26 株式会社ディスコ Dressing board, dressing method for cutting blade and cutting device

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