JPS6215024A - Grinding method for metal mold - Google Patents

Grinding method for metal mold

Info

Publication number
JPS6215024A
JPS6215024A JP15176785A JP15176785A JPS6215024A JP S6215024 A JPS6215024 A JP S6215024A JP 15176785 A JP15176785 A JP 15176785A JP 15176785 A JP15176785 A JP 15176785A JP S6215024 A JPS6215024 A JP S6215024A
Authority
JP
Japan
Prior art keywords
mold
polishing
symmetrical
work surface
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15176785A
Other languages
Japanese (ja)
Inventor
Yoshihiko Inagaki
稲垣 ▲やす▼彦
Yoshio Shibata
柴田 美夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15176785A priority Critical patent/JPS6215024A/en
Publication of JPS6215024A publication Critical patent/JPS6215024A/en
Pending legal-status Critical Current

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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

PURPOSE:To make a work surface grindable highly accurately, efficiently and simply, by grinding the work surface with a discharge or electrolytic action via a dielectric fluid between the work surface of a work metal mold and a conductive grinding surface of a symmetrical mold with this surface. CONSTITUTION:A symmetrical mold 2 is formed with ceramics, thermosetting resin, thermoplastic resin, etc., by means of casting or machining and so on, applying metallic plating, spattering, or the like, and a conductive grinding surface 2a in a form conforming or symmetrizing a work surface 1a is formed in advance. Next. the work surface 1a of a work metal mold 1 and the conductive grinding surface 2a if the symmetrical mold 2 are set up face-to-face, setting the side of the work surface 1a to the anode and the side of the grinding surface 2a to the cathode, respectively, and the specified control voltage is impressed on them, while a dielectric fluid 4 is fed to the inside of an opposite gap from a nozzle 3, thus operation takes place. If so, there is produced a discharge or electrolytic action between the work surface 1a and the grinding surface 2a via the dielectric fluid 4, thus the work surface 1a is accurately grindable in an effective manner.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は金型の研摩加工方法に関し、さらに詳しくは
複雑な形状に構成される主としてプラスチック金型の研
摩加工方法の改良に係るものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for polishing molds, and more specifically, it relates to an improvement in the method for polishing mainly plastic molds formed into complex shapes. .

〔従来の技術〕[Conventional technology]

一般的にこの種のプラスチック金型の研摩加工方法とし
ては、第3図(a)、(b)、(C)、(d)に見られ
るように、適宜、加工部品11に対し、側面研摩。
In general, as a polishing method for this type of plastic mold, as shown in FIGS. .

穴研摩、平面研摩7面取り研摩などを、それぞれに適合
した研摩砥石12を電動研摩工具13により回転駆動さ
せて、すべて手作業により行なうようにしている。
Hole polishing, flat surface polishing, seven-chamfer polishing, etc. are all performed manually by rotating a polishing wheel 12 suitable for each with an electric polishing tool 13.

すなわち、具体的には、第4図に示す通り、前記電動研
摩工具13を作業者の掌中に把持すると共に、指先でチ
ャック開閉リング14を回動操作し、チャック15を開
閉させて前記研摩砥石12を選択取換えできるようにし
、この状態で所定の押圧力により1回転駆動されている
研摩砥石12を、加工部品11の被研摩部分に押し当て
圧接させながら作業するようにしているのである。
Specifically, as shown in FIG. 4, the operator holds the electric polishing tool 13 in the palm of his hand, rotates the chuck opening/closing ring 14 with his fingertips, and opens and closes the chuck 15 to open and close the polishing tool 13. 12 can be selectively replaced, and in this state, the polishing wheel 12, which is driven one rotation by a predetermined pressing force, is pressed against the part to be polished of the workpiece 11 while working.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながらこのような研摩砥石12および電動研摩工
具13を用いた手作業による従来の研摩方法では、その
作業に極めて高度な熟練を必要とし、しかも仕上げられ
た製品金型に均一な精度などを求めるのが困難であり、
このため電動研摩工具13をたとえそのま−で作業ロボ
ットのツール軸に取、り付けて、この研摩作業を数値制
御の下に行なわせるようにしたとしても、例えば研摩圧
のjlfなどが難しく、この研摩圧の如何によっては、
研摩砥石12に過負荷が加えられて、加工部品11自体
を損傷したり、あるいは研摩砥石12の目詰りなどによ
る研摩能力の低下を招き、もしくは凹凸部に対する均一
な研摩ができないなどの問題点を有するものであった。
However, the conventional manual polishing method using the polishing wheel 12 and the electric polishing tool 13 requires an extremely high level of skill, and also requires uniform precision in the finished product mold. is difficult,
For this reason, even if the electric polishing tool 13 is attached to the tool shaft of a work robot and the polishing work is performed under numerical control, it is difficult to control the polishing pressure, for example. Depending on this polishing pressure,
Problems such as overloading the polishing wheel 12 may damage the workpiece 11 itself, or reduce the polishing ability due to clogging of the polishing wheel 12, or make it impossible to uniformly polish uneven parts. It was something that I had.

この発明は従来での金型の研摩加工方法のこのような問
題点に鑑み、放電研摩、電解研摩を採用した新規な手段
による金型の研摩加工方法を提供することを目的として
いる。
SUMMARY OF THE INVENTION In view of the above-mentioned problems with conventional mold polishing methods, it is an object of the present invention to provide a mold polishing method using novel means that employs electric discharge polishing and electrolytic polishing.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る金型の研摩加工方法は、被加工金型の被
加工面モデルから対称型を構成させ、かつその対称加工
面に金属メッキ、スパッタリングメッキなどを施して、
被加工面に一致もしくは対応する導電研摩面を形成させ
、被加工金型の被加工面とこれに対向配置させた対称型
の導電研摩面との間に、所定の電圧を印加させると共に
、対向面間に加工液を供給し、放電あるいは電解作用を
生じさせて被加工面の研摩を行なわせ得るようにしたも
のである。
The method for polishing a mold according to the present invention comprises constructing a symmetrical mold from a model of the surface to be processed of the mold to be processed, and applying metal plating, sputtering plating, etc. to the symmetrical surface to be processed.
A conductive polished surface that matches or corresponds to the surface to be machined is formed, and a predetermined voltage is applied between the surface of the mold to be machined and a symmetrical conductive polished surface placed opposite thereto. A machining fluid is supplied between the surfaces to generate electrical discharge or electrolytic action to polish the surface to be machined.

〔作   用〕[For production]

従ってこの発明方法においては、被加工金型の被加工面
に一致もしくは対応する導電研摩面を形成した対称型を
構成させ、被加工金型の被加工面とこれに対向配置させ
た対称型の導電研摩面との間で、加工液を介した放電あ
るいは電解作用により被加工面を研摩させるために、た
とえ被加工面が複雑な形状をしていたとしても、同面を
高精度で効果的かつ良好に研摩し得るのである。
Therefore, in the method of the present invention, a symmetrical mold is formed with a conductive polished surface that matches or corresponds to the processed surface of the processed mold, and a symmetrical mold that is arranged opposite to the processed surface of the processed mold The workpiece surface is polished by electrical discharge or electrolytic action via the machining fluid between the conductive polishing surface, so even if the workpiece surface has a complex shape, it can be polished with high precision and effectively. Moreover, it can be polished well.

〔実 施 例〕〔Example〕

以下この発明に係る金型の研摩加工方法の実施例につき
、第1図および@2図を参照して詳細に説明する。
Embodiments of the mold polishing method according to the present invention will be described in detail below with reference to FIGS. 1 and 2.

第1図はこの発明方法の一実施例による研摩状態の概要
を示す断面説明図である。
FIG. 1 is an explanatory cross-sectional view showing an outline of a polishing state according to an embodiment of the method of the present invention.

第1図において、この実施例の場合には、被加工金型1
の被加工面1aをモデルに用いて、例えば−S → ;
  −、/7 7    執誦Ik←ト珈、■鴨  桟
面l百硅珈■→か yにより、適宜、注型あるいは機械
加工などで対称型2を構成させると共に、その対称加工
面に金属メッキ、スパッタリングメッキなどを施して、
被加工面1aに一致し、もしくは対応する形状の導電研
摩面2aを形成させておく。
In FIG. 1, in the case of this embodiment, the workpiece die 1
Using the processed surface 1a of as a model, for example, -S →;
−, /7 7 Recitation Ik ← To coffee, ■Duck Crosspiece surface l 100 Stain black ■ → Or y, construct the symmetrical mold 2 by casting or machining as appropriate, and metal plate the symmetrical processed surface. , sputtering plating etc.
A conductive polished surface 2a having a shape that matches or corresponds to the surface to be processed 1a is formed.

しかして前記被加工金型lの被加工面1aと、対称型2
の導電研摩面2aとを対向して配置させ、かつ導電性の
ある被加工面1a側を陽極、導電研摩面2a側を陰極と
して所定の制御電圧を印加させると共に、ノズル3から
対向間隙内に加工液4を供給させて作業を行なうことに
より、こ−ではこれらの被加工面1aと導電研摩面2a
との間に、加工液4を介し放電あるいは電解作用が生じ
て、被加工面1aを精度良く効果的に研摩し得るのであ
る。
Therefore, the workpiece surface 1a of the workpiece die l and the symmetrical mold 2
The conductive polished surfaces 2a of 2 are placed facing each other, and a predetermined control voltage is applied with the conductive processed surface 1a as an anode and the conductive polished surface 2a as a cathode. By supplying the machining fluid 4 and performing the work, these surfaces 1a and conductive polished surface 2a are polished.
Electric discharge or electrolytic action occurs through the machining fluid 4 between the two, and the surface to be machined 1a can be polished effectively and accurately.

また第2図は前記対称型2に、例えば通気性のあるセラ
ミックス、熱硬化性樹脂、熱可塑性樹脂などを用いてハ
ニカム構造に構成させ、かつ加工液4中には砥粒などの
研摩剤5を混合させたものとしておき、前例と同様な操
作の外に、前記被加工金型1および対称型2の少なくと
も何れか一方に、超音波振動、その他の機械的振動を与
えて、研摩剤5に適度の圧力、微振動を加えることによ
り、研摩面を良好に鏡面仕上げできるのであり、併せて
対称型2が通気性を有するために、研摩剤5の流動が効
果的に行なわれ、一層良好な研摩をなし得るのである。
FIG. 2 shows that the symmetrical mold 2 has a honeycomb structure made of, for example, air-permeable ceramics, thermosetting resin, thermoplastic resin, etc., and the machining fluid 4 contains an abrasive agent 5 such as abrasive grains. In addition to the same operations as in the previous example, ultrasonic vibrations or other mechanical vibrations are applied to at least one of the die 1 to be processed and the symmetrical die 2 to form the abrasive 5. By applying appropriate pressure and slight vibration to the polished surface, it is possible to achieve a good mirror finish on the polished surface.In addition, since the symmetrical type 2 has air permeability, the abrasive 5 flows effectively, making it even better. This makes it possible to achieve excellent polishing.

〔発明の効果〕〔Effect of the invention〕

以上詳述したようにこの発明方法によれば、被加工金型
の被加工面に一致もしくは対応する導電研摩面を形成し
た対称型を設け、被加工金型の被加工面とこれに対向配
置させた対称型の導電研摩面との間に、所定の電圧を印
加させると共に、対向面間に加工液を供給させて、加工
液を介した放電あるいは電解作用により被加工面を研摩
させるようにしたから、たとえ被加工面が複雑な形状を
有する場合でも、この被加工面を高精度に、しかも効率
良く良好かつ簡単に研摩し得るなどの優れた特長を有す
るものである。
As detailed above, according to the method of the present invention, a symmetrical mold having a conductive polished surface that matches or corresponds to the processed surface of the processed mold is provided, and is placed opposite to the processed surface of the processed mold. A predetermined voltage is applied between the symmetrical conductive polishing surface and a machining fluid is supplied between the opposing surfaces, and the surface to be machined is polished by electric discharge or electrolytic action via the machining fluid. Therefore, even if the surface to be processed has a complicated shape, it has excellent features such as being able to easily polish the surface with high precision, efficiency, and good quality.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2−図はこの発明に係る金型の研摩加工
方法の各別の実施例による研摩状態の概要をそれぞれに
示す断面説明図であり、また第3図および第4図は従来
の金型の研摩加工方法を説明するそれぞれ斜視図である
。 1・・・・被加工金型、la・・・・被加工面、2・・
・・対称型、2a・・・・導電研摩面、3・・・・ノズ
ル、4・・・・加工液、5・・・・研摩剤。 代理人  大  岩  増  雄 第1図 第2図 第3図 (0)           (C) (b)         (d) 第4図
1 and 2 are cross-sectional explanatory views showing the outline of the polishing state according to each different embodiment of the mold polishing method according to the present invention, and FIGS. FIG. 3 is a perspective view illustrating a polishing method for a mold. 1...Mold to be machined, la...Surface to be machined, 2...
... Symmetrical type, 2a ... Conductive polishing surface, 3 ... Nozzle, 4 ... Processing fluid, 5 ... Abrasive agent. Agent Masuo Oiwa Figure 1 Figure 2 Figure 3 (0) (C) (b) (d) Figure 4

Claims (6)

【特許請求の範囲】[Claims] (1)被加工金型の被加工面モデルから対称型を構成さ
せ、かつその対称加工面に金属メッキ、スパッタリング
メッキなどを施して、被加工面に一致もしくは対応する
導電研摩面を形成させておき、被加工金型の被加工面と
これに対向配置させた対称型の導電研摩面との間に、所
定の電圧を印加させると共に、対向面間に加工液を供給
し、放電あるいは電解作用を生じさせて、被加工面の研
摩を行なわせるようにしたことを特徴とする金型の研摩
加工方法。
(1) A symmetrical mold is constructed from a model of the workpiece surface of the workpiece mold, and the symmetrical workpiece surface is subjected to metal plating, sputtering plating, etc. to form a conductive polished surface that matches or corresponds to the workpiece surface. A predetermined voltage is applied between the surface of the mold to be machined and a symmetrical conductive polished surface placed opposite thereto, and a machining fluid is supplied between the opposing surfaces to cause electrical discharge or electrolytic action. A method for polishing a mold, characterized in that the surface to be machined is polished by causing
(2)対称型にセラミックスを用いたことを特徴とする
特許請求の範囲第1項記載の金型の研摩加工方法。
(2) The method for polishing a mold according to claim 1, characterized in that ceramic is used for the symmetrical mold.
(3)対称型に樹脂を用いたことを特徴とする特許請求
の範囲第1項記載の金型の研摩加工方法。
(3) The method for polishing a mold according to claim 1, characterized in that a resin is used for the symmetrical mold.
(4)加工液には研摩剤を混合して供給させ、被加工面
、導電研摩面への所定の電圧印加に併せ、機械的振動を
加えて研摩させるようにしたことを特徴とする特許請求
の範囲第1項記載の金型の研摩加工方法。
(4) A patent claim characterized in that the machining fluid is mixed with an abrasive and supplied, and mechanical vibration is applied to the surface to be machined and the conductive polishing surface in conjunction with the application of a predetermined voltage to the surface to be polished. A method for polishing a mold according to item 1.
(5)対称型に通気性を有するセラミックスを用いたこ
とを特徴とする特許請求の範囲第2項記載の金型の研摩
加工方法。
(5) The mold polishing method according to claim 2, characterized in that a symmetrical type of ceramic having air permeability is used.
(6)対称型に通気性を有する樹脂を用いたことを特徴
とする特許請求の範囲第2項記載の金型の研摩加工方法
(6) The method for polishing a mold according to claim 2, characterized in that a resin having air permeability is used in a symmetrical shape.
JP15176785A 1985-07-10 1985-07-10 Grinding method for metal mold Pending JPS6215024A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15176785A JPS6215024A (en) 1985-07-10 1985-07-10 Grinding method for metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15176785A JPS6215024A (en) 1985-07-10 1985-07-10 Grinding method for metal mold

Publications (1)

Publication Number Publication Date
JPS6215024A true JPS6215024A (en) 1987-01-23

Family

ID=15525845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15176785A Pending JPS6215024A (en) 1985-07-10 1985-07-10 Grinding method for metal mold

Country Status (1)

Country Link
JP (1) JPS6215024A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216066A (en) * 1985-07-10 1987-01-24 Origin Electric Co Ltd Output drooping method for power converter
US6417480B2 (en) 1998-11-13 2002-07-09 Mitsubishi Denki Kabushiki Kaisha Method of processing a surface of a mold using electric discharge, an electrode used in such processing and a method of manufacturing such an electrode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6216066A (en) * 1985-07-10 1987-01-24 Origin Electric Co Ltd Output drooping method for power converter
US6417480B2 (en) 1998-11-13 2002-07-09 Mitsubishi Denki Kabushiki Kaisha Method of processing a surface of a mold using electric discharge, an electrode used in such processing and a method of manufacturing such an electrode

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