JPS6214719U - - Google Patents

Info

Publication number
JPS6214719U
JPS6214719U JP10412385U JP10412385U JPS6214719U JP S6214719 U JPS6214719 U JP S6214719U JP 10412385 U JP10412385 U JP 10412385U JP 10412385 U JP10412385 U JP 10412385U JP S6214719 U JPS6214719 U JP S6214719U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
transfer device
reaction gas
wafer transfer
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10412385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10412385U priority Critical patent/JPS6214719U/ja
Publication of JPS6214719U publication Critical patent/JPS6214719U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の装置の一実施例を備えた気相
エピキタシヤル装置の縦断面図、第2図は第1図
の−矢視図、第3図は本考案の装置の他の実
施例を備えた気相エピキタシヤル装置の縦断面図
、第4図は第3図の−矢視図、第5図は第4
図の−矢視図である。 A……反応ガス噴出部、1……板、2……噴出
口、3……半導体ウエハ、4……ガス容器、15
A,15B……流量制御弁、19A,19B……
シリンダ。
FIG. 1 is a longitudinal sectional view of a vapor phase epitaxial device equipped with an embodiment of the device of the present invention, FIG. 2 is a view taken along the - arrow in FIG. 1, and FIG. 3 is another embodiment of the device of the present invention. 4 is a longitudinal sectional view of a vapor phase epitaxial device equipped with
It is a - arrow direction view of a figure. A... Reactive gas ejection part, 1... Plate, 2... Ejection port, 3... Semiconductor wafer, 4... Gas container, 15
A, 15B...Flow rate control valve, 19A, 19B...
Cylinder.

Claims (1)

【実用新案登録請求の範囲】 1 半導体ウエハを浮上させ、その下面にエピキ
タシヤル層を成長形成するための反応ガス噴出部
を備える気相エピキタシヤル装置において、前記
反応ガス噴出部に、半導体ウエハをこの部分より
移送させる移送手段を設けたことを特徴とする半
導体ウエハの移送装置。 2 実用新案登録請求の範囲第1項記載の半導体
ウエハの移送装置において、前記移送手段は、反
応ガス噴出部を複数のガス室に区画し、このガス
室と反応ガス予混合装置との間に、反応ガス流入
量可変機構を設けて構成したことを特徴とする半
導体ウエハの移送装置。 3 実用新案登録請求の範囲第1項記載の半導体
ウエハの移送装置において、前記移送手段は、反
応ガス噴出部を傾動可能に支持し、この反応ガス
噴出部にこれを傾動可能に支持し、この反応ガス
噴出部にこれを傾動させる駆動機構を連結して構
成したことを特徴とする半導体ウエハの移送装置
[Claims for Utility Model Registration] 1. In a vapor phase epitaxial apparatus equipped with a reactive gas jetting part for floating a semiconductor wafer and growing an epitaxial layer on the lower surface thereof, the semiconductor wafer is placed in this part by the reactive gas jetting part. 1. A semiconductor wafer transfer device, comprising a transfer means for transferring a semiconductor wafer. 2 Utility Model Registration Scope of Claim 1 In the semiconductor wafer transfer device as set forth in claim 1, the transfer means divides the reaction gas jetting section into a plurality of gas chambers, and there is a space between the gas chamber and the reaction gas premixing device. A semiconductor wafer transfer device, characterized in that it is configured with a variable reaction gas inflow rate mechanism. 3 Utility Model Registration Scope of Claim 1 In the semiconductor wafer transfer device as set forth in claim 1, the transfer means tiltably supports a reactive gas jetting section, supports the reactive gas jetting section in a tiltable manner, and 1. A semiconductor wafer transfer device comprising a reaction gas ejection section connected to a drive mechanism for tilting the reaction gas ejection section.
JP10412385U 1985-07-10 1985-07-10 Pending JPS6214719U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10412385U JPS6214719U (en) 1985-07-10 1985-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10412385U JPS6214719U (en) 1985-07-10 1985-07-10

Publications (1)

Publication Number Publication Date
JPS6214719U true JPS6214719U (en) 1987-01-29

Family

ID=30977324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10412385U Pending JPS6214719U (en) 1985-07-10 1985-07-10

Country Status (1)

Country Link
JP (1) JPS6214719U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070090752A (en) * 2006-03-02 2007-09-06 신꼬오덴끼가부시끼가이샤 Air cushion unit and production method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070090752A (en) * 2006-03-02 2007-09-06 신꼬오덴끼가부시끼가이샤 Air cushion unit and production method of the same

Similar Documents

Publication Publication Date Title
JPH0554400B2 (en)
JPS6214719U (en)
JPH01119065U (en)
JPS5917420Y2 (en) Spray pressure adjustment device for self-propelled power sprayer
JPH01140816U (en)
JPS60149771A (en) Cvd device
CN2324917Y (en) Stove for chafing-dish with gas filling means
JPS62143803U (en)
JPS62100378U (en)
JPS6382929U (en)
JPS62199152U (en)
JPH0394224U (en)
JPH0158930U (en)
JPS63167725U (en)
JPH02138420U (en)
JPH0450394U (en)
JPH0253959U (en)
JPH0353835U (en)
JPS62148574U (en)
JPH0451130U (en)
JPH0472620U (en)
JPH0425233U (en)
JPH0354402U (en)
JPH0248177U (en)
JPS6365221U (en)