JPS6214489A - High frequency connection line for printed wiring board - Google Patents
High frequency connection line for printed wiring boardInfo
- Publication number
- JPS6214489A JPS6214489A JP15228185A JP15228185A JPS6214489A JP S6214489 A JPS6214489 A JP S6214489A JP 15228185 A JP15228185 A JP 15228185A JP 15228185 A JP15228185 A JP 15228185A JP S6214489 A JPS6214489 A JP S6214489A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- connection line
- conductor pattern
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産−上の１ ）
本発明は、プリント配線板の高周波接続線に関し、特に
プリント配線板において同軸コードを用いずに高周波部
品を接続するための導体パターンとスルーホールめっき
とからなる高周波接続線に関する。[Detailed Description of the Invention] Product 1) The present invention relates to high-frequency connection lines for printed wiring boards, and in particular to conductor patterns and through-hole plating for connecting high-frequency components on printed wiring boards without using coaxial cords. It relates to a high frequency connection line consisting of.
えＸ立且遺
情報化社会の進展に伴ない、電子機器小型化の要求が益
々高まっており、プリント配線板に各種部品を実装する
技術が小型化の一手段として広く採用されている。コン
ピュータや通信回線の回路では数ＭＨｚ以上の高周波に
対しても部品をプリント配線板に実装するが、この場合
には、高同波漏話を低く押えるため同軸コードを使用し
ている。BACKGROUND OF THE INVENTION With the development of an information-oriented society, the demand for miniaturization of electronic devices is increasing, and technology for mounting various components on printed wiring boards has been widely adopted as a means of miniaturization. In circuits for computers and communication lines, components are mounted on printed wiring boards even for high frequencies of several MHz or more, but in this case coaxial cords are used to suppress high-frequency crosstalk.
従来の同軸コードによる接続には、接続前に被覆の端末
部を予め処理する手間を要すること、はんだ付けを必須
とし熟練度の高いはんだ付は作業が不可欠であること、
はんだ付は後ペースト洗浄の後処理の手間がかかること
、信頼性が低いこと等の欠点があった。Connections using conventional coaxial cords require time and effort to prepare the ends of the coating before connection, and soldering is required, requiring highly skilled soldering work.
Soldering has drawbacks such as the time-consuming post-processing of post-paste cleaning and low reliability.
さらに、最近は、プリント配線板が自動設計され、その
組立が自動化され、検査も機械化される傾向にあるが、
同軸コードの使用はこれらの自動化及び機械化を阻害す
る問題点もある。Furthermore, in recent years, there has been a trend toward automatic design of printed wiring boards, automation of their assembly, and mechanization of inspection.
The use of coaxial cords also poses problems that hinder automation and mechanization.
が ・ しよう る、Ｊ′へ
従って、本発明が解決しようとする問題点は、プリント
配線板において同軸コードを用いずに高周波電子部品の
接続をする高周波接続線を提供するにある。Accordingly, the problem to be solved by the present invention is to provide a high-frequency connection line for connecting high-frequency electronic components on a printed wiring board without using a coaxial cord.
措ｎ点 るための−
：ｆＳ１図、第２図及びｆｆ１３図を参照するに、本発
明によるプリント配線板１においては、絶縁基板２の両
面に表面銅箔３及び裏面銅箔４が張られ、両銅箔３．４
は接地される。絶縁基板２は、適当な絶縁材料からなる
板材でよいが、好ましくは、ガラス布基材エポキシ樹脂
積層板、紙基材エポキシ樹脂積層板等により構成される
。接地は、適当な接地ｉａ（図示せず）を銅箔３．４へ
接続することにより行なわれる。Measures to be taken -: Referring to Figs. fS1, Fig. 2, and Fig. ff13, in the printed wiring board 1 according to the present invention, a front copper foil 3 and a back copper foil 4 are pasted on both sides of an insulating substrate 2. , both copper foils 3.4
is grounded. The insulating substrate 2 may be a plate made of a suitable insulating material, but is preferably composed of a glass cloth-based epoxy resin laminate, a paper-based epoxy resin laminate, or the like. Grounding is accomplished by connecting a suitable ground ia (not shown) to the copper foil 3.4.
接＃！銅箔３に形成された導体パターン５は両端にラン
ド６を有し、その両側に臨む部位の前記接地銅箔３．４
に前記導体パターンと平行にスルーホールめっき７の列
を形成する。各スルーホールめっき７は、めっき層８を
有し、両銅箔３．４を１σ絡する。導体パターン５は、
銅箔３若しくは４をエツチングするサブトラクティブ法
、又はそれを銅箔３．４と共に絶縁基板２上に付着する
アディティブ法により形成することができる。Contact#! The conductor pattern 5 formed on the copper foil 3 has lands 6 at both ends, and the ground copper foil 3.4 is located at the portion facing both sides of the land 6.
A row of through-hole plating 7 is formed parallel to the conductor pattern. Each through-hole plating 7 has a plating layer 8 and connects both copper foils 3.4 by 1σ. The conductor pattern 5 is
It can be formed by a subtractive method in which the copper foil 3 or 4 is etched, or an additive method in which it is deposited together with the copper foil 3.4 on the insulating substrate 2.
第２図では各導体パターン５がスルーホールめっき７の
列を有するが、本発明はこれに限定されるものではなく
、第１図に示されるように平行に近接して形成された複
数の導体パターン５の群に対しその両側にスルーホール
めっき７の列を設けてもよい、スルーホールめっき７は
両銅箔３．４を短絡する手段であれば足り、例えば中実
導体でもよい、また、銅箔３．４は、導電性の１層であ
り１例えば金、銀、アルミニウム等の箔や薄膜でもよい
。In FIG. 2, each conductor pattern 5 has a row of through-hole plating 7, but the present invention is not limited to this, and as shown in FIG. A row of through-hole platings 7 may be provided on both sides of the group of patterns 5. The through-hole platings 7 need only be a means of short-circuiting both copper foils 3.4, and may be solid conductors, for example. The copper foil 3.4 is a conductive layer, and may be a foil or thin film of gold, silver, aluminum, etc., for example.
１月
第５図を参照して本発明による高周波接続線の作用を実
験例により説明する。同図右側の線図に示される様な配
δで、２条の長さ約１５０層膳の導体パターン５をプリ
ント配線板（図示せず）上に形成した。即ち、各条の中
央部分１００ ａｍを間隔６ｍｍで平行とし、残余の部
分においては肉条端部相互間の間隔が端末に向は漸次増
大する様に配置した。一方の導体パターン５の一端に信
号ＦＡ９奢！Ｉｉ続しその他端を７５Ωで接地し、他方
の導体パターン５の一端を７５Ωで接地しその他端にレ
ベルメータ９ａを接続した。The operation of the high frequency connection line according to the present invention will be explained by an experimental example with reference to FIG. A conductor pattern 5 with a length of two stripes and approximately 150 layers was formed on a printed wiring board (not shown) with a distribution δ as shown in the diagram on the right side of the figure. That is, the central portions of each strip (100 am) were parallel to each other with an interval of 6 mm, and the remaining portions were arranged so that the spacing between the end portions of the strips gradually increased toward the ends. Signal FA9 is attached to one end of one conductor pattern 5! One end of the other conductor pattern 5 was grounded with 75Ω, and a level meter 9a was connected to the other end.
本発明による高周波接続線の一例として各導体パターン
５に平行にスルーホールめっき７の列ｅ設けた場合と、
比較例としてスルーホールめっき７の列を設けない場合
とについて両導体パターン５間の漏話減衰量を測定した
。結果を第５図のグラフに示す。As an example of the high frequency connection line according to the present invention, a case where a row e of through-hole plating 7 is provided in parallel to each conductor pattern 5,
As a comparative example, the amount of crosstalk attenuation between both conductor patterns 5 was measured in the case where no row of through-hole plating 7 was provided. The results are shown in the graph of FIG.
第３図は、本発明の上記例の導体パターン５及び両側平
行スルーホールめっき７の列からなる高周波接続線の図
式的断面図を示し、第４図は前記比較例の導体パターン
の図式的断面図を示す。FIG. 3 shows a schematic cross-sectional view of a high-frequency connection line consisting of the conductor pattern 5 of the above-mentioned example of the present invention and a row of parallel through-hole platings 7 on both sides, and FIG. 4 is a schematic cross-section of the conductor pattern of the comparative example. Show the diagram.
なお、この例において、導体パターン５の導体幅は０．
８ ｍｓ＋、その公称導体厚は３５μ層、スルーホール
径は０．８ ｍｓ＋、スルーホールめっき間隔は２．５
ａｒｍであった。In this example, the conductor width of the conductor pattern 5 is 0.
8 ms+, its nominal conductor thickness is 35μ layer, through-hole diameter is 0.8 ms+, through-hole plating spacing is 2.5
It was arm.
上記グラフから明らかな様に、本発明によるスルーホー
ルめっき７の夕１を設けた高周波接続線の場合には、比
較例よりも漏話が１ＯｄＢないし３０ｄＢ減少している
。 ３０ｄＢに達する最大漏話減衰量を与える周波数は
、実験的に定めることができる。As is clear from the above graph, in the case of the high frequency connection line provided with the through-hole plating 7 according to the present invention, the crosstalk is reduced by 10 dB to 30 dB compared to the comparative example. The frequency that gives the maximum crosstalk attenuation reaching 30 dB can be determined experimentally.
従って、本発明によれば、例えば、長さ１００ ｔｓ程
度までの接続線を、同軸コードではなく、導体パターン
５とその両側平行スルーホールめっき７の列とを組合わ
せた高周波接続線により、実質上高周波信号の漏洩なし
に提供することができる。Therefore, according to the present invention, for example, a connection line of up to about 100 ts in length can be substantially connected not by a coaxial cord but by a high-frequency connection line that combines a conductor pattern 5 and a row of through-hole plating 7 parallel to both sides of the conductor pattern 5. It can provide high frequency signals without leakage.
導体パターン５の両側に平行スルーホールめっき７の列
を設けることにより大きな漏話減衰量が得られる理由は
、第３図と第４図との比較から認められる様に、前記両
側平行スルーホールめっき７の列が導体パターン５を遮
蔽する効果を有する点にあるものと考えられる。The reason why a large amount of crosstalk attenuation can be obtained by providing rows of parallel through-hole platings 7 on both sides of the conductor pattern 5 is that the rows of parallel through-hole platings 7 on both sides of the conductor pattern 5 are It is considered that the rows have the effect of shielding the conductor pattern 5.
１為」
第６図は、本発明の一実施例として、第１図及び第２図
に示したプリント配線板ｌと同様な高周波接続線を有す
る実設備用配線板１ａに同軸コネクタｌＯ及び高周波リ
レー１１を実装して形成した高周波リレー装置の斜視図
を示す。第７図は、この実施例の動作特性の実測値を示
す、第７図右側接続図の端子Ａ、Ｂ、Ｃ，Ｄ、Ｅ、Ｆは
、第６図の同軸コネクタ６のうち符号Ａ、Ｂ、Ｃ，Ｄ、
Ｅ、Ｆを付されたものに対応する。同図に示される様に
、本発明による高周波接続線を用い、目標規格に定めら
れた周波数１４０８）Ｉｚにおいて目標規格値を上回る
８０ｄＢの漏話減衰量、目標規格値２５ｄＢの不整合減
衰量及び目標規格値を下回る０、２ ｄＢ挿入損失を確
保することができた。FIG. 6 shows, as an embodiment of the present invention, a coaxial connector lO and a high-frequency connection board 1a for actual equipment having high-frequency connection lines similar to the printed wiring board l shown in FIGS. 1 and 2. A perspective view of a high frequency relay device formed by mounting a relay 11 is shown. FIG. 7 shows actual measured values of the operating characteristics of this embodiment. Terminals A, B, C, D, E, and F in the connection diagram on the right side of FIG. B, C, D,
Corresponds to those marked E and F. As shown in the figure, using the high frequency connection line according to the present invention, at the frequency 1408) Iz specified in the target standard, a crosstalk attenuation of 80 dB exceeding the target standard value, a mismatch attenuation of 25 dB, and the target standard value. We were able to secure an insertion loss of 0.2 dB, which is below the standard value.
なお１以上の説明において、プリント配線板は一層の絶
縁板を有するものとしたが、第３図と第４図との比較か
ら明らかな様に、本発明による高周波接続線は、多層プ
リント配線板にも同様に適用されるものである。In the above description, the printed wiring board is assumed to have a single layer of insulating board, but as is clear from the comparison between FIG. 3 and FIG. The same applies to
褒朋ｇ也Σ
以上説明した如く、本発明による配線板の高周波接続線
は、導体パターンとその両側に形成されたスルーホール
めっき列との組合わせを用いるので、次の効果を奏する
。As explained above, the high-frequency connection line of the wiring board according to the present invention uses a combination of a conductor pattern and through-hole plating rows formed on both sides of the conductor pattern, so it has the following effects.
（イ）配線板上の接続線から同軸コードを除き、同軸コ
ードの前処理、はんだ付け、後処理等に要する工数を省
くことができる。(a) By removing the coaxial cord from the connection wires on the wiring board, the number of man-hours required for coaxial cord pre-treatment, soldering, post-treatment, etc. can be saved.
（ロ）配線板の品質が均質化される。(b) The quality of wiring boards becomes uniform.
（ハ）はんだ付けがないので信頼性が向上する。(c) Reliability is improved because there is no soldering.
（ニ）導体パターン及びスルーホールめっきのみからな
るので自動設計が可能である。(d) Since it consists only of conductor patterns and through-hole plating, automatic design is possible.
（ホ）回軸コードを省くので自動組立を容易にする。(E) Automatic assembly is facilitated because the rotation cord is omitted.
第１図は本発明による接続線を設けた配線板の表面図、
第２図はその裏面図、第３図は本発明による接続線の図
式的断面図、第４図は導体パターンの図式的断面図、第
５図は実験例の説明図、第６図は一実施例の斜視図、第
７図は実施例動作特性の説明図である。
１・・・プリント配線板、 ２・・・絶縁基板、
３・・・表面銅箔、 ４・・・裏面銅箔、 ５・・
・導体パターン、 ６・・・ランド、 ７・・・ス
ルーホールめっき、 ８・・・めっき層、 ９・・
・信号源、 ９ａ・・・レベルメータ、 １０・・・
同軸コネクタ、 １１・・・高周波リレー。
特許出願人 大倉電気株式会社
特許出願代理人 弁理士 市東禮次部第３図
第４図
第５図
ｔｏｏ １ＩＸ） ５ＵＪ ａＫＡＪｓｕｕ ＬＭＨ，
１周鷹紋
第６図
ｔｏ フ′ソ）ト配季寥力（FIG. 1 is a surface view of a wiring board provided with connection lines according to the present invention;
FIG. 2 is a back view thereof, FIG. 3 is a schematic sectional view of a connection line according to the present invention, FIG. 4 is a schematic sectional view of a conductor pattern, FIG. 5 is an explanatory diagram of an experimental example, and FIG. FIG. 7, a perspective view of the embodiment, is an explanatory diagram of the operational characteristics of the embodiment. 1...Printed wiring board, 2...Insulating board,
3...Surface copper foil, 4...Back surface copper foil, 5...
・Conductor pattern, 6... Land, 7... Through-hole plating, 8... Plating layer, 9...
・Signal source, 9a...Level meter, 10...
Coaxial connector, 11...High frequency relay. Patent Applicant Okura Electric Co., Ltd. Patent Application Agent Patent Attorney Ichitore Tsugube Figure 3
Figure 4 Figure 5 too 1IX) 5UJ aKAJsuu LMH,
1st lap hawk crest figure 6 to Fu'so)
Claims (1)
銅箔に形成された導体パターンの両側に臨む部位の前記
接地銅箔に前記導体パターンと平行にスルーホールめっ
きの列を形成してなるプリント配線板の高周波接続線。In a wiring board with grounded copper foil on both sides of an insulating board,
A high frequency connection line for a printed wiring board, which is formed by forming a row of through-hole plating parallel to the conductor pattern on the grounded copper foil at a portion facing both sides of the conductor pattern formed on the copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228185A JPS6214489A (en) | 1985-07-12 | 1985-07-12 | High frequency connection line for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228185A JPS6214489A (en) | 1985-07-12 | 1985-07-12 | High frequency connection line for printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6214489A true JPS6214489A (en) | 1987-01-23 |
| JPH0413873B2 JPH0413873B2 (en) | 1992-03-11 |
Family
ID=15537084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15228185A Granted JPS6214489A (en) | 1985-07-12 | 1985-07-12 | High frequency connection line for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214489A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05206678A (en) * | 1992-01-28 | 1993-08-13 | Nec Corp | Multilayer interconnection board |
| US6635853B2 (en) | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52136362A (en) * | 1976-05-10 | 1977-11-15 | Hitachi Ltd | Parallel pattern bus line |
| JPS5536901A (en) * | 1978-08-25 | 1980-03-14 | Fujitsu Ltd | Printed board |
| JPS5723001U (en) * | 1980-07-14 | 1982-02-05 | ||
| JPS5929801U (en) * | 1982-08-18 | 1984-02-24 | 三菱電機株式会社 | semiconductor phase shifter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5929801B2 (en) * | 1976-04-12 | 1984-07-23 | 松下電器産業株式会社 | Vehicle detection device |
| JPS5571801A (en) * | 1978-11-20 | 1980-05-30 | Ando Kou | Skirt cutting method |
-
1985
- 1985-07-12 JP JP15228185A patent/JPS6214489A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52136362A (en) * | 1976-05-10 | 1977-11-15 | Hitachi Ltd | Parallel pattern bus line |
| JPS5536901A (en) * | 1978-08-25 | 1980-03-14 | Fujitsu Ltd | Printed board |
| JPS5723001U (en) * | 1980-07-14 | 1982-02-05 | ||
| JPS5929801U (en) * | 1982-08-18 | 1984-02-24 | 三菱電機株式会社 | semiconductor phase shifter |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635853B2 (en) | 1909-08-09 | 2003-10-21 | Ibiden Co., Ltd. | Hot plate unit |
| JPH05206678A (en) * | 1992-01-28 | 1993-08-13 | Nec Corp | Multilayer interconnection board |
| US6639191B2 (en) | 1999-01-25 | 2003-10-28 | Ibiden Co., Ltd. | Hot plate unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0413873B2 (en) | 1992-03-11 |
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