JPS62141069U - - Google Patents
Info
- Publication number
- JPS62141069U JPS62141069U JP2829886U JP2829886U JPS62141069U JP S62141069 U JPS62141069 U JP S62141069U JP 2829886 U JP2829886 U JP 2829886U JP 2829886 U JP2829886 U JP 2829886U JP S62141069 U JPS62141069 U JP S62141069U
- Authority
- JP
- Japan
- Prior art keywords
- hooking
- semiconductor device
- separated
- utility
- during use
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Description
第１図乃至第２図は本考案の実施例図、第３図
、第４図は従来例図である。
FIGS. 1 and 2 are illustrations of an embodiment of the present invention, and FIGS. 3 and 4 are illustrations of a conventional example.
Claims (1)
用時に組合わせて使うように構成したことを特徴
とする半導体装置めつき引掛治具。 A semiconductor device plating hooking jig, characterized in that the hooking pin is separated from the hooking jig body and is configured to be used in combination during use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829886U JPS62141069U (en) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2829886U JPS62141069U (en) | 1986-02-27 | 1986-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62141069U true JPS62141069U (en) | 1987-09-05 |
Family
ID=30831124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2829886U Pending JPS62141069U (en) | 1986-02-27 | 1986-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62141069U (en) |
-
1986
- 1986-02-27 JP JP2829886U patent/JPS62141069U/ja active Pending