JPS62138576A - Peeling of surface-protecting adhesive film - Google Patents

Peeling of surface-protecting adhesive film

Info

Publication number
JPS62138576A
JPS62138576A JP27828385A JP27828385A JPS62138576A JP S62138576 A JPS62138576 A JP S62138576A JP 27828385 A JP27828385 A JP 27828385A JP 27828385 A JP27828385 A JP 27828385A JP S62138576 A JPS62138576 A JP S62138576A
Authority
JP
Japan
Prior art keywords
adhesive
film
peeling
adhesive film
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27828385A
Other languages
Japanese (ja)
Other versions
JPH0781118B2 (en
Inventor
Tomohisa Oota
共久 太田
Akihiko Dobashi
明彦 土橋
Toshishige Uehara
寿茂 上原
Kazunori Sakuma
和則 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP60278283A priority Critical patent/JPH0781118B2/en
Publication of JPS62138576A publication Critical patent/JPS62138576A/en
Publication of JPH0781118B2 publication Critical patent/JPH0781118B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To accomplish ready peeling without any problem of transfer, of the titled film by irradiation on said film to cure the adhesive thereon after its service termination which protected the surface of an adhered such as metal plate by lamination thereon of a film prepared by coating a base with a specific adhesive. CONSTITUTION:An adhesive film obtained by coating a base with an adhesive comprising (A) 100pts.wt. of an acrylic copolymer with a glass transition point -30-30 deg.C and weight-average molecular weight >=50,000 and (B) 50-200pts.wt of a radiation-curable polyfunctional liquid resin (pref. with >=4 acryloyl groups, or an oligomer) is laminated on an adhered such as metal plate or aluminum sash. After the service termination, the back surface of the base is subjected to radiation to cure said adhesive, followed by peeling the adhesive film off the adherend.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は金属機、アルミサツシ、グラスチック板、半導
体ウェーハ、ガラスなどの被着体の運搬、加工、切断時
の傷、汚染防止、保持のため一時的な表面保誇用粘着フ
ィルムの剥離方法に関する。
Detailed Description of the Invention (Industrial Application Field) The present invention is useful for preventing scratches, contamination, and holding of adherends such as metal machines, aluminum sashes, glass plates, semiconductor wafers, and glass during transportation, processing, and cutting. The present invention relates to a method for peeling an adhesive film for temporary surface preservation.

(従来の技術〉 従来、一時的な表面保護材料として、紙・布・グラスチ
ックフィルムなどの基材に天然ゴム、合成ゴムなどを主
成分とする粘着剤を塗布し之構成からなる粘着フィルム
が用いらnてき之。
(Conventional technology) Conventionally, adhesive films consisting of a base material such as paper, cloth, or glass film coated with an adhesive mainly composed of natural rubber or synthetic rubber have been used as temporary surface protection materials. I can't use it.

この粘着フィルムは貼合わせの簡便さから広く用いられ
ているが、粘着剤が極めて不安定で塑性変形しやすい材
料であるため、次のような欠点を有していた。
Although this adhesive film is widely used because of its ease of lamination, it has the following drawbacks because the adhesive is extremely unstable and is a material that easily undergoes plastic deformation.

(1)被着体に貼付けたのち、被着体表面上の微細なり
レバスに粘着剤が良く流入し、接触面積を増す友め接着
力は短時間に大きくなり過ぎ剥離し難くなる。
(1) After being attached to an adherend, the adhesive flows well into the fine recesses on the surface of the adherend, increasing the contact area and increasing the adhesive force in a short period of time, making it difficult to peel off.

(2)凝集力が小さいために剥離するとき、粘着剤層間
の破壊が生じ被着体上に転着しやすい。
(2) Since the cohesive force is small, when the adhesive layer is peeled off, the adhesive layer is likely to break and be transferred onto the adherend.

これらの粘着フィルムの欠点に対して、粘着剤全架橋す
ること、高分子量のゴムを使用することにより粘着剤の
塑性変形をある程度抑制したり、凝集力を増すなどの提
案がなさnているが、前記欠点は常温で被着体に容易に
貼り付けられることの条件下では基本的には解決されて
いない。一般に粘着フィルムが工業的に被着体上に貼付
けられた時に必要な接着力は180゜方向、6QQrn
m/分の速度で剥離したとき、単純な運搬時の保護のみ
の場合でも50 g/251IIm以上、曲げ、絞りな
どの加工を行う場合には200g/25mn+以上、I
Cウェハーのフルカット加工などでは500 g−/ 
2 S玉取上も必要とする。
To address these drawbacks of adhesive films, there have been no proposals to suppress plastic deformation of the adhesive to some extent or increase cohesive strength by fully crosslinking the adhesive or using high molecular weight rubber. However, the above drawbacks have not been fundamentally solved under the condition that the adhesive can be easily attached to an adherend at room temperature. Generally, when an adhesive film is applied industrially to an adherend, the adhesive force required is 180° direction, 6QQrn.
When peeled off at a speed of m/min, 50 g/251 IIm or more for simple protection during transportation, 200 g/25 m+ or more for bending, drawing, etc.
For full-cut processing of C wafers, etc., 500 g-/
2 It is also necessary to pick up the S ball.

一力、剥離作業性の点からは低けnば低い力が好ましく
 200 g/25mm以上になわば、剥離作業が困難
になってくる。粘着フィルムの接着力の設定は貼付時に
必要な最低の接層力を設定して行わnるが加工から剥離
までの時間は種々の行程を経るため、長時間全会し、剥
離する際の接着力は加工時より一段と高くなっているの
が普通であり剥離作業が更に困難になるとともに、粘着
剤が被着体上に転着しやすくなる。
From the viewpoint of peeling workability, a lower force is preferable; if the force exceeds 200 g/25 mm, the peeling work becomes difficult. The adhesive strength of the adhesive film is set by setting the minimum contact strength required at the time of application, but since the time from processing to peeling goes through various processes, the adhesive strength at the time of peeling is determined after a long period of time. Usually, the pressure is higher than during processing, making the peeling process more difficult and making it easier for the adhesive to transfer onto the adherend.

本発明者らは先に透明なプラスチックフィルム基材に光
硬化性を有する粘着剤を塗布してなる粘着フィルムを被
着体へ貼付け、用に供した後前記フィルム基材表面に紫
外線を照射することにより粘着剤を架橋硬化することに
より接着力が低下し剥離し易くなることを児出し提案し
た。(%公昭58−50164号) (発明が解決しようとする問題点) しかしながら、絞り加工の高度化、あるいは最近のエレ
クトロニクス産業の進歩、自動化に伴なって粘着フィル
ムの要求特性も高くなってきている。本発明はか〜る状
況に鑑みなされたものであって、用B#には一定以上の
接着力を有し、用済み後は容易に剥離することのできる
表面保護フィルムとその剥離方法を提供せんとするもの
である。
The present inventors first applied an adhesive film made by applying a photocurable adhesive to a transparent plastic film base material to an adherend, and after use, irradiated the surface of the film base material with ultraviolet rays. It was proposed that by crosslinking and curing the adhesive, the adhesive force would be reduced and it would be easier to peel off. (% Publication No. 58-50164) (Problem to be solved by the invention) However, with the increasing sophistication of drawing processing and the recent progress and automation of the electronics industry, the required characteristics of adhesive films have also become higher. . The present invention has been made in view of the above circumstances, and provides a surface protection film that has adhesive strength above a certain level for B# and can be easily peeled off after use, and a method for peeling the same. This is what I am trying to do.

(問題点を解決するための手段) かかる目的は本発明によnば、カラス転移点(以下Tg
)  か−、50’C〜sa’cで重量平均分子量が5
0万以上のアクリル系共重合体100M清部と放射線硬
化する多官能液状樹脂50〜200重量部からなる粘着
剤を基材に塗布した粘着フィルムを被着体に貼付は用に
供しt後、その基材背面より放射線を照射して粘着剤を
硬化させ、しかる後被着体よシ剥離することにより目的
を達成することができる。
(Means for Solving the Problems) According to the present invention, this purpose is achieved by determining the crow transition point (hereinafter Tg
), 50'C to sa'c, weight average molecular weight is 5
A pressure-sensitive adhesive film made of a base material coated with an adhesive consisting of a 100M acrylic copolymer and 50 to 200 parts by weight of a radiation-curable multifunctional liquid resin is applied to an adherend. The purpose can be achieved by irradiating radiation from the back side of the base material to harden the adhesive, and then peeling it off from the adherend.

本発明のアクリル系共重合体について説明する。The acrylic copolymer of the present invention will be explained.

生モノマの(メタンアクリル酸エステルとしてはアルキ
ル基の炭素数1〜12のものが好ましく、特に有利なも
のはエテルアクリレート、ブチルアクリレート、2−エ
チルへキシルアクリレート、メチルメタクリレート、ブ
チルメタクリレートなどである。
As the raw monomer (methane acrylate ester), those having an alkyl group of 1 to 12 carbon atoms are preferred, and particularly preferred are ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, butyl methacrylate, and the like.

また官能性モノマとして、アクリル酸メタクリル酸、ハ
イドロキシエチルアクリレート、ハイドロキシプロピル
メタクリレート、グクリルアミド、N−メチロールアク
リルアミドなどを架橋を行わせるために共重合させる場
合もある。
Further, as a functional monomer, acrylic acid methacrylic acid, hydroxyethyl acrylate, hydroxypropyl methacrylate, gucrylamide, N-methylol acrylamide, etc. may be copolymerized for crosslinking.

その他のビニルモノマとして酢酸ビニル、アクリロニト
リル、スチレンなども7g51節のために使用される。
Other vinyl monomers such as vinyl acetate, acrylonitrile, and styrene are also used for Section 7g51.

一方、凝集力を調節の意味において、上記アクリル系共
重合体の1分子中に通常の方法(エポキシ−酸の反応、
ハーフウレタンの利用など)より、不飽和二重納会を導
入することもできる。
On the other hand, in the sense of controlling the cohesive force, one molecule of the above acrylic copolymer is added by the usual method (epoxy-acid reaction,
(e.g. use of half urethane), it is also possible to introduce unsaturated double urethane.

なお、先に述べ友Tgは、共重合体の溝底モノマの重量
比からGorden−Tayloヒの式に従う計算値で
ある。一般には動的粘弾性装置、示差熱分析などにより
測定される。
The above-mentioned Tg is a value calculated from the weight ratio of the bottom monomer of the copolymer according to the Gorden-Taylo formula. It is generally measured using a dynamic viscoelastic device, differential thermal analysis, etc.

そのTgは一50℃〜30℃の範囲で、好ましくは一1
0℃〜20℃である。−30℃以下の場合、放射線照射
後でも粘着性であり、接着力の低下が少なく効果が低い
。+60℃では逆に接着力が低く被着体への貼付性が悪
いからである。
Its Tg is in the range of -50°C to 30°C, preferably -11°C.
It is 0°C to 20°C. When the temperature is -30° C. or lower, the adhesive remains sticky even after radiation irradiation, and the adhesive strength is less reduced and the effect is low. This is because, on the contrary, the adhesive strength is low at +60° C. and the adhesion to the adherend is poor.

次に重量平均分子量(以下Mwという)であるが、一般
的に高速液体クロマトグラフ、光散乱法、超遠心法など
により011足される値である。
Next is the weight average molecular weight (hereinafter referred to as Mw), which is generally a value added by 011 using high performance liquid chromatography, light scattering method, ultracentrifugation method, etc.

そしてそのMWは507j以上必要である。50万以下
では多量の多官能液状イ1脂を混合するため粘着剤1の
凝集力が不足し、巻き取りt場合背面に移行するのでス
′I型紙等を必要とする。
And its MW needs to be 507j or more. If it is less than 500,000 yen, a large amount of multifunctional liquid 1 fat is mixed, so the cohesive force of the adhesive 1 is insufficient, and when it is rolled up, it migrates to the back side, so a paper pattern or the like is required.

本発明の必須成分である放射劇硬化する多首能泡状仙脂
としては1.4−ブタンジオールジアクリレート、1.
6−ヘキサンジオールジアクリレート、ジエチレングリ
コールジアクリレート、ポリエチレングリコールジアク
リレート(n=5〜14)、ネオペンチルグリコールジ
アクリレート、ジプロピレングリコールジアクリレート
、2.2−ビス(4−アクリロキシジェトキシフェニー
ル)フロパン、トリメチロールプロパントリアクリレー
ト、ペンタエリスリトールテトラアクリレート、さらに
日本化薬製多官能モノマでεる商品名KAYARAD 
 D−[10(5個のアクリロイル基)、D−320(
4個)、D   5 5 0  (5イ[i!j ) 
、 DPHA(616]) 、 DPCA−20(6イ
l) 、 DPCA−,5CJ  (6([1i1) 
%DPCA−60(6個)、DPCA−120(611
1)、東亜せ成化学喪多官能オリゴマである酉品名アロ
二ツクスM−400(5個以上)。
The radiation-hardening, multi-headed foamy sesame oil, which is an essential component of the present invention, includes 1.4-butanediol diacrylate, 1.
6-hexanediol diacrylate, diethylene glycol diacrylate, polyethylene glycol diacrylate (n=5-14), neopentyl glycol diacrylate, dipropylene glycol diacrylate, 2,2-bis(4-acryloxyjethoxyphenyl)furopane , trimethylolpropane triacrylate, pentaerythritol tetraacrylate, and the product name KAYARAD, which is made of polyfunctional monomers manufactured by Nippon Kayaku.
D-[10 (5 acryloyl groups), D-320 (
4 pieces), D 5 5 0 (5i [i!j)
, DPHA(616]), DPCA-20(6il), DPCA-,5CJ(6([1i1)
%DPCA-60 (6 pieces), DPCA-120 (611
1), Toasei Chemical's multi-functional oligomer Aronix M-400 (5 or more).

M−7100(5個以上)M−8060(3個以上)、
M−8060(3個以上、M−8100(5個以上〕な
どのアクリロイル基付与の液状イg1脂とそnぞnに対
応するメタクリロイル基樹脂が主として挙げられる。
M-7100 (5 or more pieces) M-8060 (3 or more pieces),
Main examples include liquid resins with acryloyl groups such as M-8060 (3 or more, M-8100 (5 or more)) and methacryloyl group resins corresponding to acryloyl group-added resins.

その他に生鎖示(メタノアクリルgアルキルエステルを
はじめ、ポリオール、ポリエステル、ウレタン、エポキ
シ糸などで分子内に1個以上の(メタ)アクリロイル基
を末端あるいは911j鎖に有するオリゴマ、つ−!シ
通常は液状で常温での粘度がI O”cps以下のもの
も含む。
In addition, oligomers with one or more (meth)acryloyl groups in the molecule at the end or in the 911j chain, such as methanoacrylic alkyl esters, polyols, polyesters, urethane, and epoxy threads, are also commonly used. also includes those that are liquid and have a viscosity of IO"cps or less at room temperature.

特に効果の大きい液状樹脂としてはペンタエリスリトー
ルテトラアクリレートKAYARADD−410、D−
520% DPCA−20゜50.60,120.DP
HA、M−400などアクリロイル基が4個以上付与し
たモノマあるいはオリゴマで6る。
Particularly effective liquid resins include pentaerythritol tetraacrylate KAYARADD-410, D-
520% DPCA-20゜50.60,120. DP
Monomers or oligomers to which four or more acryloyl groups are added, such as HA and M-400.

なお、上記粘着剤の凝集力を向上させるためにインシア
ネート、メラミンなどの架橋剤を加えるなシ、史に必要
に応じて粘着付与剤、軟化剤、酸化防止剤、光項剤、朗
科等を混入する場合がある。
In addition, do not add crosslinking agents such as incyanate or melamine to improve the cohesive force of the above-mentioned adhesive, and add tackifiers, softeners, antioxidants, light additives, light chemicals, etc. as necessary. It may be mixed.

これらの組成からなる粘着剤を通常の一一ルコータなど
の方法により基材に塗工し、粘着フィルムを得る。
A pressure-sensitive adhesive having these compositions is applied to a base material using a conventional coating method to obtain a pressure-sensitive adhesive film.

なお、前述の放射線とは活性エネルギ線でα鞠、β線、
γ線、中性子線、加速電子線のような電線性放射線並び
に紫外線を官う。
Note that the radiation mentioned above refers to active energy rays, including α-rays, β-rays,
It emits electrical radiation such as gamma rays, neutron beams, accelerated electron beams, and ultraviolet rays.

こnらの照射は基材フィルム全通して行わnるので空気
中の酸累はおのずと遮@されているため、硬化反応は速
やかに進行する。
Since these irradiations are performed through the entire base film, acid buildup in the air is naturally blocked, and the curing reaction proceeds quickly.

また、紫外線の場合、透過性の点で基材はポリエチレン
、ポリ塩化ビニル、ポリエステルなどの透明なプラスチ
ックフィルムに限足さnる。
Furthermore, in the case of ultraviolet rays, the base material is limited to transparent plastic films such as polyethylene, polyvinyl chloride, and polyester due to their transparency.

また、硬化促進剤としてベンジル、ベンゾフェノン、ベ
ンシイ゛ン、ベンゾインエチルエーテルなどの増感剤を
多くの場合、粘涜坤j中に1〜20重ii1%混台する
Further, as a curing accelerator, a sensitizer such as benzyl, benzophenone, benzine, benzoin ethyl ether, etc. is often mixed in the viscous solution in an amount of 1 to 20% by weight.

(作用) 本発明において、粘着剤はアクリル系共重付体と相浴性
の良い多官能液状樹脂の構成からなる。またアクリル系
共重付体が高Tg、i14分子tであるため、液状樹脂
を多titK配付しても。
(Function) In the present invention, the adhesive is composed of a multifunctional liquid resin having good compatibility with an acrylic copolymer. Also, since the acrylic copolymer has a high Tg and i14 molecule t, it can be used even if a liquid resin is distributed in a large amount.

一定の接着力と凝集力があり、背面転層することなく巻
き取ることが可能である。この粘着フィルムを被看体へ
貼り付け、運搬、保持、加工。
It has a certain adhesive strength and cohesive strength, and can be rolled up without back-to-back layering. This adhesive film is pasted onto the patient, transported, held, and processed.

切断などの用に供しfc、後の剥離前に放射線を照射す
nば、液状樹脂の官能基であるアクリロイル基が重付、
架橋などの隅分子化して、粘沼剤が硬化し、接着力を低
下させるとともに転着が極めて生じ難くなる。その接着
力低下の理由は塑性a動による仕事量が小さくなるため
と思わnる。
If it is used for cutting, etc., and then irradiated with radiation before peeling, the acryloyl group, which is a functional group of the liquid resin, becomes heavy.
The viscous agent hardens due to crosslinking and other corner molecules, lowering the adhesive strength and making it extremely difficult for transfer to occur. The reason for the decrease in adhesive strength is thought to be that the amount of work due to plastic motion is reduced.

以下実施例をもって説明する。This will be explained below using examples.

(実施例J 実施例1〜6 アクリロニトリル(Tg二96℃)、プチルアクリレー
ト(Tg−54℃)、アクリル酸(Tgコ105℃)の
配付組成でTg1分子量か異なる6棹のアクリルゴムを
乳化重合法で台底した。
(Example J Examples 1 to 6) Six acrylic rubbers with different distribution compositions of acrylonitrile (Tg - 96°C), butyl acrylate (Tg - 54°C), and acrylic acid (Tg - 105°C) and Tg 1 molecular weight were emulsified. It was legal and hit rock bottom.

その特性は、実施例1(Tgニー50℃、Mw=105
万)、2 (−20’C,85万)、6(−10℃、6
0万)、4(0℃、110万)、5(20℃、70万)
、6(60℃、90万)である。
Its characteristics are shown in Example 1 (Tg knee 50°C, Mw=105
10,000), 2 (-20'C, 850,000), 6 (-10'C, 6
00,000), 4 (0℃, 1.1 million), 5 (20℃, 700,000)
, 6 (60°C, 900,000).

そnらアクリル系共重合体100部に4官能モノマであ
るペンタエリスリトールテトラアクリレート75部、増
感剤のベンゾフェノン10部を添加した粘着剤を10%
トルエン浴漱に希釈し% 60μのボ1ノエチレンフィ
ルムに固形分塗布量が15μになるようにトップリバー
スロールコータで塗工し、100℃5分wi、燥し粘着
フィルムを製造した。
10% adhesive is made by adding 75 parts of pentaerythritol tetraacrylate, which is a tetrafunctional monomer, and 10 parts of benzophenone, which is a sensitizer, to 100 parts of acrylic copolymer.
The mixture was diluted with toluene bath water, applied to a 60μ% polyethylene film using a top reverse roll coater so that the solid content coating amount was 15μ, and dried at 100°C for 5 minutes to produce an adhesive film.

この粘着フィルムを厚さQ、 5 mmの5US450
−2B機に常温で貼付けfc後、1ケ月間放面した。こ
のSO8檄のフィルム表面上から2k11の高圧水澗灯
で紫外称と15秒照射し、10分後に剥離した。各段階
での接着力、転着の有無をb・テベた。さらに同じSU
S板で深さ5mmのエリクセン絞り試験を行い、同様に
前述の紫外軸を照射し、その時の転着状態を調べた。以
上の結果を表1にまとめて示す。
This adhesive film is 5US450 with a thickness Q of 5 mm.
-2B machine at room temperature and exposed for one month after fc. The surface of this SO8 film was irradiated with ultraviolet light for 15 seconds using a 2k11 high-pressure water lamp, and peeled off after 10 minutes. The adhesive strength and presence or absence of adhesion at each stage were checked. Furthermore, the same SU
An Erichsen drawing test was conducted at a depth of 5 mm using the S plate, and the above-mentioned ultraviolet axis was irradiated in the same manner, and the state of adhesion at that time was investigated. The above results are summarized in Table 1.

比較例+、  2. 5 実施例と同様にして5独のアクリルゴム〔比較例1(T
gニー40℃、M〕=80万八2(−20℃、50万)
、5(40℃、80万)〕を台成し、4官飽モノマ、増
感剤全配付して粘着フィルムを製造した。
Comparative example +, 2. 5 In the same manner as in Example 5, German acrylic rubber [Comparative Example 1 (T
g knee 40℃, M] = 800,00082 (-20℃, 500,000)
.

比較例4,5 実施?111のアクリルゴムに2官能モノマの1゜6−
ヘキサンジオールジアクリレート、ベンゾフェノンを同
じく配付して粘着フィルム(比較例4)、実施例4のア
クリルゴムに%2官能モノマ、ベンゾフェノンを配合し
た粘Nフィルム(比較例5)を製造し、実施例にある試
験を行い、その結果を表1に示す。
Comparative Examples 4 and 5 Implementation? 1゜6- of bifunctional monomer in 111 acrylic rubber
An adhesive film (Comparative Example 4) was prepared by distributing hexanediol diacrylate and benzophenone in the same manner, and a viscous N film (Comparative Example 5) was prepared by blending the acrylic rubber of Example 4 with %2 functional monomer and benzophenone. A certain test was conducted and the results are shown in Table 1.

実施例7〜12 実施例1〜6のアクリル系共重付体100部に6′ビ能
モノマ(日本化薬仔有商品名KAYARAD  DPH
A)100部、ベンゾフェノン10部を絵加した粘着剤
を40μのポリエステルフィルムに固形分塗布厚10μ
になるように塗工し、粘着フィルムを作成した。この粘
着フィルムに集積回路を形成した100mIllφのウ
ェハを回路面が露出するように貼付け、50. OOO
RP Mのダイヤモンド回転歯でフルカットし、1[]
+1111+角のチップを@た。粘着フィルムからの剥
離は紮外勝照射り・、真空吸引により行った。
Examples 7 to 12 100 parts of the acrylic copolymer of Examples 1 to 6 was added with a 6'-binol monomer (Nippon Kayaku Co., Ltd. trade name: KAYARAD DPH).
A) Apply an adhesive containing 100 parts of benzophenone and 10 parts of benzophenone to a 40μ polyester film with a solid content coating thickness of 10μ.
An adhesive film was created. 50. A wafer of 100 milliφ on which an integrated circuit is formed is attached to this adhesive film so that the circuit surface is exposed. OOO
Full cut with RP M diamond rotating teeth, 1[]
+1111+ square chip @. Peeling from the adhesive film was performed by irradiation and vacuum suction.

比較例6〜10 比V例1〜5の粘M剤をポリエステル基材に塗布し、ダ
イシング用として使用した。
Comparative Examples 6 to 10 The viscous M agents of Ratio V Examples 1 to 5 were applied to a polyester base material and used for dicing.

表2に、その評価結果をまとめて示す。Table 2 summarizes the evaluation results.

(発明の効果) 以上のように高Tg、g分子量のアクリル系共軍台俸と
多官龍孜状欄脂からなる表面保h≠用粘着フィルムは直
型紙を介在することなく巻き′+′//JKすることが
でき、被看体に貼り付け、剥離前に放射線を照射してそ
の粘涜剤全硬化させるCとによって従来の粘層フィルム
の欠点でろ為剥購性を大幅に改善することが司能になっ
た。
(Effects of the Invention) As described above, the adhesive film for surface retention consisting of high Tg, g molecular weight acrylic adhesive and polygonal resin can be rolled without intervening straight paper. //JK can be pasted on the patient, and before peeling off, radiation is irradiated to completely cure the detoxifying agent (C), which greatly improves peelability, eliminating the shortcomings of conventional adhesive films. Koto became the chief priest.

Claims (1)

【特許請求の範囲】 1、ガラス転移点が−30℃〜30℃で、重量平均分子
量が50万以上のアクリル系共重合体100重量部と、
放射線硬化する多官能液状樹脂50〜200重量部から
なる粘着剤を基材に塗布した粘着フィルムを被着体に貼
付け用に供した後、その基材背面より放射線を照射して
粘着剤を硬化させ、しかる後被着体より剥離することを
特徴とする表面保護用粘着フィルムの剥離方法。 2、多官能液状樹脂が4個以上のアクリロイル基を持つ
モノマあるいはオリゴコである特許請求範囲第1項記載
の表面保護粘着フィルムの剥離方法。
[Claims] 1. 100 parts by weight of an acrylic copolymer having a glass transition point of -30°C to 30°C and a weight average molecular weight of 500,000 or more;
After applying an adhesive film on a substrate with an adhesive consisting of 50 to 200 parts by weight of a radiation-curable polyfunctional liquid resin, the adhesive film is applied to an adherend, and then radiation is irradiated from the back side of the substrate to harden the adhesive. 1. A method for peeling an adhesive film for surface protection, the method comprising: removing the adhesive film from the adherend; 2. The method for peeling a surface protection adhesive film according to claim 1, wherein the polyfunctional liquid resin is a monomer or oligomer having four or more acryloyl groups.
JP60278283A 1985-12-11 1985-12-11 Surface protection method for semiconductor wafer Expired - Lifetime JPH0781118B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60278283A JPH0781118B2 (en) 1985-12-11 1985-12-11 Surface protection method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60278283A JPH0781118B2 (en) 1985-12-11 1985-12-11 Surface protection method for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS62138576A true JPS62138576A (en) 1987-06-22
JPH0781118B2 JPH0781118B2 (en) 1995-08-30

Family

ID=17595190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60278283A Expired - Lifetime JPH0781118B2 (en) 1985-12-11 1985-12-11 Surface protection method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPH0781118B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184521A (en) * 1992-12-21 1994-07-05 Nichiban Co Ltd Surface-protecting material and method for forming the same
JP2000044890A (en) * 1998-07-31 2000-02-15 Nippon Synthetic Chem Ind Co Ltd:The Peelable type tacky agent composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555975A (en) * 1978-06-29 1980-01-17 Nitto Electric Ind Co Ltd Surface protection film for sheet metal processing
JPS5850164A (en) * 1981-09-19 1983-03-24 Nippon Steel Corp Continuous casting installation
JPS5989381A (en) * 1982-11-11 1984-05-23 Sekisui Chem Co Ltd Production of adhesive tape
JPS5996917A (en) * 1982-11-27 1984-06-04 Nitto Electric Ind Co Ltd Forming method of surface protection layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS555975A (en) * 1978-06-29 1980-01-17 Nitto Electric Ind Co Ltd Surface protection film for sheet metal processing
JPS5850164A (en) * 1981-09-19 1983-03-24 Nippon Steel Corp Continuous casting installation
JPS5989381A (en) * 1982-11-11 1984-05-23 Sekisui Chem Co Ltd Production of adhesive tape
JPS5996917A (en) * 1982-11-27 1984-06-04 Nitto Electric Ind Co Ltd Forming method of surface protection layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184521A (en) * 1992-12-21 1994-07-05 Nichiban Co Ltd Surface-protecting material and method for forming the same
JP2000044890A (en) * 1998-07-31 2000-02-15 Nippon Synthetic Chem Ind Co Ltd:The Peelable type tacky agent composition

Also Published As

Publication number Publication date
JPH0781118B2 (en) 1995-08-30

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