JPS62136595A - Nickel plating method - Google Patents

Abstract

PURPOSE:To smoothly form a nickel film with good current efficiency by bringing a cobalt plating metallic ingot near to the low current density section of a material to be plated and immersing the same together with a nickel electrode into a plating cell. CONSTITUTION:An electroforming matrix 1 having a recessed sectional shape, etc. and the nickel electrode 3 are immersed into the nickel plating cell 12. The cobalt plating metallic ingot 4 is fixed in proximity to the low current density section in the recess 2 of the electroforming matrix 1. The anode of a DC power source 13 is connected via an electric power feeder 15 to the cobalt plating metallic ingot 4 and the anode of a power source 14 is connected to the nickel electrode 3. The cathodes of the power sources 13, 14 are connected to the electroforming matrix 1 by using the feeder 16. Current of about 1-6A/dm<2> current density is supplied to the matrix and the ingot respectively so that the nickel is deposited on the matrix. The nickel film of the substantial thickness is also formed in the low current density recess 2 of the matrix 1 without the embrittlement of the deposited nickel by the above-mentioned method.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、電気ニッケルメッキ方法、特に深い凹部を持
つ形状の物体にニッケルメッキを施す方法の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an improvement in an electrolytic nickel plating method, particularly a method for applying nickel plating to an object having a shape having a deep recess.

（従来技術） 電気メッキは安価な金属の表面を他の金属で被覆し、優
れた特性を持たせる事ができるため、また、物品の表面
を緻密に覆い、ネｈ密な形状模写ができるため、装飾、
防食、表面硬化、電鋳その他、多用途にわたって利用さ
れている。特に、電気ニッケルメッキは、ニッケルの優
れた性質より非常に広範囲にわたって活用される技術で
ある。しかしながら、電気ニッケルメッキを例えばリッ
プ溝型鋼のような断面Ｃ字状物のように、深い凹部を持
ちニッケル陽極に対して影になる部分のある物体に施す
場合には、影の部分の電流密度が低く該部分のメッキの
付きまわりが悪く良好な結果を得にくい。そこで、上述
のような影になる部分に補助陽極を近接し、該部分の電
流密度を高めてメッキの付きまわりを向上させる方法が
一般に採用され、補助陽極として純ニッケル塊、ニッケ
ルに０゜０１〜０．１％の微量の硫黄又は燐を添加した
もの、チタン又はチタンの表面に白金メッキを施したも
の等を被メッキ物にあわせて加工したものが一般に使用
されている。(Prior art) Electroplating can cover the surface of inexpensive metals with other metals to give them superior properties, and it can also cover the surface of objects densely and reproduce precise shapes. , decoration,
It is used for a variety of purposes, including corrosion prevention, surface hardening, electroforming, and more. In particular, electrolytic nickel plating is a technique that is widely used due to the excellent properties of nickel. However, when electrolytic nickel plating is applied to an object with a deep recess and a shaded area relative to the nickel anode, such as a C-shaped cross section such as lip groove steel, the current density in the shaded area is It is difficult to obtain good results because the coverage of the plating on the area is low and the coverage of the plating is poor. Therefore, a method is generally adopted in which an auxiliary anode is placed close to the shadowed area as described above to increase the current density in that area and improve the coverage of the plating. Generally used are those to which a trace amount of sulfur or phosphorus (~0.1%) is added, titanium or titanium whose surface is plated with platinum, and processed to match the object to be plated.

しかし、これら従来の補助陽極は、全て陽極電位が高く
通電性が悪く陽極電流効率が悪い。また、その他特に、
純ニッケルを利用した場合には、不溶解のニッケル粒が
発生し、メッキ液中に分散し、それが原因で被メツキ物
表面が多硬質状になりざらつき、析出ニッケルのクラッ
クの原因となる。However, all of these conventional auxiliary anodes have a high anode potential, poor conductivity, and poor anode current efficiency. In addition, in particular,
When pure nickel is used, undissolved nickel particles are generated and dispersed in the plating solution, which causes the surface of the plated object to become hard and rough, causing cracks in the precipitated nickel.

ニッケルに０．０１〜０．１％の微量の硫黄又は燐を含
んだ材料を利用する場合は、純ニッケルを利用する場合
より陽極電位は低くなるが、不溶解ニッケル粒がメッキ
液中へ分散、含有し、硫黄又は燐がメッキ液中に不純物
となり混入し析出ニッケルの脆化、硬度の高化、電着応
力の増大をきたす。チタンはチタン表面に白金メッキを
施した補助陽極は、不熔解で極端に電極表面での抵抗が
高く、陽極での酸化応力、その他の副反応が起り、スル
ファミン酸ニッケル液や硫酸ニッケル液ではスルファミ
ン酸塩や硫酸塩の分解がおこり、析出ニッケルは上述の
場合同様に脆化する。また、主目的である補助陽極とし
ての効果は、極めて低いものである。その他に、鋼管の
内面等に、ニッケルメッキを施す場合、鋼管内に、ニッ
ケル陽極、又は上述の燐添加ニッケル、チタン、被チタ
ン等を挿入して行うが、管内面メッキの際は陽極の大き
さに制約を受けるため電流密度の向上が図れずメッキ作
業に時間を要した。When using a material containing 0.01 to 0.1% of sulfur or phosphorus in nickel, the anode potential will be lower than when using pure nickel, but undissolved nickel particles will be dispersed into the plating solution. , and sulfur or phosphorus becomes an impurity in the plating solution, causing embrittlement of the deposited nickel, increased hardness, and increased electrodeposition stress. Titanium is an auxiliary anode with platinum plating on the titanium surface, which is unmeltable and has extremely high resistance on the electrode surface, causing oxidation stress and other side reactions at the anode. Decomposition of acid salts and sulfates occurs, and the precipitated nickel becomes brittle as in the case described above. Furthermore, its effectiveness as an auxiliary anode, which is its main purpose, is extremely low. In addition, when applying nickel plating to the inner surface of a steel pipe, it is done by inserting a nickel anode or the above-mentioned phosphorous-added nickel, titanium, titanium, etc. into the steel pipe, but when plating the inner surface of the pipe, the size of the anode is Due to the limitations of current density, it was not possible to improve the current density, and the plating process took time.

（発明が解決しようとする問題点） 本発明は上述の欠点に着目し、管状物、断面Ｃの字状物
についても一様に、また、平滑にかつ電流効率よく被メ
ッキ物にニッケル被覆を行いうるニッケルメッキ法を提
供する事を目的とする。(Problems to be Solved by the Invention) The present invention focuses on the above-mentioned drawbacks, and applies nickel coating to the objects to be plated uniformly and smoothly and with current efficiency, even for tubular objects and objects having a C-shaped cross section. The purpose is to provide a nickel plating method that can be used.

（問題を解決するための手段） そこで、上述の目的を達成するために本発明者は鋭意研
究を重ね、その結果、スルファミン酸ニッケルメッキ、
硫酸ニッケル塩メッキ、ワット液によるニッケルメッキ
等による電気 ニッケルメッキ法においてコバルトを補助陽極として使
用した場合、メッキ槽内でのコバルト補助陽極の熔解性
がきわめてよく、つまり陽極電流効率が高く、被メッキ
物の低電流密度部位への電流密度の向上効果が大きく、
かつスラッジの発生も少なくメッキ仕上げ面を平滑また
は光沢を均一に仕上げる事ができ、析出ニッケルの脆化
も無く良好なニッケルメッキを施す事ができる旨を知見
するに至った。また、特殊な使用方法としてコバルトを
補助陽極としてではなく主たる陽極として使用しても上
述同様良好なニッケルメッキを施す事ができる旨をも知
見した。これは、ニッケルとコバルトの標準酸化還元電
位が ニッケル　Ｎｉ”　＋　２ｅ−＝　Ｎｉ　　Ｅｏ＝　−
０，２５０コバルト　Ｇｏ”　＋　２ｅ−＝　Ｃｏ　　
Ｅｏ＝　−０，２７７であり、コバルトの方がニッケル
よりもイオン化し易いからメッキ槽内で溶解がよく、ま
たコバルトの溶解量は主力であるニッケルアノードの溶
解量と比較すれば微量であり、その微量のコバルトが被
メッキ物のメッキ槽内で合金となって含まれ高硬度ニッ
ケルメッキとなるからであると考えられる。(Means for Solving the Problem) Therefore, in order to achieve the above-mentioned object, the present inventor conducted extensive research, and as a result, nickel sulfamate plating,
When cobalt is used as an auxiliary anode in electrolytic nickel plating methods such as nickel sulfate salt plating and Watt's solution nickel plating, the solubility of the cobalt auxiliary anode in the plating bath is extremely good, meaning that the anode current efficiency is high and The effect of improving current density to low current density parts of objects is large,
It has also been found that the plated surface can be finished with a smooth or uniform gloss with less sludge generation, and that good nickel plating can be performed without causing embrittlement of the precipitated nickel. It has also been found that as a special method of use, cobalt can be used as the main anode instead of as an auxiliary anode to provide good nickel plating as described above. This means that the standard redox potential of nickel and cobalt is nickel Ni” + 2e−= Ni Eo= −
0,250 cobalt Go” + 2e−= Co
Eo = -0,277, cobalt is easier to ionize than nickel, so it dissolves better in the plating bath, and the amount of cobalt dissolved is minute compared to that of the mainstay nickel anode. It is thought that this is because the small amount of cobalt is contained in the form of an alloy in the plating bath of the object to be plated, resulting in high hardness nickel plating.

またコバルト自体は加工性が悪い欠点があり、被メツキ
物形状が複雑である場合には被メッキ物に近接させるべ
く被メッキ物に合致させて加工する事は困難であるが比
較的加工性が良好であり、かつメッキ液等に悪影響の無
い、ニッケル、チタン、鉄、その他の金属塊を予め被メ
ッキ物に合致させて加工し、該金属塊の表面にコバルト
を厚くメッキして該金属塊を補助陽極として使用する事
により上述の欠点は解消される。　即ち、本発明は１つ
は予め被メッキ物の低電流密度部位に近接可能に成形し
た金属塊表面にコバルトメッキを施し、該コバルトメッ
キ金属塊が被メッキ物の低電流密度部位に近接した状態
にコバルトメッキ金属塊および被メッキ物をニッケル電
解液を満たしたニッケルメッキ槽中に浸漬し、またニッ
ケル電極も同様にニッケルメッキ槽内に浸漬して直流電
源の陽極にニッケル電極とコバル！・メッキ金属塊を、
陰極に被メッキ物を接続し通電して行う事を特徴とする
ニッケルメッキ法であり、今１つは、予め被メッキ物の
メッキ希望部位に近接可能に成形した金属塊表面にコバ
ルトメッキを施し、該コバルトメッキ金属塊と被メッキ
物をニッケル電解液を満たしたニッケルメッキ槽内に両
者を近接して浸漬し、直流電源の陽極にコバルトメッキ
金属塊、陰極に被メッキ物を接続し通電して行う事を特
徴とするニッケルメッキ法である。In addition, cobalt itself has the disadvantage of poor workability, and if the shape of the object to be plated is complex, it is difficult to process it so that it matches the object to be plated, but it is relatively easy to work with. A lump of nickel, titanium, iron, or other metal that is of good quality and does not have a negative effect on the plating solution, etc. is processed in advance to match the object to be plated, and the surface of the metal lump is plated with a thick layer of cobalt. By using the auxiliary anode as an auxiliary anode, the above-mentioned drawbacks are overcome. That is, one aspect of the present invention is to apply cobalt plating to the surface of a metal lump that has been formed in advance so as to be able to approach a low current density part of the object to be plated, and to apply cobalt plating to the surface of the metal lump that has been formed in advance so as to be close to the low current density part of the object to be plated. The cobalt-plated metal block and the object to be plated are immersed in a nickel plating bath filled with nickel electrolyte, and the nickel electrode is similarly immersed in the nickel plating bath.・Plated metal block,
The nickel plating method is characterized by connecting the object to be plated to the cathode and applying electricity.Another method is to apply cobalt plating to the surface of a metal block that has been formed in advance so that it can be approached to the desired part of the object to be plated. The cobalt-plated metal lump and the object to be plated are immersed in close proximity to each other in a nickel plating tank filled with a nickel electrolyte, and the cobalt-plated metal lump and the object to be plated are connected to the anode and cathode of a DC power source, and electricity is applied. This is a nickel plating method characterized by the fact that it is carried out using

（実施例） 以下更に、本発明の具体的実施例について説明する。(Example) Further, specific examples of the present invention will be described below.

実施例　ｌ 第１図は、本発明の方法を電鋳に応用したものであり、
コバルトニッケル金属塊を補助陽極として使用するもの
である。第１図中１は、表面に導電加工が施された電鋳
母型であり断面が凹型形状である。該母型全表面にわた
ってメッキ被覆を形成させる際、通常補助陽極を使用し
ない場合は電鋳母型の窪んだ部分２がニッケル電極３に
対して影になり電流密度が低くなる。Example 1 Figure 1 shows the application of the method of the present invention to electroforming.
A cobalt-nickel metal ingot is used as an auxiliary anode. Reference numeral 1 in FIG. 1 is an electroforming mother mold whose surface is electrically conductive and has a concave cross section. When a plating coating is formed over the entire surface of the mother mold, usually when an auxiliary anode is not used, the recessed portion 2 of the electroforming mother mold shadows the nickel electrode 3, resulting in a low current density.

図中４は本発明の主たる特徴であるコバルトメッキ金属
塊であり、第２図のように電鋳母型の窪みの低電流密度
部分２に近接可能に予め成形し脱脂、水洗処理したチタ
ン塊５を表１の組成の液６（スルファミン酸コバルト液
）で満たしたコバルトメッキ槽中ヘコバルト電極８と共
に浸漬し、直流電源９の陽極にコバルト電極８を、他方
陰極にチタン塊５を接続し、電流密度０．５〜５Ａ／ｄ
ｄを通電し、チタン塊５の表面に３〜５−簡の厚さのコ
バルトメッキｌＯを施したものである。4 in the figure is a cobalt-plated metal ingot, which is the main feature of the present invention, and as shown in Fig. 2, the titanium ingot has been preformed, degreased, and washed so that it can be brought close to the low current density portion 2 of the depression of the electroforming mold. 5 is immersed together with a hecobalt electrode 8 in a cobalt plating bath filled with a solution 6 (cobalt sulfamate solution) having the composition shown in Table 1, and the cobalt electrode 8 is connected to the anode of a DC power source 9, and the titanium lump 5 is connected to the other cathode. Current density 0.5-5A/d
d is applied, and the surface of the titanium lump 5 is coated with cobalt plating lO to a thickness of 3 to 5 mm.

表　　１　　スルファミン酸コバルト浴組成上述の電鋳
母型１およびニッケル電極３を表２の組成のニッケルメ
ッキ液１１（スレファミン酸ニッケル？＆）で満たした
ニッケルメッキ槽１２中に浸漬し、さらに先述のコバル
トメッキ金属塊４を電鋳母型１の窪みの電流密度部分２
に５〜２０ｎ＋耐こ近接して固定し、直流型＃１３の陽
極を銅板の表面に絶縁加工を施した給電体１５を介して
コバルトメッキ金属塊４に接続し、電源１４の陽極はニ
ッケル電極３に接続する。Table 1 Cobalt sulfamate bath composition The above-mentioned electroforming mother mold 1 and nickel electrode 3 were immersed in a nickel plating bath 12 filled with a nickel plating solution 11 (nickel sulfamate?&) having the composition shown in Table 2. Cobalt plated metal lump 4 is electroformed into a current density portion 2 of the depression of the mother mold 1.
The anode of the DC type #13 is connected to the cobalt-plated metal block 4 via the power supply 15, which has an insulated surface on the surface of the copper plate, and the anode of the power source 14 is connected to the nickel electrode. Connect to 3.

また、両型源の陰極は電鋳母型１に給電体１６を用いて
接続する。そして、それぞれ１〜６Ａ／ｄｎ（の電流密
度で通電し、ニッケルを適度に析出させることにより析
出ニッケルの脆化なく＠鋳母型１の窪みの低電流密度部
分についても一様かつ十分な厚さのニッケル被覆を得る
ことができる。Further, the cathodes of both mold sources are connected to the electroforming mother mold 1 using a power supply body 16. Then, by applying current at a current density of 1 to 6 A/dn (1 to 6 A/dn) to properly precipitate nickel, the deposited nickel is not embrittled and even the low current density part of the depression of mold 1 has a uniform and sufficient thickness. A large nickel coating can be obtained.

なお、メッキ作業中メッキ液１１をかるく攪拌すればよ
りよい結果が得られる。Incidentally, better results can be obtained if the plating solution 11 is slightly stirred during the plating operation.

実施例　２ 本発明は、コバルトメッキを施した金属塊をニッケルメ
ッキ法の陽極として使用するものであり実施例のように
ニッケル陽極を主陽橿として、本発明の金属塊を補助陽
極として使用する事が好ましいが、特殊な場合には以下
の実施例のように本発明のコバルトメッキを施した金属
塊を主陽極とする事も可能である。Example 2 The present invention uses a cobalt-plated metal lump as an anode for nickel plating, and as in the example, the nickel anode is used as the main anode, and the metal lump of the invention is used as an auxiliary anode. However, in special cases, it is also possible to use the cobalt-plated metal block of the present invention as the main anode, as shown in the following embodiments.

本発明を鋼管の内面にメッキを施す場合の応用例を以下
に示す、第３図は本発明に係るニッケルメッキ法を鋼管
の内面にニッケルメッキを施す際に応用したものである
。図中１５は内径φ５０〜φ５００の鋼管である。１６
は鋼管１５の内径の１／８〜３／４の外径を有するチタ
ン丸棒１７を実施例１の第２図に示す方法により表面に
コバルトメッキ槽１８を被着したコバルトメッキ金属塊
である。そして第３図のように、コバルトメッキ金属塊
１６を鋼管の中心に位置するように、表２の組成のメッ
キ液１９を満たしたメッキ棒２０中に浸漬し、直流電源
２１の陽極をコバルトメッキ金属塊に接続し、直流電源
の陰極を鋼管Ｉ５に接続し、電流密度１〜６　Ａ／ｄ　
ｏｆの電流密度で通電する事により鋼管１５の内面にニ
ッケルメッキを良好に析出させる事ができる。An example of applying the present invention to the inner surface of a steel pipe is shown below. FIG. 3 shows an application of the nickel plating method according to the present invention to the case of applying nickel plating to the inner surface of a steel pipe. In the figure, 15 is a steel pipe with an inner diameter of φ50 to φ500. 16
is a cobalt-plated metal lump in which a titanium round bar 17 having an outer diameter of 1/8 to 3/4 of the inner diameter of the steel pipe 15 is coated with a cobalt plating tank 18 on the surface by the method shown in FIG. 2 of Example 1. . Then, as shown in FIG. 3, the cobalt-plated metal lump 16 is immersed in the plating rod 20 filled with the plating solution 19 having the composition shown in Table 2 so as to be located at the center of the steel pipe, and the anode of the DC power supply 21 is plated with cobalt. Connect to the metal block, connect the cathode of the DC power source to the steel pipe I5, and apply a current density of 1 to 6 A/d.
By applying current at a current density of nickel plating can be satisfactorily deposited on the inner surface of the steel pipe 15.

（効果） 本発明は、ニッケルメッキ用の補助陽極としてコバルト
を使用する事により、従来の陽極に比べて陽極電流効率
が高く、被メッキ物の低電流部位の電流密度を向上させ
る効果が大きく、かつスラッジの発生も少なくメッキ仕
上げ面を平滑または光沢を均一に仕上げる事ができ、析
出ニッケルの脆化もなくニッケルメッキを施す事ができ
る効果があり、また被メッキ物の低電流部位の形状にあ
わせて比較的加工性のよい全屈を選定し、予め加工して
該加工物にコバルトメッキを施してそれを補助陽極とし
て使用する事により、コバルトの加工性の悪いと言う、
補助陽極として使用するにあたっての重大な欠点を回避
して簡単に作業を行う事ができる効果があり、断面Ｃの
字形状物の内側の影の部分の通常のニッケルメッキ方法
では電流密度が低く、メッキの付きが悪い部分や管状物
の内部についても他の部分と同様に良好なニッケルメッ
キを施す事ができる効果がある。(Effects) By using cobalt as an auxiliary anode for nickel plating, the present invention has a higher anode current efficiency than conventional anodes, and has a large effect of improving current density in low current areas of the object to be plated. It also produces less sludge and allows the plated surface to be smooth or uniformly glossy. It also has the effect of allowing nickel plating to be applied without causing embrittlement of the precipitated nickel, and also improves the shape of low-current parts of the object to be plated. In addition, by selecting a total bending material with relatively good workability, pre-processing the workpiece, applying cobalt plating to the workpiece, and using it as an auxiliary anode, it is possible to eliminate the poor workability of cobalt.
It has the effect of avoiding the serious drawbacks of using it as an auxiliary anode and making the work easier, and the current density is low when using the usual nickel plating method on the inner shaded part of the C-shaped cross section. This has the effect of allowing good nickel plating to be applied to areas with poor plating and the inside of tubular objects as well as other areas.

また、コバルトメッキを被着した金属塊を主陽極として
使用する事により、被メッキ物の被メツキ面積に対して
十分な表面積を持つ陽極を挿入不可能な場所についても
、十分かつ短時間でメッキ作業を行う事ができる。In addition, by using a metal block coated with cobalt plating as the main anode, it is possible to sufficiently and quickly plate areas where it is impossible to insert an anode with a sufficient surface area for the area to be plated. Can do the work.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明のニッケルメッキ法を電鋳に応用した
場合の説明図であり、第２図は予め成形した金属塊にコ
バルトメッキを施す際の説明図であり、第３図は本考案
のニッケルメッキ法を鋼管の内面のメッキに応用したも
のである。 （１）−−−−・−・−−−−−−−−−−−・−−−
ｍ−電鋳母型（被メッキ物）（２）−−−−−・・−・
・−−−−・−・・−低電流部位（３）−−一−・−−
−−−一−−−−−−・・・・−・ニッケル電極（４）
　　（１６）　−−−−〜−・＝−コバルトメッキ金属
塊（１１）　　（１９）　　−・−−−−−−・−・電
解液（１２）　　（２０）・−−一−・・−・−−−−
ニッケルメッキ槽（１３）　　（１４）　　（２１）　
−−−一直流電源（１５）−−−−−−−−−−−−・
−−ｍ−・−一一一一鋼管（被メッキ物）特許出願人　
　三ツ星ベルト株式会社 手続補正書（方式） 昭和６１年３月　３日 １、事件の表示 昭和６０年特許願第２７７６４１号 ２、発明の名称 ニッケルメッキ法 ３、補正をする者 事件との関係　特許出願人 住所　神戸市長田区浜添通４丁目１番２１号昭和６１年
２月２５日 ５、補正の対象 ７、添付書類の目録Fig. 1 is an explanatory diagram when the nickel plating method of the present invention is applied to electroforming, Fig. 2 is an explanatory diagram when applying cobalt plating to a preformed metal lump, and Fig. 3 is an explanatory diagram when applying the nickel plating method of the present invention to electroforming. This is an application of the invented nickel plating method to plating the inner surface of steel pipes. (1)-----・-------------
m-Electroforming mother mold (object to be plated) (2)
・−−−−・−・・−Low current part (3)−−1−・−−
−−−−−−−−−・・・・−・Nickel electrode (4)
(16) −−−−～−・=−Cobalt plated metal lump (11) (19) −・−−−−−−・−・Electrolyte (12) (20)・−−1−・・−・------
Nickel plating tank (13) (14) (21)
---1 DC power supply (15)-----
−−m−・−1111 Steel pipe (material to be plated) Patent applicant
Mitsuboshi Belting Co., Ltd. procedural amendment (method) March 3, 1985 1, Indication of the case 1985 Patent Application No. 277641 2, Name of the invention Nickel plating method 3, Person making the amendment Relationship with the case Patent application Address: 4-1-21 Hamazoe-dori, Nagata-ku, Kobe February 25, 1986 5, Subject of amendment 7, List of attached documents

Claims (1)

【特許請求の範囲】 １、予め、被メッキ物の低電流密度部位に、近接可能に
成形した金属塊表面に、コバルトメッキを施し、該コバ
ルトメッキ金属塊が被メッキ物の低電流密度部位に近接
した状態にコバルトメッキ金属塊および、被メッキ物を
ニッケル電解液を満たしたニッケルメッキ槽中に浸漬し
、またニッケル電極も同様にニッケルメッキ槽内に浸漬
して直流電源の陽極にニッケル電極とコバルトメッキ金
属塊を、陰極に被メッキ物を接続し、通電して行う事を
特徴とするニッケルメッキ法。 ２、予め、被メッキ物のメッキ希望部位に、近接可能に
、成形した金属塊表面に、コバルトメッキを施し、該コ
バルトメッキ金属塊と被メッキ物をニッケル電解液を満
たしたニッケルメッキ槽内に両者を近接して浸漬し、直
流電源の陽極にコバルトメッキ金属塊、陰極に被メッキ
物を接続し、通電して行う事を特徴とするニッケルメッ
キ法。[Claims] 1. Cobalt plating is applied to the surface of a metal lump formed in advance so that it can be approached to a low current density area of the object to be plated, and the cobalt-plated metal lump is applied to the low current density area of the object to be plated. The cobalt-plated metal lump and the object to be plated are immersed in a nickel plating bath filled with nickel electrolyte in close proximity, and the nickel electrode is similarly immersed in the nickel plating bath, and the nickel electrode is connected to the anode of a DC power source. A nickel plating method that involves connecting a cobalt-plated metal block to the cathode of the object to be plated and applying electricity. 2. Cobalt plating is applied to the surface of the formed metal lump in advance so that it can be approached to the desired part of the object to be plated, and the cobalt-plated metal lump and the object to be plated are placed in a nickel plating bath filled with nickel electrolyte. A nickel plating method characterized by immersing both in close proximity, connecting the cobalt-plated metal mass to the anode of a DC power supply, and the object to be plated to the cathode, and applying electricity.