JPS62134233U - - Google Patents
Info
- Publication number
- JPS62134233U JPS62134233U JP2098286U JP2098286U JPS62134233U JP S62134233 U JPS62134233 U JP S62134233U JP 2098286 U JP2098286 U JP 2098286U JP 2098286 U JP2098286 U JP 2098286U JP S62134233 U JPS62134233 U JP S62134233U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- boat
- support groove
- heat treatment
- inclination angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
Description
第１図は、本考案の一実施例である熱処理用ボ
ートの支持溝の縦断面図。第２図は、第１図に示
した本考案の支持溝に鏡面ウエーハを挿入した状
態を示す図。第３図は、鏡面ウエーハの面取りを
示す図。第４図は従来の熱処理用ボートにウエー
ハを挿入した状態を示す正面図。第５図、第６図
、第７図および第８図は、第４図に示した熱処理
用ボートの支持溝中にウエーハを挿入した各状態
を示す側面断面図。
FIG. 1 is a longitudinal sectional view of a support groove of a boat for heat treatment, which is an embodiment of the present invention. FIG. 2 is a diagram showing a mirror wafer inserted into the support groove of the present invention shown in FIG. 1; FIG. 3 is a diagram showing chamfering of a mirror wafer. FIG. 4 is a front view showing a state in which wafers are inserted into a conventional heat treatment boat. 5, 6, 7, and 8 are side sectional views showing each state in which the wafer is inserted into the support groove of the heat treatment boat shown in FIG. 4.
Claims (1)
のウエーハ支持溝の傾斜角βが、該ウエーハの面
取り角θより大なる角度とし、該支持溝の傾角γ
を該ウエーハの面取り角θと同じか小さい角度と
し、該支持溝底に該ウエーハの先端面の幅よりや
や大きな幅の底面ｆを設けたことを特徴とするウ
エーハ熱処理用ボート。 ２ 該支持溝の傾斜角βを２０°以上とし、傾角
γを２０°以下としたことを特徴とする実用新案
登録請求の範囲第１項記載のウエーハ熱処理用ボ
ート。[Claims for Utility Model Registration] 1. In a boat for wafer heat treatment, the inclination angle β of the wafer support groove of the boat is greater than the chamfer angle θ of the wafer, and the inclination angle γ of the support groove is greater than the chamfer angle θ of the wafer.
A boat for wafer heat treatment, characterized in that the chamfer angle θ is the same as or smaller than the chamfer angle θ of the wafer, and the support groove bottom is provided with a bottom face f having a width slightly larger than the width of the tip end face of the wafer. 2. The boat for wafer heat treatment according to claim 1, wherein the support groove has an inclination angle β of 20° or more and an inclination angle γ of 20° or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2098286U JPS62134233U (en) | 1986-02-18 | 1986-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2098286U JPS62134233U (en) | 1986-02-18 | 1986-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134233U true JPS62134233U (en) | 1987-08-24 |
Family
ID=30817000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2098286U Pending JPS62134233U (en) | 1986-02-18 | 1986-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134233U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141221A (en) * | 2008-12-15 | 2010-06-24 | Shin-Etsu Chemical Co Ltd | Method of manufacturing silicon substrate with oxide film |
-
1986
- 1986-02-18 JP JP2098286U patent/JPS62134233U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141221A (en) * | 2008-12-15 | 2010-06-24 | Shin-Etsu Chemical Co Ltd | Method of manufacturing silicon substrate with oxide film |