JPS62131584A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS62131584A JPS62131584A JP27146585A JP27146585A JPS62131584A JP S62131584 A JPS62131584 A JP S62131584A JP 27146585 A JP27146585 A JP 27146585A JP 27146585 A JP27146585 A JP 27146585A JP S62131584 A JPS62131584 A JP S62131584A
- Authority
- JP
- Japan
- Prior art keywords
- resist
- substrate
- dielectric film
- etching
- shortened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、微細な電極を有する半導体装置の製造方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method of manufacturing a semiconductor device having fine electrodes.
GaAsを中心とする化合物半導体電界効果型トランジ
スタにおけるデバイス性能は、(1)、ゲート長の短縮
(2)、ゲート・ソース間距離の短縮(3)、リセス構
造の採用などにより、著しく向上することが知られてい
る。The device performance of compound semiconductor field-effect transistors, mainly made of GaAs, can be significantly improved by (1) shortening the gate length (2), shortening the gate-source distance (3), and adopting a recessed structure. It has been known.
上記(1)及び(2)の要求を満たすために、微細加工
性、位置合せ精度に優れた電子線リソグラフィが極めて
有用である。しかし、未だ、十分な特性をもつレジスト
が開発されておらず、実際のデバイスの加工には多層レ
ジスト法を用いるなど工夫されている。In order to satisfy the above requirements (1) and (2), electron beam lithography, which has excellent microfabrication performance and alignment accuracy, is extremely useful. However, a resist with sufficient properties has not yet been developed, and efforts are being made to actually process devices, such as using a multilayer resist method.
この他、現状のリングラフィ技術で、微細な電極を形成
するために、例えば、第1図に示す如く昭和56年度電
子通イd学会、半導体・材料部門全国大会予橋集p4で
、今井他が述べているペデスタル(pedestal)
14を利用して、実効的なゲート長を短くする等の試
みがある。しかし、斜めからの蒸着を2回行った上イオ
ンミリングを行う等工程が複雑であり、寸法制御性1面
内均一性に乏しいという問題がある。また、電極11形
状から分かるように基板とゲート間の電気容量が大きく
なるといった特性上の問題も残る。In addition, in order to form fine electrodes using the current phosphorography technology, for example, as shown in Figure 1, at the 1981 Electronic Communication and Id Society, Semiconductor and Materials Division National Conference, Yohashi Collection p4, Imai et al. The pedestal mentioned by
There are attempts to shorten the effective gate length by using 14. However, the process is complicated, such as performing oblique vapor deposition twice and then ion milling, and there is a problem that dimensional control and in-plane uniformity are poor. Further, as can be seen from the shape of the electrode 11, there remains a problem in characteristics such as increased capacitance between the substrate and the gate.
本発明の目的は、前述のような複雑な工程を含まず、し
かし単層レジストで、簡便に、微細な電極パターンを形
成する半導体装置の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor device that does not involve the above-mentioned complicated steps, but easily forms a fine electrode pattern using a single-layer resist.
本発明の骨子は、段差構造の基板に、誘電体膜を被覆し
段差部を含む領域を選択的に異方性エツチングによりエ
ツチングする事である。The gist of the present invention is to cover a substrate with a step structure with a dielectric film and selectively etch the region including the step portions by anisotropic etching.
段差部に被覆した誘電体膜は、平坦部に被覆したものよ
り、垂直方向にノqくなる。従って異方性エツチングを
用いると平坦部の誘電体膜が早くエツチングされ、微細
な溝の形成が可能となる。なお、基板上に形成された四
部形成は通常リセス形状と呼ばれる。The dielectric film coated on the stepped portion is vertically wider than that coated on the flat portion. Therefore, when anisotropic etching is used, the dielectric film in the flat portion can be etched quickly, making it possible to form fine grooves. Note that the four-part formation formed on the substrate is usually called a recess shape.
思上、本発明の詳細な説明する。 The present invention will now be described in detail.
〔実施例、1〕
本発明を、化合物半導体電界効果型トランジスタのゲー
ト電極形成に適用した例を第2図を用いて示す。[Example 1] An example in which the present invention is applied to the formation of a gate electrode of a compound semiconductor field effect transistor will be shown with reference to FIG.
■GaAs結晶基板1に、リセスエッチを施す。(2) Perform recess etching on the GaAs crystal substrate 1.
〔図(a)〕半導体結晶基板1として、InGaAs
、 InPなどを用いる事もできる。[Figure (a)] InGaAs is used as the semiconductor crystal substrate 1.
, InP, etc. can also be used.
■化学気相堆積法により誘電体膜5iO22を被覆する
。〔図(b)〕 尚、誘電体膜2として、5iaNa
、 S OGなどを用いる事も可能である。(2) Cover the dielectric film 5iO22 by chemical vapor deposition. [Figure (b)] Note that as the dielectric film 2, 5iaNa
, SOG, etc. can also be used.
■耐ドライエツチング性を有するノボラック系の電子線
ポジ型レジストRE 5000P(日立化成商品名)3
を該基板上塗布する。電子線リングラフィ技術を用いて
誘電体膜2の段差部を含んだ領域上のレジストに開孔部
を設ける。〔図(C)〕ここで、パターン用レジスト3
にはR8200ON(日立化成商品名)等の耐ドライエ
ツチング性ネガ型レジストを用いることも可能である。■Novolac-based electron beam positive resist with dry etching resistance RE 5000P (Hitachi Chemical product name) 3
is applied onto the substrate. Openings are provided in the resist on the region of the dielectric film 2 including the step portion using electron beam phosphorography. [Figure (C)] Here, pattern resist 3
It is also possible to use a dry etching resistant negative type resist such as R8200ON (trade name, Hitachi Chemical).
■前記レジストパターンをマスクに、誘電体M膜5iO
z 2を、CHF sガスを用いて、反応性イオンエツ
チング(Reactive Ion 1EtchinH
)する。〔図(d)〕エツチングガスとしては、CF4
等も使用できる。■ Using the resist pattern as a mask, dielectric M film 5iO
z 2 was subjected to reactive ion etching (Reactive Ion 1EtchinH) using CHF s gas.
)do. [Figure (d)] CF4 is used as the etching gas.
etc. can also be used.
■金属電極4をリフトオフ法により形成する。(2) Metal electrode 4 is formed by lift-off method.
〔図(e)〕ここではアルミニアムを用いたが、WSi
等を用いることも可能である。[Figure (e)] Aluminum was used here, but WSi
It is also possible to use the following.
このプロセスを用いて製造した電界効果型トランジスタ
は第3図に示すように、リセス構造を有しゲート長が短
くでき(1/4μm以下)、シかもソース・ドレイン間
距離も短縮できる。As shown in FIG. 3, the field effect transistor manufactured using this process has a recessed structure and can have a short gate length (1/4 .mu.m or less), as well as a short source-drain distance.
〔実施例、2〕 実施例1において、■のマスクパターン形成を。[Example, 2] In Example 1, form the mask pattern (2).
光(X線も含む)リングラフィ技術を用いて行う。It is performed using optical (including X-ray) phosphorography technology.
〔実施例、3〕
実施例1において、■の全1g電極形成を、全面に金属
を被覆した後、レジストのパターニング及び金属のエツ
チングにより形成する。[Example 3] In Example 1, the entire 1 g electrode (2) was formed by coating the entire surface with metal, and then patterning the resist and etching the metal.
〔実施例、4〕
実施例1において■のマスクパターン形成に、多層レジ
スト法を用いる。[Example 4] In Example 1, a multilayer resist method is used to form the mask pattern (2).
本発明によれば、現状のりソグラフイ技術を用いて、し
かも簡単なプロセスで実効長1/4μm以下の電極17
が形成できた。According to the present invention, the electrode 17 with an effective length of 1/4 μm or less can be produced using the current laminating technology and in a simple process.
was formed.
また、電界効果型トランジスタにおいて短縮が望まれる
ソース・ゲート間距離Qsz16が、被覆した誘電体膜
厚で精度よく短縮・制御できた。In addition, the source-to-gate distance Qsz16, which is desired to be shortened in a field-effect transistor, could be shortened and controlled accurately by changing the thickness of the dielectric film coated.
第1図は従来技術による半導体装置の要御断面図、第2
図は、本発明の一実施例を示すプロセス説明のための断
面図、第3図は、本発明の一実施例により構成された半
導体装置の断面図である。
1・・・半導体基板、2・・・誘電体膜(S1021
S OG +5iaNaなど)、3・・・耐ドライエツ
チ性の良いレジスト(NPR,MR8,等或いは多層レ
ジスト)4・・・電極用金属、5・・・半導体基板、6
・・・能動層(例えば、・n型GaAs層)7・・・誘
電体膜(SiOz、 S OG r 5iaN4など)
、8・・・ゲート電極、9・・・ドレイン電極、10・
・・ソース電極、11・・・ゲート電極、12・・・ソ
ース電極、13・・・ドレイン電極、14・・・5iO
115・・・半導体基板、16・・・ゲート・ソース間
距離Qs□、17・・・実効的ゲート長Qg。
第 1 目
第32Figure 1 is a cross-sectional view of a semiconductor device according to the prior art;
The figure is a cross-sectional view for explaining a process of an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a semiconductor device constructed according to an embodiment of the present invention. 1... Semiconductor substrate, 2... Dielectric film (S1021
SOG +5iaNa, etc.), 3... Resist with good dry etch resistance (NPR, MR8, etc. or multilayer resist) 4... Metal for electrode, 5... Semiconductor substrate, 6
... Active layer (for example, n-type GaAs layer) 7 ... Dielectric film (SiOz, SOG r 5iaN4, etc.)
, 8... gate electrode, 9... drain electrode, 10.
... Source electrode, 11... Gate electrode, 12... Source electrode, 13... Drain electrode, 14... 5iO
115... Semiconductor substrate, 16... Gate-source distance Qs□, 17... Effective gate length Qg. 1st item 32nd
Claims (1)
板を誘電体薄膜で被覆する工程と、前記凹部形状のエッ
ジ部分に被覆した誘電体薄膜の、段差部分の一部を開孔
部に含むようにレジストパターンを形成する工程と、該
レジストパターンをマスクに非等方的に該誘電体薄膜を
エッチングし、微細な溝を形成する工程と、該溝状部分
に金属を堆積する工程とを含むことを特徴とする半導体
装置の製造方法。forming a concave shape in a semiconductor substrate; coating the semiconductor substrate with a dielectric thin film; and including a part of the stepped portion of the dielectric thin film coated on the edge portion of the concave shape in the opening. A step of forming a resist pattern as shown in FIG. A method of manufacturing a semiconductor device, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27146585A JPS62131584A (en) | 1985-12-04 | 1985-12-04 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27146585A JPS62131584A (en) | 1985-12-04 | 1985-12-04 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62131584A true JPS62131584A (en) | 1987-06-13 |
Family
ID=17500412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27146585A Pending JPS62131584A (en) | 1985-12-04 | 1985-12-04 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62131584A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855763A (en) * | 1987-05-25 | 1989-08-08 | Canon Kabushiki Kaisha | Image recording apparatus |
-
1985
- 1985-12-04 JP JP27146585A patent/JPS62131584A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4855763A (en) * | 1987-05-25 | 1989-08-08 | Canon Kabushiki Kaisha | Image recording apparatus |
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