JPS62128667U - - Google Patents
Info
- Publication number
- JPS62128667U JPS62128667U JP1455086U JP1455086U JPS62128667U JP S62128667 U JPS62128667 U JP S62128667U JP 1455086 U JP1455086 U JP 1455086U JP 1455086 U JP1455086 U JP 1455086U JP S62128667 U JPS62128667 U JP S62128667U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- terminal
- wiring pattern
- soldering
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例によるフラツトパツ
ケージＩＣを実装したプリント板の平面図とＡ―
Ａ′断面図、第２図は従来例による同上平面図と
Ａ―Ａ′断面図である。
１：フラツトパツケージ、１Ｃ，２：ＩＣの半
田付用ランド、３：ＩＣの端子、４，４′：配線
パターン、５：ＩＣの不使用端子下のシルク印刷
、６：プリント板。
FIG. 1 is a plan view of a printed board on which a flat package IC according to an embodiment of the present invention is mounted, and A-
FIG. 2 is a plan view of the conventional example and a sectional view taken along line A-A'. 1: Flat package, 1C, 2: Land for IC soldering, 3: IC terminal, 4, 4': Wiring pattern, 5: Silk printing under unused terminal of IC, 6: Printed board.
Claims (1)
線パターンに面実装形ＩＣの端子を半田付けして
実装するプリント板において、前記ＩＣの不使用
端子と、この端子下に設けた配線パターンとの間
に絶縁被膜を形成したことを特徴とするプリント
板。 In a printed board in which a terminal of a surface mount IC is mounted by soldering to a wiring pattern on a printed board without using a lead insertion hole, an unused terminal of the IC and a wiring pattern provided below this terminal. A printed board characterized by having an insulating film formed in between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1455086U JPS62128667U (en) | 1986-02-05 | 1986-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1455086U JPS62128667U (en) | 1986-02-05 | 1986-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62128667U true JPS62128667U (en) | 1987-08-14 |
Family
ID=30804637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1455086U Pending JPS62128667U (en) | 1986-02-05 | 1986-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357960U (en) * | 1989-10-11 | 1991-06-05 |
-
1986
- 1986-02-05 JP JP1455086U patent/JPS62128667U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357960U (en) * | 1989-10-11 | 1991-06-05 |
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