JPS62126836U - - Google Patents

Info

Publication number
JPS62126836U
JPS62126836U JP1179986U JP1179986U JPS62126836U JP S62126836 U JPS62126836 U JP S62126836U JP 1179986 U JP1179986 U JP 1179986U JP 1179986 U JP1179986 U JP 1179986U JP S62126836 U JPS62126836 U JP S62126836U
Authority
JP
Japan
Prior art keywords
pellet
terminal portion
wiring board
connecting terminal
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1179986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1179986U priority Critical patent/JPS62126836U/ja
Publication of JPS62126836U publication Critical patent/JPS62126836U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図〜第４図はこの考案の一実施例を示した
もので、第１図は配線基板と半導体ペレツトの断
面図、第２図は配線基板のペレツト接続端子部を
凹入させる方法を示すプレス装置と配線基板の断
面図、第３図は異方導電性接着剤により配線基板
に半導体ペレツトを接合した状態の断面図、第４
図は絶縁性接着剤により配線基板に半導体ペレツ
トを接合した状態の断面図である。第５図はこの
考案の他の実施例を示す配線基板と半導体ペレツ
トの断面図である。 Ａ…半導体ペレツト、ａ…端子部、１…配線基
板、１ａ…フイルム基材、２…配線、２ａ…ペレ
ツト接続端子部、２ｂ…凹入部、３…箔接着剤、
４…異方導電性接着剤、４ａ…絶縁性接着剤、４
ｂ…導電性粒子、５…絶縁性接着剤。 Figures 1 to 4 show an embodiment of this invention. Figure 1 is a cross-sectional view of a wiring board and a semiconductor pellet, and Figure 2 shows a method for recessing the pellet connecting terminal portion of a wiring board. Fig. 3 is a cross-sectional view of a semiconductor pellet bonded to a wiring board using an anisotropic conductive adhesive;
The figure is a cross-sectional view of a semiconductor pellet bonded to a wiring board using an insulating adhesive. FIG. 5 is a sectional view of a wiring board and a semiconductor pellet showing another embodiment of this invention. A... Semiconductor pellet, a... Terminal part, 1... Wiring board, 1a... Film base material, 2... Wiring, 2a... Pellet connection terminal part, 2b... Recessed part, 3... Foil adhesive,
4... Anisotropic conductive adhesive, 4a... Insulating adhesive, 4
b... Conductive particles, 5... Insulating adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトの主面外周部に配列されている
端子部と対応するペレツト接続端子部を有し、前
記半導体ペレツトをその端子部を前記ペレツト接
続端子部に対向させて接着接合する配線基板にお
いて、前記ペレツト接続端子部の半導体ペレツト
外側縁部と対応する部分を凹入させ、この凹入部
から先端側のペレツト接続端子部を前記半導体ペ
レツトの端子部に対する接続部としたことを特徴
とする配線基板。 A wiring board having a pellet connecting terminal portion corresponding to the terminal portions arranged on the outer periphery of the main surface of a semiconductor pellet, and adhesively bonding the semiconductor pellet with the terminal portion thereof facing the pellet connecting terminal portion; A wiring board characterized in that a portion of the pellet connecting terminal portion corresponding to the outer edge of the semiconductor pellet is recessed, and the pellet connecting terminal portion on the tip side from the recessed portion is used as a connecting portion to the terminal portion of the semiconductor pellet.
JP1179986U 1986-01-31 1986-01-31 Pending JPS62126836U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1179986U JPS62126836U (en) 1986-01-31 1986-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1179986U JPS62126836U (en) 1986-01-31 1986-01-31

Publications (1)

Publication Number Publication Date
JPS62126836U true JPS62126836U (en) 1987-08-12

Family

ID=30799342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1179986U Pending JPS62126836U (en) 1986-01-31 1986-01-31

Country Status (1)

Country Link
JP (1) JPS62126836U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132120U (en) * 1988-03-01 1989-09-07
JP2001094227A (en) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd Semiconductor chip mounting wiring board and semiconductor chip mounting method using the board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132120U (en) * 1988-03-01 1989-09-07
JP2001094227A (en) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd Semiconductor chip mounting wiring board and semiconductor chip mounting method using the board

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