JPS62124809U

JPS62124809U -

Info

Publication number: JPS62124809U
Application number: JP1986010334U
Authority: JP
Priority date: 1986-01-29
Filing date: 1986-01-29
Publication date: 1987-08-08

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例のセラミツク基板の平面
図、第２図は同セラミツク基板の部分拡大平面図
、第３図ａ〜ｆは本考案セラミツク基板を用いた
チツプ抵抗体の製造工程図、第４図は印刷作業を
説明する斜視図、第５図は印刷作業を説明する断
面図、第６図は従来のセラミツク基板の平面図、
第７図はチツプ抵抗体の断面図、第８図は従来の
セラミツク基板からチツプ抵抗体を得る際のセラ
ミツク分割板を示す斜視図、第９図は従来におけ
る印刷の際のセラミツク基板の位置決めを説明す
る斜視図、第１０図は従来におけるセラミツク基
板の位置決め状態を示す断面図、第１１図は従来
における印刷の際のマスクに対する位置ずれを説
明する断面図である。１……セラミツク基板、１２……位置基準孔、
１３……位置決め孔、１５……表面電極、２３…
…抵抗体。 FIG. 1 is a plan view of a ceramic substrate according to an embodiment of the present invention, FIG. 2 is a partially enlarged plan view of the ceramic substrate, and FIGS. 3 a to 3 f are process diagrams for manufacturing a chip resistor using the ceramic substrate of the present invention. FIG. 4 is a perspective view explaining the printing operation, FIG. 5 is a sectional view explaining the printing operation, and FIG. 6 is a plan view of a conventional ceramic substrate.
FIG. 7 is a cross-sectional view of a chip resistor, FIG. 8 is a perspective view showing a ceramic dividing plate when obtaining a chip resistor from a conventional ceramic substrate, and FIG. 9 is a diagram showing the positioning of a ceramic substrate during conventional printing. FIG. 10 is a perspective view for explaining, FIG. 10 is a cross-sectional view showing the conventional positioning state of a ceramic substrate, and FIG. 11 is a cross-sectional view for explaining the positional deviation with respect to a mask during printing in the conventional method. 1...Ceramic substrate, 12...Position reference hole,
13...Positioning hole, 15...Surface electrode, 23...
...Resistor.

Claims

【実用新案登録請求の範囲】[Scope of utility model registration request]

表面に多数の電極や抵抗体等のパターンを印刷
形成するチツプ電子部品用のセラミツク基板であ
つて、中央に印刷の際の位置基準孔を、この位置
基準孔から離れた位置に位置決め孔をそれぞれ穿
設したセラミツク基板。 A ceramic substrate for chip electronic components on which patterns such as a large number of electrodes and resistors are printed on the surface, with a position reference hole for printing in the center and positioning holes at positions distant from this position reference hole. Perforated ceramic substrate.